Features
- ½ ATR compliant, conduction-cooled system (reduced size)
- Physical dimensions of 4.88 in (W), 5.62 in (H), 8.75 in (L)
- 3U VPX and cPCI backplanes available
- Optional front-panel USB port
- Optional SATA SSD memory module with easy removal and insertion
- Optional Gigabit Ethernet switched backplane
- Configurable standard I/O includes Gigabit Ethernet, USB, and RS-232/RS-422
- Integration services with third-party modules available
Description
The XPand3200 system solutions redefine the limits of power, performance, and functionality in a sub-½ ATR system. This conduction-cooled, fully ruggedized system is designed to meet the rigorous standards of MIL-STD-810F while integrating the latest power-saving and performance-enhancing technology. In today's avionics and ruggedized environments, size really does matter, and the XPand3200 sets a new standard for sub-½ ATR computing.
Depending on your processing requirements, the XPand3200 can be populated with high-performance, low-power 3U X-ES modules such as the XPedite7170 single-board computer based on the Intel® Core™2 Duo processor, the XPedite5370 based on the Freescale dual-core MPC8572E PowerQUICC® III processor, or the XPedite5170 based on the Freescale dual-core MPC8640D processor.
The XPand3200 can then be configured to meet your I/O requirements. An optional 32-GB SATA SSD memory module provides the convenience of removable storage and the ruggedness of solid-state memory. An optional USB port provides system monitoring and maintenance capabilities.
Please contact X-ES sales to begin designing a system that will meet and exceed your I/O, processing, and power requirements.
Technical Specifications
Physical Characteristics
- ½ ATR compliant, conduction-cooled system (reduced size)
- 4.88 in (W), 5.62 in (H), 8.75 in (L)
Backplane Options
- 3U VPX
- 3U cPCI
- Custom backplane solutions available (contact X-ES sales)
Front Panel I/O Options
- USB 2.0 and 1.0 compliant interface
- Three user-defined push buttons
- Removable SATA SSD storage media bay
Back Panel I/O Options
- Up to three D38999 circular connectors
- DVI graphics interfaces
- USB 2.0 and 1.0 compliant interfaces
- 10/100/1000BASE-T Gigabit Ethernet interfaces
- RS-232/RS-422 serial links
- Custom I/O via XMC/PMC modules
Standard Processor Module Options
- XPedite5130: 3U cPCI Freescale MPC8640D
- XPedite5170: 3U VPX Freescale MPC8640D
- XPedite5330: 3U cPCI Freescale MPC8572E
- XPedite5370: 3U VPX Freescale MPC8572E
- XPedite7130: 3U cPCI Intel® Core™2 Duo
- XPedite7170: 3U VPX Intel® Core™2 Duo
- Custom processor module solutions available (contact X-ES sales)
I/O Options
- XChange3011: Gigabit Ethernet switch
- XPort6270: Removable storage
- XPort4100: High-performance graphics
- Integration services available
- Custom I/O solutions available (contact X-ES sales)
Power Supply Options
- MIL-STD-704 28V DC input voltage support (default)
- 110-ms internal hold-up time (default)
- Additional power supply options available (contact X-ES sales)
Environmental Requirements
- -40 to 71 °C (at cold plate, 125W solution)
Example Configuration: XPand3200-32-X-CA2
- Application: Gigabit Ethernet switched SBCs
- Slot 1: XPedite7170 SBC
- Slot 2: XPedite5370 SBC
- Slot 3: XPedite5170 SBC
- Slot 4: Power supply (28 V DC input)
- Slot 5: XChange3011 Gigabit Ethernet switch
- Slot 6: XPort6170 removable storage
Example Configuration: XPand3200-32-X-CA5
- Application: Redundant SBCs
- Slot 1: XPedite7170 SBC
- Slot 2: XPedite7170 SBC
- Slot 3: Empty (I/O expansion)
- Slot 4: Power supply (28 V DC input)
- Slot 5: XPort6170 removable storage
