X-ES logo

The latest Single Board Computers from X-ES are now available with Intel® Core™ Ultra (Series 3) (formerly Panther Lake) processors, offering unrivaled performance and proven reliability in extreme environments.

X-ES combines deep embedded systems expertise with a relentless focus on reliability, security, and long-term customer commitment to deliver mission-ready rugged computing solutions for the world's most demanding environments.

Intel® Core™ Ultra (Series 3)

Advanced Single Board Computers from X-ES

Extreme environments demand precision-engineered solutions. Our Intel® Core™ Ultra (Series 3) processor-based single board computers bring cutting-edge performance to the harshest operational conditions.

These platforms don't just survive demanding deployments; they excel in them, delivering the computational performance required by real-time processing and data-intensive workloads where reliability and performance are non-negotiable.

Intel® Core™ Ultra (Series 3) Single Board Computers in many industry-standard form factors from X-ES

Pushing the limits of technology

The Next Evolution of Intel® Core™ Processing

Intel® Core™ Ultra (Series 3), formerly code named Panther Lake-H, represents the next evolution of Intel®'s long-standing Core i processor family, delivering a seamless continuation of performance, compatibility, and lifecycle stability for embedded and mission-critical systems.

Core™ Ultra is the first Intel® processor produced on the new 18A process, Intel®'s advanced 1.8 nm-class semiconductor manufacturing technology, delivering higher performance and reduced power consumption.

Hybrid Core Architecture

A three-tier hybrid architecture combining performance cores, efficiency cores, and low-power efficiency cores supports up to 16 total cores, enabling the processor to match compute resources to workload demands with high efficiency.

Mixed-Criticality Compute

Mixed criticality compute cores enable real-time and time-aware applications by separating latency-sensitive tasks from throughput workloads, supporting deterministic operation across diverse mission profiles.

Distributed Power Performance

Exceptional power scaling is achieved through distributed core usage, allowing workloads to dynamically balance performance and efficiency while operating across the full processor temperature range without Dynamic Temperature Range (DTR) restrictions or reboots.

High-Speed Memory with In-Band ECC

Up to 64 GB of LPDDR5 SDRAM with native in-band ECC provides high-bandwidth memory performance and enhanced data integrity, supporting deterministic operation, extended temperature ranges, and long-life, mission-critical deployments.

Advanced Capabilities

Built for the Demands of Modern Mission Computing

Our rugged single board computers built on the Intel® Core™ Ultra (Series 3) family of processors deliver a new level of performance, efficiency, and integration for demanding embedded applications.

The hybrid core architecture supports mixed-criticality workloads and real-time operation while enabling efficient power scaling across diverse use cases. Integrated AI acceleration, high-bandwidth memory with in-band ECC, and integrated security features make these platforms well suited for data-intensive, compute-heavy applications that require the proven reliability and long-term operation that X-ES delivers.

Additionally, Intel® Core™ Ultra processors offer a 10+ year supply life assurance, providing predictable availability and long-term program stability.

Native Extended Temperature icon

Native Extended Temperature

Extended temperature operation from -40˚C up to 85˚C is supported natively across the entire board. All components on the PCB are rated for the temperature range in which they are used, eliminating the need for temperature up-screening and improving reliability.

View Single Board Computers ›

Tank icon

Fully Ruggedized Design

Our SBCs are engineered with a ruggedized architecture from initial design through final assembly. The PCBs are designed to minimize layers, reducing cost and increasing manufacturability and reliability, all while being fabricated and assembled to IPC Class 3.

View Single Board Computers ›

Security FPGA icon

Microchip PolarFire™ SoC FPGA

An integrated Microchip PolarFire™ SoC FPGA enables secure and application-specific functionality beyond the processor. It supports custom security implementations and works alongside processor-based protections such as Intel® Boot Guard, UEFI secure boot, Intel® TXT, and secure boot workflows.

View Single Board Computers ›

40 Gigabit Ethernet icon

100 Gigabit Ethernet Networking

High-performance networking is enabled through integrated 100 Gigabit Ethernet support, including RoCE v2 capability via a network interface controller. This architecture supports high-throughput, low-latency data movement for critical embedded systems and can be paired with Ethernet switching where required.

View Single Board Computers ›

Sensor Open Systems Architecture™

SOSA-Aligned Design

Our VPX single board computers are fully aligned with the SOSA technical standard, supporting both I/O-intensive and Payload-intensive profiles, ensuring interoperability, modularity, and long-term compatibility with the broader SOSA ecosystem.

I/O-Intensive SBCsPayload-Intensive SBCs

Built for the Extremes

High Reliability, Rugged Design

Our single board computers are engineered with ruggedization and reliability as foundational design requirements, not post-production enhancements.

Mechanical construction, component selection, and assembly processes are aligned to support extended temperature operation (-40°C to +85°C), long service life, and deterministic performance in demanding embedded environments. This systems-level approach minimizes integration risk, reduces field failure modes, and ensures predictable behavior across the operational envelope.

Efficient Thermal Management

Every component on the PCB is industrial-grade and natively rated for extended temperature operation—no commercial part screening or up-rating.

Consistent thermal performance across all processor cores means predictable behavior under sustained loads in demanding environments.

Ruggedized Mechanical Design

Soldered components, BGA processor mounting, and an integrated heatframe deliver structural integrity and thermal stability.

Built to IPC Class 3 standards with a PCB stackup that is engineered for durability without the need for underfill or post-process reinforcement.

Qualified for Extended Service Life

Built with Intel®'s high-reliability processors and qualified by Intel® to 10 years at 100% utilization in order to deliver exceptional performance while minimizing field service requirements.

Guaranteed long-term component availability ensures programs can deploy with confidence and maintain systems throughout their operational life.

Enhanced AI capabilities unlock new possibilities for intelligent edge applications. Process and analyze data faster, closer to the source, enabling smarter systems that respond in real-time to changing conditions and operational demands.

Next-Generation Xe3 GPU

 

Leverages the new GFX Xe3 architecture GPU, delivering speeds up to four times faster
than the previous generation.

Neural Processing Unit

 

Integrated Neural Processing
Unit (NPU) 5.0 for dedicated AI acceleration with up to 3x performance in TOPS.

Enhanced AI Features

 

Built-in Intel® Arc graphics can access >50% of system memory, delivering advanced AI performance to the edge.

High Speed PCIe

 

Processor features 20 lanes of high-speed PCIe, including 12 lanes of PCIe Gen5, for the most throughput-intensive peripherals like NICs and GPU co-processors.

Extreme Engineering Solutions

Trusted and Proven Embedded Solutions

Experience the most capable, ruggedized embedded computing boards available on the market today, featuring Intel® Core™ Ultra (Series 3) processor technology.

View Single Board Computers ›

Extreme Engineering Solutions (X-ES) logo

9901 Silicon Prairie Pkwy
Verona, WI 53593