3U VPX SINGLE BOARD COMPUTER · SKU 90074565
XPedite7771
The XPedite7771 is a secure, high-performance single board computer based on the Intel® Xeon® D-1700 series (formerly Ice Lake-D) of processors and features an integrated SecureCOTS™ technology with a Microchip PolarFire™ System-on-Chip (SoC) FPGA, making it an optimal choice for computationally heavy applications requiring maximum data and information protection.
Product Lifecycle
X-ES also offers comprehensive configuration and obsolescence management services, providing customers with direct control over non-interchangeable changes and extending product availability and serviceability well beyond standard end-of-life milestones.
Engineered for Extended Reliability
All X-ES products are designed and manufactured 100% in the USA with components from trusted supply chains in order to deliver rugged, reliable performance in the most demanding environments.
Built with components rated for extreme conditions and validated through rigorous testing, our solutions minimize obsolescence risk and lower total cost of ownership across the full program lifespan.
Introduction to XPedite7771
The XPedite7771 is a secure, high-performance single board computer based on the Intel® Xeon® D-1700 series (formerly Ice Lake-D) of processors, making it an optimal choice for computationally heavy applications requiring maximum data and information protection.
Security & Data Protection
This 3U VPX-REDI module integrates SecureCOTS™ technology with a Microchip PolarFire™ System-on-Chip (SoC) FPGA for hosting custom functions to protect data from being modified or observed and provides an ideal solution when stringent security capabilities are required.
Ethernet Connectivity
The XPedite7771 provides incredible speed with two 100GBASE-KR4 and one 10/100/1000BASE-T Ethernet ports. The dual 100GBASE-KR4 Ethernet ports offer fallback redundancy to help ensure a consistent processor throughput of up to 100 Gbps is available at all times.
Processor Memory & Additional I/O
The XPedite7771 also accommodates up to 48 GB of DDR4 ECC SDRAM in three channels and up to 256 GB of onboard NAND flash in addition to numerous I/O ports, including USB 2.0, PCI Express, and RS-232/422/485 serial through the backplane connectors.
Expansion Capabilities
An integrated XMC site provides additional expansion capabilities, including a x8 PCI Express connection to the Intel® Xeon® D processor.
Software Support
Wind River VxWorks, X-ES Enterprise Linux (XEL), and Linux Yocto Board Support Packages (BSPs) are available.
Processor
- Intel® Xeon® D-1700 series (formerly Ice Lake-D) processor
- Up to 10 Xeon®-class cores in a single, power-efficient SoC package
- SKUs available with native extended temperature support
Memory
- 48 GB of DDR4 ECC SDRAM in three channels
- Up to 256 GB of NAND flash
- 64 MB NOR boot flash
- 64 kB EEPROM
Security and Management
- Microchip PolarFire™ SoC FPGA with 256 MB SPI flash
- Designed with SecureCOTS™ technology to support enhanced security and trusted computing
- System voltage monitor, power-on/reset control, non-volatile write-protection control
- Trusted Platform Module (TPM)
VPX (VITA 46) P0 I/O
- Two IPMB connections to an IPMI Controller
VPX (VITA 46) P1 I/O
- Dual 100GBASE-KR4 Ethernet ports (up to 100 Gbps aggregate processor throughput) to P1.A and P1.B
- One x4 PCI Express Gen3-capable interface to P1.C
VPX (VITA 46) P2 I/O
- One 10/100/1000BASE-T Ethernet port
- Three x4 PCI Express Gen3-capable interfaces
- Two USB 2.0 ports
- Two RS-232/422/485 serial ports
- Four single-ended FPGA GPIOs
Software Support
- RDMA over Converged Ethernet (RoCE) v2 internet layer protocol support
- UEFI firmware
- Wind River VxWorks BSP
- X-ES Enterprise Linux (XEL) BSP
- Linux Yocto BSP
- Contact factory for availability of Microsoft Windows drivers and other operating systems
XMC Site
- One x8 PCI Express Gen2-capable interface
Physical Characteristics
- 3U VPX-REDI conduction- or air-cooled form factor
- Dimensions: 100 mm x 160 mm
- 0.8 in. pitch without solder-side cover
- 1.0 in. pitch with Two-Level Maintenance (2LM) support
Environmental Requirements
Contact factory for appropriate board configuration based on environmental requirements
- Supported ruggedization levels (see the X-ES Ruggedization Chart): 5
- Conformal coating available as an ordering option
- Thermal performance will vary based on CPU frequency and application
- Contact X-ES for air-cooled development options
Power Requirements
- Power will vary based on configuration and usage. Please consult factory.
Accessories
- XIt1098 (90030650) – 3U VPX Rear Transition Module with Dual 40 Gigabit and 10 Gigabit Ethernet, USB, and Serial
- XPand1007 (90075300) – Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O
- XPand1205 (90075035) – 3U VPX Development Platform for Up to Eight Conduction-Cooled Modules
- XTend230 (90072690) – Debug Module for Programming and Diagnostic Interfaces
XPedite7771
Intel® Xeon® D-1700 Processor-Based 3U VPX-REDI Module with 48 GB of DDR4, 100 Gigabit Ethernet, and SecureCOTS™
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Datasheet
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Technical Documentation
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