Manufacturing

X-ES has a streamlined manufacturing process that is efficient, scalable, and meets all Class 3 requirements as required by most military applications. In order to assure scheduling requirements can be met, X-ES owns a product assembly line. Prior to board assembly, PCBs and test coupons are inspected to ensure they meet fabrication requirements; product is assembled per IPC-6012B; BGAs are 100% x-rayed, and assembled boards go through 100% AOI (Automated Optical Inspection).

X-ES understands the reliability issues of a RoHS process. A leaded process can be used in applications where solder joint reliability and tin whiskering issues are a concern.

All products undergo a formal ATP (Acceptance Test Procedure) as well as an ESS (Environmental Stress Screening) procedure if required. Test logs are available in either electronic or print format and can be shipped along with every product.