XPand5200 Series

Sub-½ ATR, Natural Convection-Cooled or Conduction-Cooled Chassis for Four Conduction-Cooled Modules

The XPand5200 Series redefines the limits of power, performance, and functionality in a sub-½ ATR chassis.

This natural convection-cooled or conduction-cooled, fully ruggedized chassis is designed to meet the rigorous standards of MIL-STD-810 while integrating the latest power-saving and performance-enhancing technology.

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Please see recommended replacement product, the XPand6200 Series Sub-½ ATR Rugged System.

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SKU: 90070790 Category:
XPand5200 Series Rugged System

The XPand5200 Series redefines the limits of power, performance,and functionality in a sub-½ ATR chassis. This natural convection-cooled or conduction-cooled, fully ruggedized chassis is designed to meet the rigorous standards of MIL-STD-810 while integrating the latest power-saving and performance-enhancing technology. In today’s avionics and ruggedized environments, size really does matter, and the XPand5200 sets a new standard for sub-½ ATR computing.

Depending on your processing requirements, systems based on the XPand5200 Series can be populated with up to four high-performance, low-power, 3U VPX or 3U cPCI modules designed and manufactured by X-ES. X-ES also has an extensive lineup of XMC and PMC solutions to fulfill your data-processing and I/O requirements. Additionally, X-ES provides integration services for third-party modules.

Optional non-volatile SATA Solid-State Drive (SSD) memory provides the convenience of high-capacity storage and the ruggedness of solid-state memory. X-ES maximizes power supply performance, supporting an integrated MIL-STD-704 28 VDC power supply. Internal EMI filtering and hold-up for up to 100 ms at 70 W is also provided.

Please contact X-ES sales to begin designing a system that will meet or exceed your I/O, processing, and power requirements.

Features

  • ½ ATR natural convection-cooled or conduction-cooled chassis (reduced height and length)
  • Four conduction-cooled 0.8 in. slots
  • Physical dimensions of 10.30 in. (L) x 4.88 in. (W) x 5.65 in. (H)
  • 3U VPX and cPCI backplanes available
  • Non-volatile SSD memory (optional)
  • PCI Express fabric backplane (optional)
  • Gigabit Ethernet fabric backplane (optional)
  • Configurable front panel I/O connectors
  • Integration services with third-party modules available
  • Integrated MIL-STD-704 28 VDC power supply
  • MIL-STD-461E/F EMI filtering
  • Internal holdup of up to 100 ms at 70 W (optional)
  • Foldable front panel handle
  • Environmentally sealed

Technical Specs

Physical Characteristics

  • ½ ATR-compliant, natural convection-cooled or conduction-cooled chassis (reduced height and length)
  • Dimensions: 10.30 in. (L) x 4.88 in. (W) x 5.65 in. (H)
  • Four 0.8 in. slots support conduction-cooled 3U VPX, 3U cPCI, or power supply modules
  • Boards are inserted in the back of the chassis in a vertical orientation
  • Foldable front panel handle

Backplane Options

  • 3U VPX
  • 3U cPCI
  • Two high-power payload slots
  • Up to two lower-power payload slots for I/O or non-volatile SSD memory
  • One power supply slot or optional integrated power supply
  • Custom backplane solutions available
  • PCI Express or Gigabit Ethernet switching (optional)

Front Panel I/O Options

  • Up to three D38999 circular connectors for I/O
  • DVI graphics interfaces
  • USB 2.0- and 1.0-compliant interfaces
  • 10/100/1000BASE-T Gigabit Ethernet interfaces
  • RS-232/422 serial links
  • MIL-STD-1553
  • ARINC 429
  • Custom I/O via PMC/XMC modules
  • Custom I/O via third-party modules

Power Supply Options

  • MIL-STD-704 28 VDC input voltage support (default)
  • Up to 100 ms internal holdup time at 70 W (optional)
  • Additional power supply options available

Thermal

At 55°C ambient and 200 LFM ambient airflow at sea level

  • Maintains 85²C board rail temperatures with up to 105 W total chassis power dissipation
  • Two high-power payload slots at up to 40 W each
  • One lower-power payload slot at up to 10 W
  • Conduction through the base plate can provide additional cooling

Accessories

Supports the following:

Please contact X-ES Sales at sales@xes-inc.com or by phone at +1-608-833-1155 for information on this product's accessories.

Documentation

Datasheet

To view all of the information about this product in a PDF, please download the datasheet.

Download Datasheet

Technical Documents

SupportNet is your source for product manuals, technical support, and software downloads.

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Block Diagram

XPand5200 Series Rugged System
XPand5200 Series — Rugged Embedded System

Information Request

Additional Information

Replacement Product

View the recommended replacement product, the XPand6200 Series

View Product

Press Release

View the XPand5200 Series Press Release
 

View Press Release

Datasheet

View the XPand5200 Series Datasheet PDF
 

Download Datasheet

VPX Rugged Systems

View the full selection of VPX Rugged Systems from X-ES
 

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cPCI Rugged Systems

View the full selection of cPCI Rugged Systems from X-ES
 

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