XPedite2770

AMD (formerly Xilinx) Versal® Prime VM1402 ACAP-Based 3U VPX FPGA Module with 16 GB of LPDDR4, PCIe Gen3, and SecureCOTS™

The XPedite2770 is a high-performance, reconfigurable, conduction-cooled, 3U VPX processing module based on the AMD (formerly Xilinx) Versal® Prime Adaptive Compute Acceleration Platform (ACAP).

With multiple high-speed fabric interfaces and 16 GB of LPDDR4 ECC SDRAM in two channels, the XPedite2770 is ideal for customizable, high-bandwidth, signal-processing applications. It integrates SecureCOTS™ technology with a Versal® Prime VM1402 ACAP for hosting custom functions to protect data from being modified or observed and provides an ideal solution when stringent security capabilities are required.

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SKU: 90075345 Categories: ,
XPedite2770 | 3U VPX FPGA

The XPedite2770 is a high-performance, reconfigurable, conduction-cooled, 3U VPX processing module based on the AMD (formerly Xilinx) Versal® Prime Adaptive Compute Acceleration Platform (ACAP). With multiple high-speed fabric interfaces and 16 GB of LPDDR4 ECC SDRAM in two channels, the XPedite2770 is ideal for customizable, high-bandwidth, signal-processing applications. It integrates SecureCOTS™ technology with a Versal® Prime VM1402 ACAP for hosting custom functions to protect data from being modified or observed and provides an ideal solution when stringent security capabilities are required.

The XPedite2770 is a heterogeneous compute platform that delivers exceptional performance utilizing two ARM® Cortex®-A72 processor cores, two ARM® Cortex®-R5F real-time processor cores, a Network-on-Chip (NoC) interconnect, and a large FPGA fabric. These devices provide specialized processing elements designed to meet the demands of high-bandwidth applications such as packet processing, signal processing, sensor I/O, DSP-intensive applications, next-generation wired and 5G wireless infrastructure, cloud computing, and aerospace and defense applications.

Providing incredible speed with two x4 and two x1 High-Speed Serial (HSS) 25 Gbps-capable interfaces, plus two 1000BASE-T Ethernet ports, the XPedite2770 accommodates up to 256 GB of onboard NAND flash in addition to numerous I/O ports, including LVDS, single-ended GPIO, and RS-232/422/485 serial through the backplane connectors. The XPedite2770 provides additional expansion capabilities by including an integrated XMC site, which includes one x8 HSS 16 Gbps-capable connection to the Versal® Prime ACAP and X12d I/O mapped directly to the VPX backplane connectors. Additional configurations can route x16s and x8d from the XMC site to the VPX backplane connectors.

The XPedite2770 offers a SOSA-aligned pinout compatible with backplane slot profile SLT3-PAY-1F1F2U1TU1T1U1T-14.2.16 and is designed with support for SOSA-aligned AMPS profile MODA3-16.2.15-1-F2C-(P3F)(P2F)(2E7-E3)(N-N-N-N-M3/M4/M5-N)<XA0>.

The XPedite2770 provides a high-performance, feature-rich solution capable of interfacing to and processing streaming data from a wide variety of sensors. The X-ES Hardware Manager Development Kit (HMDK) is provided to deliver a pre-validated environment for rapid application development, offering an optimized library of IP, design resources, and software components that can easily be used as the basis for custom designs. X-ES’ HMDK includes the Hardware Manager application, Arm Trusted Firmware (ATF), U-Boot bootloader, and the FPGA Development Kit (FDK), and complete example designs for the XPedite2770. Linux Yocto support is also available separately.

