News & Events

X-ES Unveils Deployable 40 Gigabit Ethernet Switches Designed for Rugged Networking Applications

X-ES continues to push the boundaries of embedded computing with the introduction of two cutting-edge, 40 Gigabit 3U VPX Ethernet switches: the XChange3030 and XChange3031. These switches provide unparalleled data transmission speeds while maintaining a power-balanced design, ensuring efficient cooling and remarkable versatility to meet the demands of modern networking solutions. With an unwavering focus on maximizing…

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X-ES Showcases New Line of Rugged Products Based on Cutting-Edge Intel® Xeon® D-1700/D-2700 Processors for Maximum Processing Power

Formerly codenamed Ice Lake-D, Xeon® D-1700 and D-2700 series processors are power-efficient System-on-Chip (SoC) packages with integrated 40 Gigabit Ethernet for high-speed connectivity. Offering significant improvements over existing Xeon® D processors in terms of sheer processing power and memory density, Ice Lake-D technology is ideal for computationally heavy applications.

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X-ES Announces Rugged, Configurable XPedite2500 XMC Module with High-Density Xilinx Kintex® UltraScale™ FPGA

Introducing the XPedite2500, a rugged XMC module based on the high‑performance Xilinx Kintex® UltraScale™ XCKU115 FPGA. Featuring the highest density of logic elements in its family, up to 8 GB of DDR4 SDRAM in four independent channels, and numerous options for high-bandwidth I/O, this mezzanine card is a powerful, yet cost-effective, solution for a wide…

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XPedite7683 Offers the Intel® Xeon® D with 32 GB of -40°C Manufacturer-Rated DDR4 Memory, Without Sacrificing XMC Support

X-ES announces the XPedite7683, a 3U VPX SBC based on the Intel® Xeon® D-1500 family of processors. In addition to its 12 Xeon®-class processing cores and XMC expansion site, the XPedite7683 includes 32 GB of single-die DDR4 memory with ECC, rated by the manufacturer to operate at temperatures down to -40°C. Compared to competitive 3U VPX…

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Rapid Growth Fuels X-ES Move to New Corporate Headquarters

To accommodate current and future growth, Extreme Engineering Solutions (X-ES) has moved to a new corporate headquarters in Verona, WI. Completed in September of 2018, the combined office and manufacturing space is located at 9901 Silicon Prairie Parkway, approximately six miles from the company’s previous headquarters in Middleton, WI. The new 125,000 sq. ft. facility…

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XPand6215 Redefines What is Possible in an Embedded, SWaP-Optimized System

Revolutionary performance in a Small Form Factor enclosure – XPand6215 is latest 3U VPX embedded system from X-ES and it sets a new standard for high-bandwidth data acquisition and signal processing in harsh environments. With multiple high-speed optical links, an Intel® Xeon® D-1500 processor, and a Xilinx Kintex® UltraScale™ FPGA, the XPand6215 offers uncompromising performance and…

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Unrivaled Processing Performance on Rugged, Deployable Intel® Xeon® D Processor Boards

Since unveiling our first single board computers (SBCs) based on the Intel® Xeon® D family of processors in 2015, X-ES has developed an industry-leading portfolio of embedded, high-reliability Intel® Xeon® D processor-based products in several industry-standard form factors. Supporting features like native 10 Gigabit Ethernet, high core-count SKUs, extended temperature tolerances, and a scalable, pin-compatible design, X-ES Intel®…

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