XPedite7750

Intel® Xeon® D-1700 Processor-Based Rugged COM Express® Basic (Type 7) Module with Quad 10 Gigabit Ethernet

The XPedite7750 is an enhanced, Type 7 COM Express® module based on the Intel® Xeon® D-1700 series (formerly Ice Lake-D) of processors.

It accommodates up to 32 GB of DDR4-2133 ECC SDRAM in two channels to support memory-intensive applications.

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XPedite7750 COM Express (Type 7) Mezzanine Module

The XPedite7750 is an enhanced, Type 7 COM Express® module based on the Intel® Xeon® D-1700 series (formerly Ice Lake-D) of processors. COM Express® provides a standards-based form factor to bring PC processing to a wide range of applications. The XPedite7750 is ideal for the high-bandwidth and processing-intensive requirements of today’s commercial, industrial, and military applications. The small footprint and standards-based form factor make the XPedite7750 perfect for portable and rugged environments, while providing an upgrade path for the future.

The XPedite7750 accommodates up to 32 GB of DDR4 ECC SDRAM in two channels to support memory-intensive applications. The XPedite7750 also hosts numerous I/O ports and interfaces, including 10 Gigabit Ethernet, Gigabit Ethernet, PCI Express, USB 3.0, and LVTTL serial.

Wind River VxWorks and X-ES Enterprise Linux Support Packages (XEL) are available.

Features

  • Supports Intel® Xeon® D-1700 series (formerly Ice Lake-D) processors
  • Up to 10 Xeon®-class cores in a single, power-efficient SoC package
  • SKUs available with native extended temperature support
  • Standard COM Express® Basic form factor with ruggedization enhancements
  • COM Express® enhanced Type 7 pinout
  • Up to 32 GB of DDR4 ECC SDRAM in two channels
  • 16 lanes of PCIe Gen3, available as one x16 PCIe interface
  • 16 lanes of PCIe Gen2, available as two x8 PCIe interfaces
  • Four 10GBASE-KR Ethernet ports (can be configured as one 40GBASE-KR4 Ethernet port)
  • One 10/100/1000BASE-T Ethernet port
  • Four USB 3.0 ports
  • Two LVTTL serial ports
  • Wind River VxWorks BSP
  • coreboot firmware powered by Intel® FSP
  • Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs, as well as Microsoft Windows drivers

Technical Specs

Processor

  • Intel® Xeon® D-1700 series (formerly Ice Lake-D) processors
  • Up to 10 Xeon®-class cores in a single, power-efficient SoC package
  • SKUs available with native extended temperature support

Memory

  • Up to 32 GB of DDR4 ECC SDRAM in two channels
  • Up to 32 GB of SLC NAND flash
  • 32 MB NOR boot flash
  • 64 kB EEPROM

COM Express®

  • Basic form factor (95 mm x 125 mm)
  • Enhanced Type 7 pinout
  • Adds non-volatile write protect
  • Adds two external interrupts
  • Adds boot flash select

Additional Features

  • Non-volatile memory write protection
  • Trusted Platform Module (TPM)

Ruggedization and Reliability

  • Class III PCB fabrication and assembly
  • Soldered DDR4 ECC SDRAM
  • Tin whisker mitigation
  • Designed and tested for extended solder joint reliability
  • Additional mounting holes for rugged and conduction-cooled environments
  • BIT support

Interface

  • Four USB 3.0 ports
  • Four 10GBASE-KR Ethernet ports with optional management sideband signals (availability dependent on firmware and drivers); can be configured as one 40GBASE-KR4 Ethernet port
  • One 10/100/1000BASE-T Ethernet port
  • One x16 PCI Express Gen3-capable interface
  • Two x8 PCI Express Gen2-capable interfaces
  • Two LVTTL serial ports
  • Four GPI and four GPO pins

Software Support

  • Wind River VxWorks BSP
  • X-ES Enterprise Linux (XEL) BSP
  • Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs, as well as Microsoft Windows drivers

Physical Characteristics

  • COM Express® Basic (Type 7) form factor
  • Dimensions: 95 mm x 125 mm

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements.

  • Supported ruggedization levels (see the X-ES Ruggedization Chart): 5
  • Conformal coating available as an ordering option
  • Contact X-ES for air-cooled development options

Power Requirements

  • Power will vary based on configuration and usage. Please consult factory.

Accessories

Documentation

Datasheet

To view all of the information about this product in a PDF, please download the datasheet.

Download Datasheet

Technical Documents

SupportNet is your source for product manuals, technical support, and software downloads.

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Block Diagram

Additional Information

Intel® Xeon® D Overview

Learn more about the Intel® Xeon® D family of processors

Learn More

Press Release
 

View the Ice Lake-D press release
 

View Press Release

Datasheet
 

View the XPedite7750
Datasheet PDF
 

Download Datasheet

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