The XPedite2600 is a configurable, high-performance, conduction- or air-cooled XMC module based on the AMD (formerly Xilinx) Zynq® UltraScale+™ family of MPSoC devices. These devices provide specialized processing elements ideal for next-generation wired and 5G wireless infrastructure, cloud computing, and aerospace and defense applications. The Zynq® UltraScale+™ XCZU11EG MPSoC combines a quad-core ARM® Cortex™-A53 platform with dual-core Cortex™-R5 real-time processors, a Mali™-400 MP2 graphics processing unit, and 16 nm FinFET+ programmable logic.
The XPedite2600 is capable of interfacing to and processing streaming data from a wide variety of inputs. It provides four High-Speed Serial interfaces from the FPGA and four High-Speed Serial interfaces from the Zynq® processor subsystem, the latter featuring integrated support for multiple protocols such as SATA, Gigabit Ethernet, USB 3.0, and DisplayPort. Other interfaces on the P16 connector include Gigabit Ethernet, USB 2.0, serial, and LVDS I/O. Additional LVDS I/O is available via an optional P14 connector.
The X-ES FPGA Development Kit (FDK) is provided to jump-start application development with a full suite of IP blocks, HDL, test benches, Linux drivers, and complete example designs for the XPedite2600.
Technical Specs
MPSoC
- AMD (formerly Xilinx) Zynq® UltraScale+™ MPSoC XCZU11EG
- Quad-core ARM® Cortex™-A53 platform running at up to 1.5 GHz
- Dual-core ARM® Cortex™-R5 real-time processors
- ARM® Mali™-400 MP2 graphics processing unit
- 16 nm FinFET+ programmable logic
Memory
- Up to 16 GB of DDR4 ECC SDRAM in two 64-bit channels
- 64 GB of Micron EMMC flash
- Dual-QSPI FPGA configuration flash
XMC Site
- x8 PCI Express Gen3 interface
P14 User I/O (Optional)
P15 I/O
- x8 PCI Express Gen3 interface compliant with VITA 42.3
P16 I/O
- Four PL MGT High-Speed Serial ports from FPGA
- Four PS GTR High-Speed Serial ports from Zynq® processor subsystem with integrated support for multiple protocols
- Two 1000BASE-X Ethernet ports or one 10/100/1000BASE-T Ethernet port
- One I²C port
- Two RS-232/422/485 serial ports
- Two USB 2.0 interfaces
- Nine LVDS user I/O to FPGA
Development Support
- X-ES FPGA Development Kit (FDK)
- Linux drivers
Physical Characteristics
- Conduction- or air-cooled XMC form factor
- Dimensions: 149 mm x 74 mm
Environmental Requirements
Contact factory for appropriate board configuration based on environmental requirements.
- Supported ruggedization levels (see the X-ES Ruggedization Chart): 5
- Conformal coating available as an ordering option
- Contact X-ES for air-cooled development options
Power Requirements
- Power will vary based on configuration and usage. Please consult factory.
Documentation
Datasheet
To view all of the information about this product in a PDF, please download the datasheet.
Download Datasheet
Technical Documents
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