XPand6000

The XPand6000 natural convection-cooled, fully-ruggedized ATR chassis is designed to meet the rigorous standards of MIL-STD-810 while integrating the latest power-saving, performance-enhancing, and space efficient off-the-shelf rugged technology. In today's avionics and ruggedized environments, size really does matter, and the XPand6000 sets a new standard for rugged small form factor computing systems.

The XPand6000 supports an internal carrier card that can be populated with a high-performance ruggedized COM Express module designed and manufactured by X-ES or a third party. The XPand6000 carrier card supports a PMC or XMC module, an SSD, and can also be customized to support application specific circuitry such as additional I/O or an FPGA. X-ES has an extensive lineup of PMC or XMC solutions to fulfill your data-processing and I/O requirements. Additionally, X-ES provides integration services for third-party ruggedized COM Express or PMC/XMC modules.

An optional 1.8 in. or Slim SATA SSD memory module (with optional integrated encryption) provides the convenience of high capacity off the shelf storage, the ruggedness of solid-state non-volatile memory, and the security of 256-bit AES encryption. X-ES maximizes power supply performance per cubic inch, supporting an integrated MIL-STD-704 28V DC power supply and MIL-STD-461 EMI filtering. Internal hold-up can be provided, as well.

Please contact X-ES sales to begin designing a system that will meet or exceed your I/O, processing, and power requirements.

• Natural convection-cooled small form factor ATR chassis
• Physical dimensions of 2.36 in. (W), 4.88 in. (H), 7.10 in. (L)
• Supports a single ruggedized COM Express module
• Supports a single conduction-cooled PMC or XMC module
• Integration services with third-party modules available
• Optional 1.8 in. or Slim SATA SSD memory module
• Integrated MIL-STD-704 28V DC power supply
• Integrated MIL-STD-461 E/F EMI filtering
• Optional internal holdup
• Environmentally sealed
• D38999 connector support
• Configurable front panel I/O connectors
• Configurable I/O options
• Customizable internal carrier card for application specific circuitry
• Back panel power connector

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Physical Characteristics

• 2.36 in. (W), 4.88 in. (H), 7.10 in. (L)
• Weighs less than 4 pounds (fully populated)

Configuration Options

• Supports a single ruggedized COM Express module
• Supports a single conduction-cooled PMC or XMC module
• Customized carrier card solutions available for application specific circuitry
• 1.8 in. SSD module with optional integrated encryption

Front Panel I/O Options

• Up to two D38999 circular connectors for I/O
• Customizable connector options
• DVI graphics interfaces
• USB 2.0- and 1.0-compliant interfaces
• 10/100/1000BASE-T Gigabit Ethernet interfaces
• RS-232/RS-422 serial links
• MIL-STD-1553
• ARINC-429
• Custom I/O via XMC or PMC modules
• Custom I/O via carrier card

Power Supply Options

• Integrated power supply
• MIL-STD-704 28V DC input voltage support (default)
• MIL-STD-461 EMI filtering
• Integrated internal hold-up (optional)
• Additional power supply options available

Thermal

• 55°C ambient with 40 W Rugged COM Express Card