3U VPX FPGA MODULE · SKU 90030570
XPedite2570
The XPedite2570 is a high-performance, reconfigurable, conduction- or air-cooled, 3U VPX, FPGA processing module based on the AMD (formerly Xilinx) Kintex™ UltraScale™ family of FPGAs.
With multiple high-speed fabric interfaces, x8 PCI Express Gen3, 12 high-speed fiber-optic transceivers, and 8 GB of DDR4 SDRAM in two channels, the XPedite2570 is ideal for customizable, high-bandwidth, signal-processing applications.
Product Lifecycle
X-ES also offers comprehensive configuration and obsolescence management services, providing customers with direct control over non-interchangeable changes and extending product availability and serviceability well beyond standard end-of-life milestones.
Engineered for Extended Reliability
All X-ES products are designed and manufactured 100% in the USA with components from trusted supply chains in order to deliver rugged, reliable performance in the most demanding environments.
Built with components rated for extreme conditions and validated through rigorous testing, our solutions minimize obsolescence risk and lower total cost of ownership across the full program lifespan.
Introduction to XPedite2570
The XPedite2570 is a high-performance, reconfigurable, conduction- or air-cooled, 3U VPX, FPGA processing module based on the AMD (formerly Xilinx) Kintex™ UltraScale™ family of FPGAs.
With multiple high-speed fabric interfaces, x8 PCI Express Gen3, and 12 high-speed fiber-optic transceivers, the XPedite2570 is ideal for customizable, high-bandwidth, signal-processing applications.
High-Bandwith Processing
The XPedite2570 is a reconfigurable FPGA resource designed to meet the demands of high-bandwidth applications such as packet processing, signal processing, and DSP-intensive applications.
It features 12 rugged, protocol-independent fiber optic transceivers operating at up to 10.3125 Gb/s, along with 8 GB of DDR4 ECC SDRAM in two independent channels capable of up to 38 GB/s aggregate bandwidth.
Backplane I/O Options
The XPedite2570 has several options for high-performance backplane I/O, including a x8 Gen3 PCI Express interface, dual GTH transceivers with a maximum data rate of 16.375 Gb/s, and up to 44 LVDS transceivers for user I/O.
Fiber-Optic Transceivers
The XPedite2570 incorporates 12 high-data-rate, protocol-independent fiber-optic receivers. The fiber-optic receivers utilize 50/125 μm multi-mode fiber with MT connectors, which can easily be connected to the backplane (VITA 66).
The fiber-optic receivers are qualified over the full -40°C to +85°C industrial temperature range for reliable performance in extreme environments.
Programmable FPGA Resource
The XPedite2570 is designed to be a user-programmable FPGA resource, using the powerful AMD Kintex™ UltraScale™ XCKU115 FPGA to support high-performance signal processing, sensor I/O, data acquisition, data recording, and linking systems in a range of protocols.
Development Support
The XPedite2570 provides a high-performance, feature-rich solution capable of interfacing to and processing streaming data from a wide variety of sensors. The X-ES FPGA Development Kit (FDK) is provided to support the requirements of high-performance, real-time, embedded, streaming-data applications and simplify FPGA development.
X-ES’ FDK includes IP blocks, HDL, test benches, Linux drivers, and complete example designs for the XPedite2570.
FPGA
- AMD (formerly Xilinx) Kintex™ UltraScale™ XCKU115 FPGA for high-performance logic and DSP applications
- 8 GB of DDR4 ECC SDRAM in two channels
- 1 GBit of configuration NOR Flash
Optical Interfaces
- 12-channel transmitter and receiver modules
- 14 Gb/s max line rate
- Socketed Samtec FireFly optics
- I²C register interfaces
- Industrial temperature range
VPX (VITA 46) P1 I/O
- One x8 PCI Express Gen3 interface to P1.A
- Two additional GTH-capable High-Speed Serial (HSS) lanes
- Twelve LVDS and two single-ended GPIO
VPX (VITA 46) P2 I/O
- Thirty-two LVDS and eight single-ended GPIO
Development Support
- X-ES FPGA Development Kit (FDK)
- Linux drivers
Physical Characteristics
- 3U VPX-REDI conduction- or air-cooled form factor
- Dimensions: 100 mm x 160 mm
- 0.8 in. pitch without solder-side cover
- 0.85 in. and 1.0 in. pitch with solder-side cover
Environmental Requirements
Contact factory for appropriate board configuration based on environmental requirements.
- Supported ruggedization levels (see the X-ES Ruggedization Chart): 3, 5
- Conformal coating available as an ordering option
Power Requirements
- Power will vary based on configuration and usage. Please consult factory.
Accessories
- XTend218 (90072500) – Debug Module/Cable for FPGA Cards
XPedite2570
3U VPX AMD (formerly Xilinx) Kintex™ UltraScale™ FPGA-Based Fiber-Optic I/O Module
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Datasheet
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Technical Documentation
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