The XPedite2770 is a high-performance, reconfigurable, conduction-cooled, 3U VPX processing module based on the AMD (formerly Xilinx) Versal® Prime Adaptive Compute Acceleration Platform (ACAP). With multiple high-speed fabric interfaces and 16 GB of LPDDR4 ECC SDRAM in two channels, the XPedite2770 is ideal for customizable, high-bandwidth, signal-processing applications. It integrates SecureCOTS™ technology with a Versal® Prime VM1402 ACAP for hosting custom functions to protect data from being modified or observed and provides an ideal solution when stringent security capabilities are required.
The XPedite2770 is a heterogeneous compute platform that delivers exceptional performance utilizing two ARM® Cortex®-A72 processor cores, two ARM® Cortex®-R5F real-time processor cores, a Network-on-Chip (NoC) interconnect, and a large FPGA fabric. These devices provide specialized processing elements designed to meet the demands of high-bandwidth applications such as packet processing, signal processing, sensor I/O, DSP-intensive applications, next-generation wired and 5G wireless infrastructure, cloud computing, and aerospace and defense applications.
Providing incredible speed with two x4 PCI Express interfaces and two 10/100/1000BASE-T Ethernet ports, the XPedite2770 accommodates up to 256 GB of onboard NAND flash in addition to numerous I/O ports, including LVDS, single-ended GPIO, and RS-232/422/485 serial through the backplane connectors. The XPedite2770 provides additional expansion capabilities by including an integrated XMC site. This XMC site includes a x8 PCI Express connection to the Versal® Prime ACAP and X12d I/O mapped directly to the VPX backplane connectors. Additional configurations can route x16s and x8d from the XMC site to the VPX backplane connectors.
The XPedite2770 offers a SOSA-aligned pinout compatible with backplane slot profile SLT3-PAY-1F1F2U1TU1T1U1T-14.2.16 and is designed with support for SOSA-aligned AMPS profile MODA3-16.2.15-1-F2C-(P3F)(P2F)(2E7-E3)(N-N-N-N-M3/M4/M5-N)<XA0>.
The XPedite2770 provides a high-performance, feature-rich solution capable of interfacing to and processing streaming data from a wide variety of sensors. The X-ES Hardware Manager Development Kit (HMDK) is provided to deliver a pre-validated environment for rapid application development, offering an optimized library of IP, design resources, and software components that can easily be used as the basis for custom designs. X-ES’ HMDK includes the Hardware Manager application, Arm Trusted Firmware (ATF), U-Boot bootloader, and the FPGA Development Kit (FDK), as well as Linux Yocto support and complete example designs for the XPedite2770.
