Features
- ½ ATR compliant, conduction-cooled system (reduced height and length)
- Physical dimensions of 4.88 in (W), 5.62 in (H), 8.75 in (L)
- 3U VPX and cPCI backplanes available
- Optional front-panel USB port
- Optional SATA SSD memory module with easy removal and insertion
- Optional PCI Express fabric backplane
- Optional Gigabit Ethernet switched backplane
- Configurable standard I/O includes Gigabit Ethernet, USB, RS-232/RS-422, MIL-STD-1553, ARINC-429, SATA, DVI, etc.
- Integration services with third-party modules available
Description
The XPand3200 system solutions redefine the limits of power, performance, and functionality in a sub-½ ATR system. This conduction-cooled, fully ruggedized system is designed to meet the rigorous standards of MIL-STD-810 while integrating the latest power-saving and performance-enhancing technology. In today's avionics and ruggedized environments, size really does matter, and the XPand3200 sets a new standard for sub-½ ATR computing.
Depending on your processing requirements, the XPand3200 can be populated with high-performance, low-power 3U X-ES modules such as the XPedite7170 single-board computer based on the Intel® Core™2 Duo processor, the XPedite5370 based on the Freescale dual-core MPC8572E PowerQUICC® III processor, or the XPedite5170 based on the Freescale dual-core MPC8640D processor.
The XPand3200 can then be configured to meet your I/O requirements. An optional 64 GB SATA SSD memory module provides the convenience of removable storage and the ruggedness of solid-state memory. An optional front-panel USB port provides system monitoring and maintenance capabilities.
Please contact X-ES sales to begin designing a system that will meet and exceed your I/O, processing, and power requirements.
Technical Specifications
Physical Characteristics
- ½ ATR compliant, conduction-cooled system (reduced height and length)
- 4.88 in (W), 5.62 in (H), 8.75 in (L)
Backplane Options
- 3U VPX
- 3U cPCI
- Custom backplane solutions available
(contact X-ES sales)
Front Panel I/O Options
- USB 2.0 and 1.0 compliant interface
- Three user-defined push buttons
- Removable SATA SSD storage media bay with high reliability connector
Back Panel I/O Options
- Up to three D38999 circular connectors
- DVI graphics interfaces
- USB 2.0 and 1.0 compliant interfaces
- 10/100/1000BASE-T Gigabit Ethernet interfaces
- RS-232/RS-422 serial links
- MIL-STD-1553
- ARINC-429
- Custom I/O via XMC/PMC modules
Standard Processor Module Options
- XPedite5130: 3U cPCI Freescale MPC8640D
- XPedite5170: 3U VPX Freescale MPC8640D
- XPedite5330: 3U cPCI Freescale MPC8572E
- XPedite5370: 3U VPX Freescale MPC8572E
- XPedite7130: 3U cPCI Intel® Core™2 Duo
- XPedite7170: 3U VPX Intel® Core™2 Duo
- Custom processor module solutions available (contact X-ES sales)
I/O Options
- XChange3011: Gigabit Ethernet switch
- XPort6170: Removable storage and touch panel display
- XPort4100: High-performance graphics
- Integration services available
- Custom I/O solutions available
(contact X-ES sales)
Power Supply Options
- MIL-STD-704 28V DC input voltage support (default)
- MIL-STD-704 115-AC input voltage support (default)
- Up to 110-ms internal hold-up time
- Additional power supply options available (contact X-ES sales)
Environmental Requirements
- -40 to 71 °C (at cold plate, 125W solution)
Example Configuration: XPand3200-32-X-CA2
- Application: Gigabit Ethernet switched SBCs
- Slot 1: XPedite7170 SBC
- Slot 2: XPedite5370 SBC
- Slot 3: XPedite5170 SBC
- Slot 4: XPm2000 (28 V DC input Power Supply)
- Slot 5: XChange3011 Gigabit Ethernet switch
- Slot 6: XPort6170 removable storage
Example Configuration: XPand3200-32-X-CA5
- Application: Redundant SBCs with touch-panel display
- Slot 1: XPedite7170 SBC
- Slot 2: XPedite7170 SBC
- Slot 3: Empty (I/O expansion)
- Slot 4: XPm2000 (28 V DC input Power Supply)
- Slot 5: XPort6170 removable storage and touch-panel display controller
