XPedite7301

Intel® Core™ i7 Processor-Based Conduction- or Air-Cooled XMC Module

The XPedite7301 accommodates up to 4 GB of DDR3 ECC SDRAM to support memory- intensive applications and hosts numerous I/O ports including Gigabit Ethernet, USB 2.0, SATA, and RS-232/422/485.

Not Recommended for New Designs

Please see recommended replacement products, the XPedite7501 or XPedite8101 XMC Processor Mezzanines.

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SKU: 90015145 Category:
XPedite7301 XMC Module

The XPedite7301 is a high-performance, low-power, XMC module based on the Intel® Core™ i7 processor and Intel® QM57 chipset. With up to three PCI Express ports and a Gigabit Ethernet port, the XPedite7301 is ideal for high-bandwidth data-processing applications.

The XPedite7301 accommodates up to 4 GB of DDR3 ECC SDRAM to support memory- intensive applications and hosts numerous I/O ports including Gigabit Ethernet, USB 2.0, SATA, and RS-232/422/485.

Wind River VxWorks, QNX Neutrino, Linux, and Green Hills INTEGRITY Board Support Packages (BSPs), as well as Microsoft Windows drivers, are available for the XPedite7301.

Features

  • Intel® Core™ i7-610E, -620LE, -620UE, and -660UE processors
  • Dual-core processor with Hyper-Threading Technology
  • XMC module
  • Conduction or air cooling
  • Up to 4 GB of DDR3-1066 ECC SDRAM in two channels
  • 32 MB NOR boot flash
  • Up to 16 GB of NAND flash
  • Two x4 or one x8 PCI Express P15 XMC interface
  • One x4 PCI Express P16 XMC interface
  • Gigabit Ethernet port with integrated magnetics
  • Four USB 2.0 ports
  • Two SATA ports
  • Two RS-232/422/485 serial ports
  • DVI video
  • Audio line I/O port
  • Linux BSP
  • Wind River VxWorks BSP
  • QNX Neutrino BSP
  • Green Hills INTEGRITY BSP
  • Microsoft Windows drivers

Technical Specs

Processor

  • Intel® Core™ i7 processor operating at 2.53, 2.0, 1.06, or 1.33 GHz
  • Dual-core processor with Hyper-Threading Technology
  • Intel® QM57 chipset
  • Dual-channel integrated memory controller
  • Integrated graphics controller
  • 4 MB of shared cache

Memory

  • Up to 4 GB of DDR3-1066 ECC SDRAM in two channels
  • 32 MB NOR boot flash
  • Up to 16 GB of NAND flash

P14 PMC Interface

  • Two USB 2.0 ports
  • Two RS-232/422/485 ports
  • One 10/100/1000BASE-T Ethernet port
  • Four GPIO signals
  • One audio I/O port

P15 XMC Interface

  • One x8 or two x4 PCI Express links

P16 XMC Interface

  • One DVI display
  • Two USB 2.0 ports
  • Two SATA ports capable of 3 Gb/s
  • One x4 PCI Express link

Software

  • Linux BSP
  • Wind River VxWorks BSP
  • QNX Neutrino BSP
  • Green Hills INTEGRITY BSP
  • Microsoft Windows drivers

Physical Characteristics

  • XMC form factor
  • Dimensions: 149 mm x 74 mm, 10 mm stacking height

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements.

  • Supported ruggedization levels (see the X-ES Ruggedization Chart): 1, 3, 5
  • Conformal coating available as an ordering option

Power Requirements

  • Power will vary based on configuration and usage. Please consult factory.

Accessories

Please contact X-ES Sales at sales@xes-inc.com or by phone at +1-608-833-1155 for information on this product's accessories.

Documentation

Data Sheet

To view all of the information about this product in a PDF, please download the data sheet.

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Technical Documents

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Additional Information

Replacement Product

View the recommended replacement product, XPedite7501

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Datasheet

View the XPedite7301
Datasheet PDf

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Product Brief

Built-In Test (BIT)
Product Brief

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XMC Mezzanines

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