3U VPX SINGLE BOARD COMPUTER · SKU 90030480
XPedite7770
The XPedite7770 is a secure, high-performance single board computer based on the Intel® Xeon® D-1700 series (formerly Ice Lake-D) of processors, making it an optimal choice for computationally heavy applications requiring maximum data and information protection.
This 3U VPX-REDI module offers a pinout compatible with the Sensor Open System Architecture (SOSA) I/O Intensive profile (SLT3-PAY-1F1F2U1TU1T1U1T-14.2.16).
Product Lifecycle
X-ES also offers comprehensive configuration and obsolescence management services, providing customers with direct control over non-interchangeable changes and extending product availability and serviceability well beyond standard end-of-life milestones.
Engineered for Extended Reliability
All X-ES products are designed and manufactured 100% in the USA with components from trusted supply chains in order to deliver rugged, reliable performance in the most demanding environments.
Built with components rated for extreme conditions and validated through rigorous testing, our solutions minimize obsolescence risk and lower total cost of ownership across the full program lifespan.
Introduction to XPedite7770
The XPedite7770 is a secure, high-performance single board computer based on the Intel® Xeon® D-1700 series (formerly Ice Lake-D) of processors, making it an optimal choice for computationally heavy applications requiring maximum data and information protection.
Ruggedized, Standards-Based Design
This 3U VPX-REDI module offers a pinout compatible with the Sensor Open System Architecture (SOSA) I/O Intensive profile (SLT3-PAY-1F1F2U1TU1T1U1T-14.2.16).
Security & Data Protection
XPedite7770 integrates SecureCOTS™ technology with a Microchip PolarFire™ System-on-Chip (SoC) FPGA for hosting custom functions to protect data from being modified or observed and provides an ideal solution when stringent security capabilities are required.
Memory & Storage
It accommodates up to 48 GB of DDR4 ECC SDRAM in three channels and up to 256 GB of onboard NAND flash.
I/O & Connectivity
The XPedite7770 provides incredible speed with 100GBASE-KR4, 10GBASE-KR, and 10/100/1000BASE-T Ethernet ports in addition to numerous I/O ports, including USB 2.0, PCI Express, and RS-232/422/485 serial through the backplane connectors.
Expansion Capabilities & Software Support
An integrated XMC site provides additional expansion capabilities, including a x8 PCI Express connection to the Intel® Xeon® D processor and X12d I/O mapped directly to the VPX backplane connectors.
Wind River VxWorks, X-ES Enterprise Linux (XEL), and Linux Yocto Board Support Packages (BSPs) are available.
Processor
- Intel® Xeon® D-1700 series (formerly Ice Lake-D) processor
- Up to 10 Xeon®-class cores in a single, power-efficient SoC package
- SKUs available with native extended temperature support
Memory
- 48 GB of DDR4 ECC SDRAM in three channels
- Up to 256 GB of NAND flash
- 64 MB NOR boot flash
- 64 kB EEPROM
Security and Management
- Microchip PolarFire™ SoC FPGA with 256 MB SPI flash
- Designed with SecureCOTS™ technology to support enhanced security and trusted computing
- System voltage monitor, power-on/reset control, non-volatile write-protection control
- Trusted Platform Module (TPM)
VPX (VITA 46) P0 I/O
- Two IPMB connections to an IPMI Controller
VPX (VITA 46) P1 I/O
- One 100GBASE-KR4 Ethernet port to P1.A
- One x4 PCI Express Gen3-capable interface to P1.B
- XMC P16 I/O, mapping P1w9-X12d per VITA 46.9
- One 10GBASE-KR Ethernet port
- One 10GBASE-KR Ethernet port (optional)
VPX (VITA 46) P2 I/O
- One 10/100/1000BASE-T Ethernet port
- One x4 PCI Express Gen3-capable interface
- One x4 PCI Express Gen2-capable interface
- Two x2 PCI Express Gen2-capable interfaces
- Two USB 2.0 ports
- Two RS-232/422/485 serial ports
- Four single-ended FPGA GPIOs
Software Support
- RDMA over Converged Ethernet (RoCE) v2 internet layer protocol support
- UEFI firmware
- Wind River VxWorks BSP
- X-ES Enterprise Linux (XEL) BSP
- Linux Yocto BSP
- Contact factory for availability of Microsoft Windows drivers and other operating systems
XMC Site
- One x8 PCI Express Gen3-capable interface
Physical Characteristics
- 3U VPX-REDI conduction- or air-cooled form factor
- Pinout compatible with SOSA I/O Intensive profile (SLT3-PAY-1F1F2U1TU1T1U1T-14.2.16)
- Dimensions: 100 mm x 160 mm
- 0.8 in. pitch without solder-side cover
- 1.0 in. pitch with Two-Level Maintenance (2LM) support
Environmental Requirements
Contact factory for appropriate board configuration based on environmental requirements
- Supported ruggedization levels (see the X-ES Ruggedization Chart): 5
- Conformal coating available as an ordering option
- Thermal performance will vary based on CPU frequency and application
- Contact X-ES for air-cooled development options
Power Requirements
- Power will vary based on configuration and usage. Please consult factory.
Accessories
- XIt1097 (90074535) – 3U VPX Rear Transition Module with 40 Gigabit and 10 Gigabit Ethernet, USB, Serial, and XIM Site
- XPand1007 (90075300) – Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O
- XPand1203 (90072665) – 3U VPX Development Platform for Up to Eight Conduction-Cooled Modules
- XPand1205 (90075035) – 3U VPX Development Platform for Up to Eight Conduction-Cooled Modules
- XTend230 (90072690) – Debug Module for Programming and Diagnostic Interfaces
XPedite7770
Intel® Xeon® D-1700 Processor-Based 3U VPX-REDI Module with 48 GB of DDR4, 100 Gigabit Ethernet, and SecureCOTS™
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Datasheet
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