XPedite7770

Intel® Xeon® D-1700 Processor-Based 3U VPX-REDI Module with 48 GB of DDR4, 40 Gigabit Ethernet, and SecureCOTS™

The XPedite7770 is a secure, high-performance, 3U VPX-REDI, single board computer based on the Intel® Xeon® D-1700 series (formerly Ice Lake-D) of processors.

The XPedite7770 is an optimal choice for computationally heavy applications requiring maximum data and information protection.

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XPedite7770 3U VPX Single Board Computer (SBC)

The XPedite7770 is a secure, high-performance, 3U VPX-REDI, single board computer based on the Intel® Xeon® D-1700 series (formerly Ice Lake-D) of processors. The XPedite7770 is an optimal choice for computationally heavy applications requiring maximum data and information protection.

The XPedite7770 integrates SecureCOTS™ technology with a Microsemi® PolarFire™ FPGA for hosting custom functions to protect data from being modified or observed and provides an ideal solution when stringent security capabilities are required.

The XPedite7770 provides incredible speed with a 40GBASE-KR4, up to two 10GBASE-KR, and one 10/100/1000BASE-T Ethernet ports. It accommodates up to 48 GB of DDR4 ECC SDRAM in three channels and up to 32 GB of onboard SLC NAND flash in addition to numerous I/O ports, including USB 2.0, PCIe, and RS-232/422/485 serial through the backplane connectors.

The XPedite7770 provides additional expansion capabilities by including an integrated XMC site. This XMC site includes a x8 PCIe connection to the Intel® Xeon® D processor and X12d I/O mapped directly to the VPX backplane connectors.

Wind River VxWorks and X-ES Enterprise Linux (XEL) Board Support Packages (BSPs) are available.

Features

  • Supports Intel® Xeon® D-1700 series (formerly Ice Lake-D) processors
  • Up to 10 Xeon®-class cores in a single, power-efficient SoC package
  • SKUs available with native extended temperature support
  • Designed with SecureCOTS™ technology to support enhanced security and trusted computing
  • Microsemi® PolarFire™ FPGA with 128 MB SPI flash
  • 3U VPX (VITA 46) module
  • Compatible with multiple VITA 65 OpenVPX™ slot profiles
  • Ruggedized Enhanced Design Implementation (REDI) per VITA 48
  • 48 GB of DDR4 ECC SDRAM in three channels
  • 32 GB of SLC NAND flash
  • XMC site with x8 PCIe interface and rear I/O support
  • One 40GBASE-KR4 Ethernet port
  • One 10/100/1000BASE-T Ethernet port
  • Two x4 Gen3, one x4 Gen2, and two x2 Gen2 PCIe interfaces
  • One 10GBASE-KR port (with additional port available in some board configurations)
  • Two USB 2.0 ports
  • Two RS-232/422/485 serial ports
  • Wind River VxWorks BSP
  • X-ES Enterprise Linux (XEL) BSP
  • Contact factory for SATA or PCIe Gen4 availability
  • Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs, as well as Microsoft Windows drivers

Technical Specs

Processor

  • Intel® Xeon® D-1700 series (formerly Ice Lake-D) processor
  • Up to 10 Xeon®-class cores in a single, power-efficient SoC package
  • SKUs available with native extended temperature support

Memory

  • 48 GB of DDR4 ECC SDRAM in three channels
  • 32 GB of SLC NAND flash
  • 64 MB NOR boot flash
  • 64 kB EEPROM

Security and Management

  • Microsemi® PolarFire™ FPGA with 128 MB SPI flash
  • Designed with SecureCOTS™ technology to support enhanced security and trusted computing
  • System voltage monitor, power-on/reset control, non-volatile write-protection control
  • Trusted Platform Module (TPM)

VPX (VITA 46) P0 I/O

  • Two IPMB connections to an IPMI Controller

VPX (VITA 46) P1 I/O

  • One 40GBASE-KR4 Ethernet port to P1.A
  • One x4 PCI Express Gen3-capable interface to P1.B
  • XMC P16 I/O, mapping P1w9-X12d per VITA 46.9
  • One 10GBASE-KR Ethernet port
  • One 10GBASE-KR Ethernet port (optional)

VPX (VITA 46) P2 I/O

  • One 10/100/1000BASE-T Ethernet port
  • One x4 PCI Express Gen3-capable interface
  • One x4 PCI Express Gen2-capable interface
  • Two x2 PCI Express Gen2-capable interfaces
  • Two USB 2.0 ports
  • Two RS-232/422/485 serial ports
  • Four single-ended FPGA GPIOs

Software Support

  • UEFI firmware
  • Wind River VxWorks BSP
  • X-ES Enterprise Linux (XEL) BSP
  • Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs, as well as Microsoft Windows drivers

XMC Site

  • One x8 PCI Express Gen3-capable interface

Physical Characteristics

  • 3U VPX-REDI conduction- or air-cooled form factor
  • Dimensions: 100 mm x 160 mm
  • 0.8 in. pitch without solder-side cover
  • 1.0 in. pitch with Two-Level Maintenance (2LM) support

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements

  • Supported ruggedization levels (see the X-ES Ruggedization Chart): 5
  • Conformal coating available as an ordering option
  • Thermal performance will vary based on CPU frequency and application
  • Contact X-ES for air-cooled development options

Power Requirements

  • Power will vary based on configuration and usage. Please consult factory.

Accessories

  • XIt1097 (90074535) - 3U VPX Rear Transition Module with 40 Gigabit and 10 Gigabit Ethernet, USB, Serial, and XIM Site
  • XIt1098 (90030650) - 3U VPX Rear Transition Module with Dual 40 Gigabit and 10 Gigabit Ethernet, USB, and Serial
  • XPand1200 (90070530) - 3U VPX Conduction-Cooled Development Platform
  • XTend218 (90072500) - Debug Module/Cable with Serial/I2C/USB/JTAG/SPI and Power Supply Programming

Documentation

Datasheet

To view all of the information about this product in a PDF, please download the datasheet.

Download Datasheet

Technical Documents

SupportNet is your source for product manuals, technical support, and software downloads.

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Block Diagram

Additional Information

Intel® Xeon® D Overview

Learn more about the Intel® Xeon® D family of processors

Learn More

Press Release

View the Ice Lake-D press release

View Press Release

Datasheet

View the XPedite7770
Datasheet PDF

Download Datasheet

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