VPX DEVELOPMENT SYSTEM · SKU 90075300
XPand1007
The XPand1007 system is a development platform for conduction-cooled 3U VPX cards. It supports up to two 0.8 in. or 1.0 in. 3U VPX boards and utilizes Rear Transition Modules to simplify I/O access and support rapid system prototyping.
Product Lifecycle
X-ES also offers comprehensive configuration and obsolescence management services, providing customers with direct control over non-interchangeable changes and extending product availability and serviceability well beyond standard end-of-life milestones.
Engineered for Extended Reliability
All X-ES products are designed and manufactured 100% in the USA with components from trusted supply chains in order to deliver rugged, reliable performance in the most demanding environments.
Built with components rated for extreme conditions and validated through rigorous testing, our solutions minimize obsolescence risk and lower total cost of ownership across the full program lifespan.
XPand1007 Platform Overview
The XPand1007 system is a development platform for conduction-cooled 3U VPX cards. It supports up to two 0.8 in. or 1.0 in. 3U VPX boards and utilizes RTMs to simplify I/O access and support rapid system prototyping.
The XPand1007 can be configured with multiple backplane options.
System Status & Configuration
Power and reset LEDs are provided for system status.
Switches allow configuration for the included VITA 62 power supply, as well as reset and other I/O signals.
Power Supply
An included external XPm9001 power supply plugs into a standard 120 V wall outlet to produce 24 V DC to power an included VITA 62 supply.
The VITA 62 power supply provides the DC power rails to the backplane for the VPX modules.
Thermal Management
The XPand1007 routes heat from the conduction-cooled modules to sidewall heat exchangers, where it is quietly dissipated to the ambient environment by forced-air cooling.
Configuration Options
The XPand1007 is currently available for purchase in several rapid-development standard configurations, including configurations aligned to Sensor Open System Architecture (SOSA) profiles.
Custom configurations of modules, RTMs, and backplanes are also available utilizing X-ES and third-party components.
VPX Slot Features
- Two 3U VPX-REDI (VITA 48.2) 0.8 in. or 1.0 in. pitch slots
- Two 3U VPX (VITA 46.10) RTM slots
- One 3U VPX VITA 62 power supply slot
- Configurable I/O (NVMRO, geographical addresses, SYSCON) via DIP switches
- VBAT supplied by VITA 62 supply, battery, or external power source
Power
- Included 120 V AC to 24 V DC XPm9001 power supply
Physical Characteristics
- Dimensions: 11.9 in. (L) x 5.6 in. (W) x 9.3 in. (H)
- 10 lbs. with backplane
Backplane Options
- XTend4933: Dual Fat Pipe (DFP) interconnects on J1
- XTend4945: I/O slot isolation with full I/O pass-through to RTM slots
- XTend4947: SOSA Payload / Compute Intensive profile SLT3-PAY-1F1U1S1S1U1U4F1J-14.6.13-n expansion plane routed between slots with other I/O passed through to RTM. Modules targeting SLT3-PAY-1F1U1S1S1U1U2F1H-14.6.11-n are compatible if no aperture is present on payload card. (Additional build options available to accommodate apertures; contact factory for more information.)
- Aperture access unavailable on backplanes targeting slot profiles with aperture support
Accessories
- XPm9001 (90071735) – Power Supply for XPand1007
XPand1007
Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O
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Datasheet
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Technical Documentation
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