Intel® has unveiled their eagerly awaited Xeon® D-1700 and D-2700 series processors: a new line of power-efficient System-on-Chip (SoC) packages with integrated 40 Gigabit Ethernet providing incredible speed and exceptional networking performance in extreme environments.
3U VPX · Xeon® D-2700 (HCC)
Formerly codenamed Ice Lake-D, Xeon® D-1700 and D-2700 series processors are power-efficient System-on-Chip (SoC) packages with integrated 40 Gigabit Ethernet for high-speed connectivity.
Offering significant improvements over existing Xeon® D processors in terms of sheer processing power and memory density, Ice Lake-D technology is ideal for computationally heavy applications.
With native temperature support between -40˚C and up to 85˚C and featuring high-density BGA packages, these processors are built to support rugged applications in more diverse conditions than ever before.
X-ES processor boards featuring the Intel® Xeon® D-1700 series products offer optimized computing performance with up to 10 processor cores and up to 48 GB of DDR4 memory in three channels all in one, easy-to-cool package.
In addition to highly capable 40 Gigabit Ethernet and dual 10 Gigabit Ethernet, X-ES' LCC processor-based boards provide an XMC site and a Microsemi PolarFire FPGA for hosting custom functions - ideal when stringent security capabilities are required.
Native extended temperature support from -40°C to 85°C allows embedded applications utilizing these Intel® Xeon® D processors to excel in thermally challenging environments.
X-ES integrates Intel® Xeon® D-1700 (LCC) and D-2700 (HCC) series processors into a variety of standard and custom form factors.
Experience the most capable, most ruggedized embedded computing processor boards available on the market today.
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