X-ES combines deep embedded systems expertise with a relentless focus on reliability, security, and long-term customer commitment to deliver mission-ready rugged computing solutions for the world's most demanding environments.
Extreme environments demand precision-engineered solutions. Our Intel® Core™ Ultra (Series 3) processor-based single board computers bring cutting-edge performance to the harshest operational conditions.
These platforms don't just survive demanding deployments; they excel in them, delivering the computational performance required by real-time processing and data-intensive workloads where reliability and performance are non-negotiable.
Intel® Core™ Ultra (Series 3), formerly code named Panther Lake-H, represents the next evolution of Intel®'s long-standing Core i processor family, delivering a seamless continuation of performance, compatibility, and lifecycle stability for embedded and mission-critical systems.
Core™ Ultra is the first Intel® processor produced on the new 18A process, Intel®'s advanced 1.8 nm-class semiconductor manufacturing technology, delivering higher performance and reduced power consumption.
A three-tier hybrid architecture combining performance cores, efficiency cores, and low-power efficiency cores supports up to 16 total cores, enabling the processor to match compute resources to workload demands with high efficiency.
Mixed criticality compute cores enable real-time and time-aware applications by separating latency-sensitive tasks from throughput workloads, supporting deterministic operation across diverse mission profiles.
Exceptional power scaling is achieved through distributed core usage, allowing workloads to dynamically balance performance and efficiency while operating across the full processor temperature range without Dynamic Temperature Range (DTR) restrictions or reboots.
Up to 64 GB of LPDDR5 SDRAM with native in-band ECC provides high-bandwidth memory performance and enhanced data integrity, supporting deterministic operation, extended temperature ranges, and long-life, mission-critical deployments.
Our rugged single board computers built on the Intel® Core™ Ultra (Series 3) family of processors deliver a new level of performance, efficiency, and integration for demanding embedded applications.
The hybrid core architecture supports mixed-criticality workloads and real-time operation while enabling efficient power scaling across diverse use cases. Integrated AI acceleration, high-bandwidth memory with in-band ECC, and integrated security features make these platforms well suited for data-intensive, compute-heavy applications that require the proven reliability and long-term operation that X-ES delivers.
Additionally, Intel® Core™ Ultra processors offer a 10+ year supply life assurance, providing predictable availability and long-term program stability.
Extended temperature operation from -40˚C up to 85˚C is supported natively across the entire board. All components on the PCB are rated for the temperature range in which they are used, eliminating the need for temperature up-screening and improving reliability.
Our SBCs are engineered with a ruggedized architecture from initial design through final assembly. The PCBs are designed to minimize layers, reducing cost and increasing manufacturability and reliability, all while being fabricated and assembled to IPC Class 3.
An integrated Microchip PolarFire™ SoC FPGA enables secure and application-specific functionality beyond the processor. It supports custom security implementations and works alongside processor-based protections such as Intel® Boot Guard, UEFI secure boot, Intel® TXT, and secure boot workflows.
High-performance networking is enabled through integrated 100 Gigabit Ethernet support, including RoCE v2 capability via a network interface controller. This architecture supports high-throughput, low-latency data movement for critical embedded systems and can be paired with Ethernet switching where required.
Our VPX single board computers are fully aligned with the SOSA technical standard, supporting both I/O-intensive and Payload-intensive profiles, ensuring interoperability, modularity, and long-term compatibility with the broader SOSA ecosystem.
Our single board computers are engineered with ruggedization and reliability as foundational design requirements, not post-production enhancements.
Mechanical construction, component selection, and assembly processes are aligned to support extended temperature operation (-40°C to +85°C), long service life, and deterministic performance in demanding embedded environments. This systems-level approach minimizes integration risk, reduces field failure modes, and ensures predictable behavior across the operational envelope.
Every component on the PCB is industrial-grade and natively rated for extended temperature operation—no commercial part screening or up-rating.
Consistent thermal performance across all processor cores means predictable behavior under sustained loads in demanding environments.
Soldered components, BGA processor mounting, and an integrated heatframe deliver structural integrity and thermal stability.
Built to IPC Class 3 standards with a PCB stackup that is engineered for durability without the need for underfill or post-process reinforcement.
Built with Intel®'s high-reliability processors and qualified by Intel® to 10 years at 100% utilization in order to deliver exceptional performance while minimizing field service requirements.
Guaranteed long-term component availability ensures programs can deploy with confidence and maintain systems throughout their operational life.
Enhanced AI capabilities unlock new possibilities for intelligent edge applications. Process and analyze data faster, closer to the source, enabling smarter systems that respond in real-time to changing conditions and operational demands.
Experience the most capable, ruggedized embedded computing boards available on the market today, featuring Intel® Core™ Ultra (Series 3) processor technology.