Features

  • AMD (formerly Xilinx) Versal® Prime VM1402 ACAP
  • 3U VPX (VITA 46) module
  • Compatible with multiple VITA 65 OpenVPX™ slot profiles and SOSA-aligned options
  • 16 GB of LPDDR4 ECC SDRAM in two channels
  • Option to reconfigure one channel as 16 GB non-ECC SDRAM for higher performance and capacity (24 GB total)
  • 4 Gbit of QSPI FPGA configuration flash
  • Up to 256 GB of NAND flash
  • XMC site with one x8 High-Speed Serial (HSS) 16 Gbps-capable interface to support PCI Express
  • Two x1 HSS 25 Gbps-capable interfaces to support 25 Gigabit Ethernet
  • Two x4 HSS 25 Gbps-capable interfaces to support Ethernet, CPM, PCI Express, etc.
  • Interfaces on P1.A and P1.B can be combined to function as one x8 CPM PCI Express interface
  • One x1 HSS 8 Gbps-capable capable interface to support storage for SOSA alignment
  • Two 1000BASE-T Ethernet ports
  • One RS-232/422/485 serial port
  • One UART/RS-232 maintenance port
  • 14 LVDS GPIO
  • 16 single-ended (SE) GPIO
  • SOSA-aligned pinout compatible with backplane slot profile SLT3-PAY-1F1F2U1TU1T1U1T-14.2.16
  • Designed with support for SOSA-aligned AMPS profile MODA3-16.2.15-1-F2C-(P3F)(P2F)(2E7-E3)(N-N-N-N-M3/M4/M5-N)<XA0>
  • Linux Yocto support
  • Hardware Manager Development Kit (HMDK)

Technical Specs

FPGA

  • AMD (formerly Xilinx) Versal® Prime VM1402 ACAP for high-performance logic and DSP applications
  • Dual-core ARM® Cortex®-A72, 48 KB/32 KB L1 cache with parity and ECC; 1 MB L2 cache with ECC
  • Dual-core ARM® Cortex®-R5F, 32 KB/32 KB L1 cache, and 256 KB TCM with ECC
  • One coherent PCI Express module (CPM) to support PCIe with acceleration features such as CCIX
  • Two integrated MRMAC blocks supporting 100 Gigabit-capable Ethernet functions
  • Two integrated PLPCIe Gen4 blocks supporting PCI Express functions

Memory

  • 16 GB of LPDDR4 ECC SDRAM in two channels
  • One channel can be reconfigured as 16 GB non-ECC SDRAM for higher performance and capacity (24 GB total)
  • Up to 256 GB of NAND flash
  • 4 Gbit of QSPI FPGA configuration flash

XMC Site

  • One x8 High-Speed Serial (HSS) 16 Gbps-capable interface to support PCI Express

VPX (VITA 46) P0 I/O

  • Two IPMB connections to an IPMI controller

VPX (VITA 46) P1 I/O

  • Two x1 HSS 25 Gbps-capable interfaces to support 25GBASE-R Ethernet
  • One x4 HSS 25 Gbps-capable interface on P1.A to support Ethernet, CPM, PCIe, etc.
  • One x4 HSS 25 Gbps-capable interface on P1.B to support Ethernet, PCIe, etc.
  • P1.A and P1.B ports can be combined to function as one x8 CPM PCI Express port
  • XMC P16 I/O, mapping P1w9-X12d per VITA 46.9

VPX (VITA 46) P2 I/O

  • Two 1000BASE-T Ethernet ports
  • Six LVDS GPIO
  • One x1 HSS 8 Gbps-capable interface to support PCIe and SATA
  • One RS-232/422/485 serial port
  • Build option for eight LVDS and 16 SE GPIO from the FPGA, or XMC P16 I/O mapping P2w9-X16s+X8d

Development Support

  • Linux Yocto support
  • Hardware Manager Development Kit (HMDK)

Physical Characteristics

  • 3U VPX-REDI conduction- or air-cooled form factor
  • SOSA-aligned pinout compatible with backplane slot profile SLT3-PAY-1F1F2U1TU1T1U1T-14.2.16
  • Designed with support for SOSA-aligned AMPS profile MODA3-16.2.15-1-F2C-(P3F)(P2F)(2E7-E3)(N-N-N-N-M3/M4/M5-N)<XA0>
  • Dimensions: 100 mm x 160 mm
  • 0.8 in. pitch without solder-side cover
  • 0.85 in. and 1.0 in. pitch with solder-side cover and Two-Level Maintenance (2LM) support

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements.

  • Supported ruggedization levels (see the X-ES Ruggedization Chart): 5
  • Conformal coating available as an ordering option

Power Requirements

  • Power will vary based on configuration and usage. Please consult factory.

Accessories

  • XIt1170 (90040115) - 3U VPX Rear Transition Module with Gigabit Ethernet, High-Speed Serial, and XIM Site

Documentation

Datasheet

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Technical Documents

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Block Diagram

XPedite2770 | 3U VPX FPGA
XPedite2770 — 3U VPX FPGA

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Additional Information

Board Support

X-ES FPGA Development Kit (FDK) Overview

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Datasheet

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Datasheet PDF

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