News & Events

X-ES Announces Rugged, Configurable XPedite2500 XMC Module with High-Density Xilinx Kintex® UltraScale™ FPGA

Introducing the XPedite2500, a rugged XMC module based on the high‑performance Xilinx Kintex® UltraScale™ XCKU115 FPGA. Featuring the highest density of logic elements in its family, up to 8 GB of DDR4 SDRAM in four independent channels, and numerous options for high-bandwidth I/O, this mezzanine card is a powerful, yet cost-effective, solution for a wide…

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XPedite7683 Offers the Intel® Xeon® D with 32 GB of -40°C Manufacturer-Rated DDR4 Memory, Without Sacrificing XMC Support

X-ES announces the XPedite7683, a 3U VPX SBC based on the Intel® Xeon® D-1500 family of processors. In addition to its 12 Xeon®-class processing cores and XMC expansion site, the XPedite7683 includes 32 GB of single-die DDR4 memory with ECC, rated by the manufacturer to operate at temperatures down to -40°C. Compared to competitive 3U VPX…

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Rapid Growth Fuels X-ES Move to New Corporate Headquarters

To accommodate current and future growth, Extreme Engineering Solutions (X-ES) has moved to a new corporate headquarters in Verona, WI. Completed in September of 2018, the combined office and manufacturing space is located at 9901 Silicon Prairie Parkway, approximately six miles from the company’s previous headquarters in Middleton, WI. The new 125,000 sq. ft. facility…

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XPand6215 Redefines What is Possible in an Embedded, SWaP-Optimized System

Revolutionary performance in a Small Form Factor enclosure – XPand6215 is latest 3U VPX embedded system from X-ES and it sets a new standard for high-bandwidth data acquisition and signal processing in harsh environments. With multiple high-speed optical links, an Intel® Xeon® D-1500 processor, and a Xilinx Kintex® UltraScale™ FPGA, the XPand6215 offers uncompromising performance and…

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Unrivaled Processing Performance on Rugged, Deployable Intel® Xeon® D Processor Boards

Since unveiling our first single board computers (SBCs) based on the Intel® Xeon® D family of processors in 2015, X-ES has developed an industry-leading portfolio of embedded, high-reliability Intel® Xeon® D processor-based products in several industry-standard form factors. Supporting features like native 10 Gigabit Ethernet, high core-count SKUs, extended temperature tolerances, and a scalable, pin-compatible design, X-ES Intel®…

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Intel Federal Summit

X-ES will be exhibiting October 9-10, 2018 at the 2018 Intel Federal Summit, taking place at the MGM National Harbor Hotel located in Oxen Hill, MD

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2018 AUSA Annual Meeting and Exposition

X-ES will be exhibiting October 8-10, 2018 in booth #8205 (in Hall D/E) at the 2018 AUSA Annual Meeting and Exposition, taking place at the Walter E. Washington Convention Center located in Washington, D.C.

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X-ES Announces Secure-by-Design Multi-Core Board Now Ready for 2nd Generation Integrated Modular Avionics

X-ES announces the integration of our secure-by-design XPedite7674 board with the LynxSecure Safety Bundle (LSB) from Lynx Software Technologies. The integration delivers an ideal platform for 2nd generation IMA development. LSB is an open system architecture solution that unlocks the potential of multi-core processors such as the Intel® Xeon® D onboard X-ES’ XPedite7674 3U VPX…

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X-ES Unveils XPand6212 & XPand6211 Rugged Embedded Systems Offering Unparalleled, High-Performance Networking & Communications

Introducing our most powerful, Small Form Factor chassis, ever. The XPand6212 and XPand6211, a pair of Small Form Factor (SFF), COTS, rugged embedded systems, are now available from X-ES. With their high-performance networking and communications capabilities and lightweight, SWaP-optimized design, these systems are ideal for deployed applications where connectivity is key to mission success.

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