XPedite2300

Virtex-6 FPGA-Based Conduction- or Air-Cooled XMC Module

The XPedite2300 is a high-performance reconfigurable conduction- or air-cooled XMC module based on the Xilinx Virtex-6 family of FPGAs. With a x8 PCI Express interface, external memory, and high-density I/O, the XPedite2300 is ideal for customizable, high-bandwidth, data-processing applications.

End of Life

Please see the recommended replacement product, the XPedite2400 XMC FPGA module.

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SKU: 90010190 Category:
XPedite2300 XMC FPGA Module

The XPedite2300 is a high-performance reconfigurable conduction- or air-cooled XMC module based on the Xilinx Virtex-6 family of FPGAs. With a x8 PCI Express interface, external memory, and high-density I/O, the XPedite2300 is ideal for customizable, high-bandwidth, data-processing applications.

The XPedite2300’s DDR3 SDRAM and flexible I/O routing makes it perfect for high-speed, bandwidth-intensive applications. The card provides numerous I/O capabilities through its 180- and 40-pin daughter card headers which provide access to single-ended and differential I/O and configurable GTX transceivers. X-ES offers daughter card modules for high-performance A/D, D/A, high-density I/O, and custom I/O solutions.

Features

  • Xilinx Virtex-6 FPGA LX130T, LX195T, LX240T, LX365T, SX315T, or SX475T
  • Conduction- or air-cooled XMC module
  • Up to 1 GB of DDR3 SDRAM in two channels
  • Volatile and non-volatile FPGA configuration flash
  • 80 MB of user NOR flash
  • 180-pin, high-density daughter card header for expandable I/O
  • 40-pin daughter card header for high speed serial
  • Front and rear panel I/O support
  • x8 PCI Express XMC interface
  • Super cap backup for configuration bit stream encryption key (optional)
  • I²C RTC with super cap backup
  • Configuration via PCIe, flash, and JTAG with multi-boot support
  • Linux BSP
  • Wind River VxWorks BSP

Technical Specs

FPGA

  • Xilinx LXT or SXT Virtex-6 for high performance logic and DSP applications

Memory

  • Up to 1 GB of DDR3 SDRAM in two channels
  • 80 MB user NOR flash
  • 384 MB FPGA configuration flash
  • 128 MB volatile configuration PSRAM

XMC Interface

  • x8 PCI Express port
  • Program FPGA and configuration flash via PCIe
  • Four GPIO via I²C expander

P14 User I/O

  • 44 FPGA LVTTL/LVDS user I/O

P16 I/O

  • Four GPIO via I²C expander
  • x4 GTX transceivers

Front I/O

  • Up to 150 LVTTL/LVDS and x8 GTX transceivers

Software

  • Linux BSP
  • Wind River VxWorks BSP
  • Reference designs in VHDL

Physical Characteristics

  • XMC conduction- or air-cooled form factor
  • Dimensions: 149 mm x 74 mm, 10 mm stacking height
  • 12 mm stacking height option

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements.

  • Supported ruggedization levels (see the X-ES Ruggedization Chart): 1, 3, 5
  • Conformal coating available as an ordering option

Power Requirements

  • Power will vary based on configuration and usage. Please consult factory.

Accessories

Please contact X-ES Sales at sales@xes-inc.com or by phone at +1-608-833-1155 for information on this product's accessories.

Documentation

Datasheet

To view all of the information about this product in a PDF, please download the datasheet.

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Technical Documents

SupportNet is your source for product manuals, technical support, and software downloads.

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Block Diagram

Additional Information

Replacement Product

Please see the recommended replacement product, the XPedite2400

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Board Support

FPGA Development Kit (FDK) Overview
 

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Datasheet

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Datasheet PDF
 

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XMC FPGAs

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