XPedite7040

Intel® Core™ Duo or Intel® Core™2 Duo Processor-Based AMC Single Board Computer (SBC)

The XPedite7040 is a single-width, mid-size or full-size Advanced Mezzanine Card (AMC) single board computer designed to provide maximum performance and I/O options while minimizing power consumption.

End of Life

Please see recommended replacement product, the XPedite7501 XMC Module.

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SKU: 90015045 Category:
XPedite7040 Processor-Based AMC Module

The XPedite7040 is a single-width, mid-size or full-size Advanced Mezzanine Card (AMC) single board computer designed to provide maximum performance and I/O options while minimizing power consumption. The Ultra Low Voltage (ULV) Intel® Core™ Duo processor or Low Voltage (LV) Intel® Core™2 Duo processor provides the XPedite7040 with a significant performance-per-watt processing advantage. Additionally, the Intel® 3100 chipset combines the functionality of an integrated server-class memory controller (Northbridge) and an I/O controller (Southbridge) into a single device that is specifically intended for power- and board-space-sensitive embedded applications.

The XPedite7040 can be installed in an AdvancedTCA (ATCA) AMC.0-compliant carrier or a MicroTCA.0 (µTCA)-compliant backplane. The XPedite7040 supports an AMC.1 x4 PCI Express interface, dual AMC.2 Gigabit Ethernet 1000BASE-BX interfaces, and dual AMC.3 SATA interfaces. Additional serial and GPIO is provided through the backplane connector.

The XPedite7040 supports two PC3200 SO-RDIMM modules and 4 GB of NAND flash for ample on-card memory capacity. Up to 4 MB of Firmware Hub (FWH) flash is also supported for redundant BIOS or OS kernel storage.

Features

  • Intel® Core™ Duo or Intel® Core™2 Duo processor at up to 1.5 GHz
  • Intel® 3100 chipset
  • Front panel Gigabit Ethernet port
  • Front panel RS-232 serial port
  • Front panel USB 2.0 port
  • Complies with AMC.0 and MicroTCA.0 (µTCA)
  • AMC.1 x4 PCI Express interface
  • AMC.2 dual Gigabit Ethernet 1000BASE-BX interfaces
  • AMC.3 dual SATA interfaces
  • Two PC3200 SO-RDIMMs, up to 8 GB
  • 4 GB of NAND flash
  • Up to 4 MB of Firmware Hub (FWH) storage
  • AMI BIOS
  • Linux BSP
  • Wind River VxWorks BSP
  • QNX Neutrino BSP
  • Green Hills INTEGRITY BSP
  • Microsoft Windows drivers

Technical Specs

Processor

  • Intel® Core™ Duo or Intel® Core™2 Duo processor
  • Up to 1.5 GHz
  • Up to 4 MB L2 cache
  • Up to 166 MHz (667 MT/s) FSB

Memory and I/O Controller Hub

  • Intel® 3100
  • DDR2-400 ECC SDRAM
  • 4 GB of NAND flash
  • Up to 4 MB of Firmware Hub (FWH) storage

AMC Backplane Interconnect

  • Complies with AMC.0 and MicroTCA.0 (µTCA)
  • AMC.1 x4 PCI Express interface
  • AMC.2 dual Gigabit Ethernet 1000BASE-BX interfaces
  • AMC.3 dual SATA interfaces
  • Dual USB 2.0 interfaces
  • RS-232/422 serial interface

Front Panel I/O

  • Micro-DB-9, RS-232 serial port
  • USB 2.0 port
  • Gigabit Ethernet port

Software

  • AMI BIOS
  • Linux BSP
  • Wind River VxWorks BSP
  • QNX Neutrino BSP
  • Green Hills INTEGRITY BSP
  • Microsoft Windows drivers

Physical Characteristics

  • Single-width, mid-size, or full-size AMC
  • Dimensions: 180.6 mm x 73.5 mm

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements.

  • Supported ruggedization levels (see the X-ES Ruggedization Chart): 1
  • Conformal coating available as an ordering option

Power Requirements

Tested at 25°C ambient with 2 GB DDR2 and 1.2 GHz CPU

  • Less than 30 W

Accessories

Please contact X-ES Sales at sales@xes-inc.com or by phone at +1 (608) 833-1155 for information on this product's accessories.

Documentation

Datasheet

To view all of the information about this product in a PDF, please download the datasheet.

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Technical Documents

SupportNet is your source for product manuals, technical support, and software downloads.

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Block Diagram

Additional Information

Replacement Product

View the recommended replacement product, XPedite7501

View Product

Datasheet

View the XPedite7040
Datasheet PDF
 

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