XPedite7301

The XPedite7301 is a high-performance, low-power, XMC module based on the Intel® Core™ i7 processor and Intel® QM57 chipset. With up to three PCI Express ports and a Gigabit Ethernet port, the XPedite7301 is ideal for high-bandwidth data-processing applications.

The XPedite7301 accommodates up to 4 GB of DDR3 ECC SDRAM to support memory- intensive applications and hosts numerous I/O ports including Gigabit Ethernet, USB 2.0, SATA, and RS-232/422/485.

Wind River VxWorks, QNX Neutrino, Linux, and Green Hills INTEGRITY Board Support Packages (BSPs), as well as Microsoft Windows drivers, are available for the XPedite7301.

Features

• Intel® Core™ i7-610E, -620LE, -620UE, and -660UE processors
• Dual-core processor with Hyper-Threading Technology
• XMC module
• Conduction or air cooling
• Up to 4 GB of DDR3-1066 ECC SDRAM in two channels
• 32 MB NOR boot flash
• Up to 16 GB of NAND flash
• Two x4 or one x8 PCI Express P15 XMC interface
• One x4 PCI Express P16 XMC interface
• Gigabit Ethernet port with integrated magnetics
• Four USB 2.0 ports
• Two SATA ports
• Two RS-232/422/485 serial ports
• DVI video
• Audio line I/O port
• Linux BSP
• Wind River VxWorks BSP
• QNX Neutrino BSP
• Green Hills INTEGRITY BSP
• Microsoft Windows drivers

Technical Specs

Processor

• Intel® Core™ i7 processor operating at 2.53, 2.0, 1.06, or 1.33 GHz
• Dual-core processor with Hyper-Threading Technology
• Intel® QM57 chipset
• Dual-channel integrated memory controller
• Integrated graphics controller
• 4 MB of shared cache

Memory

• Up to 4 GB of DDR3-1066 ECC SDRAM in two channels
• 32 MB NOR boot flash
• Up to 16 GB of NAND flash

P14 PMC Interface

• Two USB 2.0 ports
• Two RS-232/422/485 serial ports
• One 10/100/1000BASE-T Ethernet port
• Four GPIO signals
• One audio I/O port

P15 XMC Interface

• One x8 or two x4 PCI Express interfaces

P16 XMC Interface

• One DVI display
• Two USB 2.0 ports
• Two SATA ports capable of 3 Gb/s
• One x4 PCI Express interface

Software

• Linux BSP
• Wind River VxWorks BSP
• QNX Neutrino BSP
• Green Hills INTEGRITY BSP
• Microsoft Windows drivers

Physical Characteristics

• XMC form factor
• Dimensions: 149 mm x 74 mm, 10 mm stacking height

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements.

• Supported ruggedization levels (see the X-ES Ruggedization Chart): 1, 3, 5
• Conformal coating available as an ordering option

Power Requirements

• Power will vary based on configuration and usage. Please consult factory.

Accessories

• XIt2041 (90060220) - PMC I/O Module (PIM) with Gigabit Ethernet, SATA, USB, Serial, and DVI

Documentation

Datasheet

To view all of the information about this product in a PDF, please download the datasheet.

Download Datasheet

Technical Documents

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