XPedite7478

Intel® Core™ i7 Processor-Based 3U VPX-REDI Single Board Computer (SBC) with Integrated 1553 and CAN Bus

The XPedite7478 is a high-performance, low-power, 3U VPX-REDI, single board computer based on the 3rd generation Intel® Core™ i7 processor. With an integrated dual-redundant MIL-STD-1553B interface and two CAN bus channels, the XPedite7478 maximizes native I/O while minimizing SWaP and cost.

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SKU: 90030410 Category:
XPedite7478 3U VPX-REDI SBC

The XPedite7478 is a high-performance, low-power, 3U VPX-REDI, single board computer based on the 3rd generation Intel® Core™ i7 processor.

With an integrated dual-redundant MIL-STD-1553B interface and two CAN bus channels, the XPedite7478 maximizes native I/O while minimizing SWaP and cost. Additionally, the XPedite7478 integrates further expansion capabilities by including support for an XMC module.

The XPedite7478 also maximizes memory density with up to 8 GB of DDR3 ECC SDRAM across two channels. With two PCI Express Fat Pipe P1 interconnects and two Gigabit Ethernet ports, the XPedite7478 is ideal for processing-intensive applications requiring high-throughput communication.

Wind River VxWorks and Linux Board Support Packages (BSPs) are available, as well as Microsoft Windows drivers.

Features

  • Supports 3rd generation Intel® Core™ i7 processors
  • Dual-core processor with Intel® Hyper-Threading Technology
  • 3U VPX (VITA 46) module
  • VITA 46.11 Tier 1 and Tier 2 IPMI Controller (IPMC)
  • Compatible with multiple VITA 65 OpenVPX™ profiles
  • Ruggedized Enhanced Design Implementation (REDI) per VITA 48
  • Conduction cooling
  • Up to 8 GB of DDR3 ECC SDRAM in two channels
  • Up to 32 GB of NAND flash
  • Two Gen2 Fat Pipe P1 fabric interconnects
  • One dual-redundant MIL-STD-1553B interface
  • Two CAN bus channels
  • Four serial ports
  • One DisplayPort video interface
  • Wind River VxWorks BSP
  • Linux BSP
  • Microsoft Windows drivers
  • Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks BSPs

Technical Specs

Processor

  • Quad- or dual-core Intel® Core™ i7
  • Intel® Turbo Boost Technology
  • Intel® Hyper-Threading Technology
  • AVX instruction set extensions
  • Integrated with Intel® QM77 chipset
  • Dual-channel integrated memory controller

Quad-Core Processor Configurations

  • Core™ i7-3612QE: 2.1 GHz, 6 MB cache

Dual-Core Processor Configurations

  • Core™ i7-3555LE: 2.5 GHz, 4 MB cache
  • Core™ i7-3517UE: 1.7 GHz, 4 MB cache

Memory

  • Up to 8 GB of DDR3 ECC SDRAM in two channels
  • 32 MB of NOR boot flash
  • Up to 32 GB of NAND flash
  • 16 kB EEPROM
  • 4 MB MRAM

Graphics

  • Integrated high-performance 3D graphics controller
  • One DisplayPort video interface

VPX (VITA 46) P0 I/O

  • IPMI I²C port
  • VITA 46.11 (System Management on VPX)

VPX (VITA 46) P1 I/O

  • x4 PCI Express Fat Pipe interface to P1.A
  • x4 PCI Express Fat Pipe interface to P1.B
  • One 10/100/1000BASE-T Gigabit Ethernet port

VPX (VITA 46) P2 I/O

  • One 10/100/1000BASE-T Gigabit Ethernet port
  • One dual-redundant MIL-STD-1553B interface
  • Two CAN bus channels
  • Two SATA ports capable of 3 Gb/s
  • Two USB 2.0 ports
  • Two RS-232 serial ports, two RS-422/485 serial ports
  • One DisplayPort video interface
  • Isolated mono audio

Additional Features

  • Non-volatile memory write protection
  • IEEE 1588 support on two Gigabit Ethernet ports
  • VITA 46.11 Tier 1 and Tier 2 IPMI Controller (IPMC)

Software Support

  • Wind River VxWorks BSP
  • Linux BSP
  • Microsoft Windows drivers
  • Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks BSPs

Physical Characteristics

  • 3U VPX-REDI conduction- or air-cooled form factor
  • Dimensions: 100 mm x 160 mm
  • 0.8 in. pitch without solder-side cover
  • 0.85 in. and 1.0 in. pitch with solder-side cover

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements.

  • Supported ruggedization levels (see the X-ES Ruggedization Chart): 3, 5
  • Conformal coating available as an ordering option
  • Thermal performance will vary based on CPU frequency and application

Power Requirements

  • Power will vary based on configuration and usage. Please consult factory.

Accessories

  • XIt1080 (90040020) - 3U VPX Rear Transition Module (RTM) for I/O Breakout
  • XPand1004 (90071810) - 3U VPX Two-Slot Development Chassis for Conduction-Cooled Modules
  • XTend209 (90071685) - Debug Module for Intel® Processor-Based Boards

Documentation

Datasheet

To view all of the information about this product in a PDF, please download the datasheet.

Download Datasheet

Technical Documents

SupportNet is your source for product manuals, technical support, and software downloads.

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Block Diagram

Additional Information

Product Brief

3rd Gen Intel® Core™ i7 3U VPX SBCs Product Brief

View Brief

Datasheet

View the XPedite7478
Datasheet PDF

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