XPedite2300

The XPedite2300 is a high-performance reconfigurable conduction- or air-cooled XMC module based on the AMD (formerly Xilinx) Virtex-6 family of FPGAs. With a x8 PCI Express interface, external memory, and high-density I/O, the XPedite2300 is ideal for customizable, high-bandwidth, data-processing applications.

The XPedite2300’s DDR3 SDRAM and flexible I/O routing makes it perfect for high-speed, bandwidth-intensive applications. The card provides numerous I/O capabilities through its 180- and 40-pin daughter card headers which provide access to single-ended and differential I/O and configurable GTX transceivers. X-ES offers daughter card modules for high-performance A/D, D/A, high-density I/O, and custom I/O solutions.

Features

• AMD (formerly Xilinx) Virtex-6 FPGA LX130T, LX195T, LX240T, LX365T, SX315T, or SX475T
• Conduction- or air-cooled XMC module
• Up to 1 GB of DDR3 SDRAM in two channels
• Volatile and non-volatile FPGA configuration flash
• 80 MB of user NOR flash
• 180-pin, high-density daughter card header for expandable I/O
• 40-pin daughter card header for high speed serial
• Front and rear panel I/O support
• x8 PCI Express XMC interface
• Super cap backup for configuration bit stream encryption key (optional)
• I²C RTC with super cap backup
• Configuration via PCIe, flash, and JTAG with multi-boot support
• Linux BSP
• Wind River VxWorks BSP

Technical Specs

FPGA

• AMD (formerly Xilinx) LXT or SXT Virtex-6 for high performance logic and DSP applications

Memory

• Up to 1 GB of DDR3 SDRAM in two channels
• 80 MB user NOR flash
• 384 MB FPGA configuration flash
• 128 MB volatile configuration PSRAM

XMC Interface

• x8 PCI Express port
• Program FPGA and configuration flash via PCIe
• Four GPIO via I²C expander

P14 User I/O

• 44 FPGA LVTTL/LVDS user I/O

P16 I/O

• Four GPIO via I²C expander
• x4 GTX transceivers

Front I/O

• Up to 150 LVTTL/LVDS and x8 GTX transceivers

Software

• Linux BSP
• Wind River VxWorks BSP
• Reference designs in VHDL

Physical Characteristics

• XMC conduction- or air-cooled form factor
• Dimensions: 149 mm x 74 mm, 10 mm stacking height
• 12 mm stacking height option

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements.

• Supported ruggedization levels (see the X-ES Ruggedization Chart): 1, 3, 5
• Conformal coating available as an ordering option

Power Requirements

• Power will vary based on configuration and usage. Please consult factory.

Accessories

Documentation

Datasheet

To view all of the information about this product in a PDF, please download the datasheet.

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Technical Documents

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