September 18th, 2020 — News
On September 18, 2020, X‑ES was recognized as one of just 20 of Lockheed Martin Missiles and Fire Control Outstanding Small Business Suppliers for our continued contributions in 2019.
Read MoreApril 10th, 2019 — News
Introducing the XPedite2500, a rugged XMC module based on the high‑performance AMD (formerly Xilinx) Kintex® UltraScale™ XCKU115 FPGA. Featuring the highest density of logic elements in its family, up to 8 GB of DDR4 SDRAM in four independent channels, and numerous options for high-bandwidth I/O, this mezzanine card is a powerful, yet cost-effective, solution for…
Read MoreJanuary 30th, 2019 — News
X-ES announces the XPedite7683, a 3U VPX SBC based on the Intel® Xeon® D-1500 family of processors. In addition to its 12 Xeon®-class processing cores and XMC expansion site, the XPedite7683 includes 32 GB of single-die DDR4 memory with ECC, rated by the manufacturer to operate at temperatures down to -40°C. Compared to competitive 3U VPX…
Read MoreDecember 17th, 2018 — News
To accommodate current and future growth, Extreme Engineering Solutions (X-ES) has moved to a new corporate headquarters in Verona, WI. Completed in September of 2018, the combined office and manufacturing space is located at 9901 Silicon Prairie Parkway, approximately six miles from the company’s previous headquarters in Middleton, WI. The new 125,000 sq. ft. facility…
Read MoreNovember 14th, 2018 — News
Revolutionary performance in a Small Form Factor enclosure – XPand6215 is latest 3U VPX embedded system from X-ES and it sets a new standard for high-bandwidth data acquisition and signal processing in harsh environments. With multiple high-speed optical links, an Intel® Xeon® D-1500 processor, and an AMD (formerly Xilinx) Kintex® UltraScale™ FPGA, the XPand6215 offers uncompromising…
Read MoreSeptember 26th, 2018 — News
Since unveiling our first single board computers (SBCs) based on the Intel® Xeon® D family of processors in 2015, X-ES has developed an industry-leading portfolio of embedded, high-reliability Intel® Xeon® D processor-based products in several industry-standard form factors. Supporting features like native 10 Gigabit Ethernet, high core-count SKUs, extended temperature tolerances, and a scalable, pin-compatible design, X-ES Intel®…
Read MoreSeptember 17th, 2018 — Events
X-ES will be exhibiting October 9-10, 2018 at the 2018 Intel Federal Summit, taking place at the MGM National Harbor Hotel located in Oxen Hill, MD
Read MoreSeptember 17th, 2018 — Events
X-ES will be exhibiting October 8-10, 2018 in booth #8205 (in Hall D/E) at the 2018 AUSA Annual Meeting and Exposition, taking place at the Walter E. Washington Convention Center located in Washington, D.C.
Read MoreJuly 25th, 2018 — News
X-ES announces the integration of our secure-by-design XPedite7674 board with the LynxSecure Safety Bundle (LSB) from Lynx Software Technologies. The integration delivers an ideal platform for 2nd generation IMA development. LSB is an open system architecture solution that unlocks the potential of multi-core processors such as the Intel® Xeon® D onboard X-ES’ XPedite7674 3U VPX…
Read MoreJuly 5th, 2018 — Events
X-ES will be exhibiting August 7-9 in booth #629 at the Space & Missile Defense Symposium 2018, taking place at the Von Braun Center in Huntsville, AL.
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