3rd Generation Intel® Core™ i7 Processor Technology

3rd Gen Intel® Core™ i7

Designed for Rugged, Secure Performance

X-ES 3rd Gen Intel® Core™ i7 (formerly Ivy Bridge) processor boards bring unrivaled processing performance, in even the most rugged environments and applications.

Including features like PCI Express Fat Pipe P1 interconnects, Gigabit Ethernet, integrated dual-redundant MIL-STD-1553B interface, and CAN bus channels, X-ES Intel® Core™ i7 boards are able to maximize native I/O while minimizing SWaP and cost concerns.

Scalable, Expandable, and Customizable Solutions

X-ES 3rd Gen Intel® Core™ i7 (formerly Ivy Bridge) processor boards provide numerous I/O interfaces through the backplane connectors, including Gigabit Ethernet ports, USB 2.0 ports, SATA, graphics, and RS-232/422/485 serial ports, and are able to support additional expansion from an integrated XMC/PMC site.

Based on industry-standard form factors, such as VPX, COM Express®, and CompactPCI, X-ES Intel® Core™ i7 boards provide a dependable framework for any embedded system, along with X-ES’ comprehensive obsolescence and life cycle management services.

Featured 3rd Gen Intel® Core™ i7 Products

XPedite7479 3U VPX-REDI SBC


3rd Gen Intel® Core™ i7 Processor-Based 3U VPX SBC with Full XMC J16 I/O Routing

XPedite7472 3U VPX-REDI SBC


3U VPX-REDI high-performance, secure SBC that features integrated SecureCOTS technology.

XPedite7450 COM Express® Mezzanine Module


Enhanced, Type 6 COM Express® module with up to 16 GB DDR3 ECC SDRAM.

XCalibur4440 6U VPX SBC


6U VPX, multiprocessing single board computer ideally suited for Small Form Factor systems.

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