XPand5200 Series

Sub-½ ATR, Natural Convection-Cooled or Conduction-Cooled Chassis for Four Conduction-Cooled Modules

The XPand5200 Series redefines the limits of power, performance, and functionality in a sub-½ ATR chassis.

This natural convection-cooled or conduction-cooled, fully ruggedized chassis is designed to meet the rigorous standards of MIL-STD-810 while integrating the latest power-saving and performance-enhancing technology.

Not Recommended for New Designs (NRND)

Please see recommended replacement product, the XPand6200 Series Sub-½ ATR Rugged System.

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SKU: 90070790 Category:
XPand5200 Series Rugged System

The XPand5200 Series redefines the limits of power, performance,and functionality in a sub-½ ATR chassis. This natural convection-cooled or conduction-cooled, fully ruggedized chassis is designed to meet the rigorous standards of MIL-STD-810 while integrating the latest power-saving and performance-enhancing technology. In today’s avionics and ruggedized environments, size really does matter, and the XPand5200 sets a new standard for sub-½ ATR computing.

Depending on your processing requirements, systems based on the XPand5200 Series can be populated with up to four high-performance, low-power, 3U VPX or 3U cPCI modules designed and manufactured by X-ES. X-ES also has an extensive lineup of XMC and PMC solutions to fulfill your data-processing and I/O requirements. Additionally, X-ES provides integration services for third-party modules.

Optional non-volatile SATA Solid-State Drive (SSD) memory provides the convenience of high-capacity storage and the ruggedness of solid-state memory. X-ES maximizes power supply performance, supporting an integrated MIL-STD-704 28 VDC power supply. Internal EMI filtering and hold-up for up to 100 ms at 70 W is also provided.

Please contact X-ES sales to begin designing a system that will meet or exceed your I/O, processing, and power requirements.

Features

  • ½ ATR natural convection-cooled or conduction-cooled chassis (reduced height and length)
  • Four conduction-cooled 0.8 in. slots
  • Physical dimensions of 10.30 in. (L) x 4.88 in. (W) x 5.65 in. (H)
  • 3U VPX and cPCI backplanes available
  • Non-volatile SSD memory (optional)
  • PCI Express fabric backplane (optional)
  • Gigabit Ethernet fabric backplane (optional)
  • Configurable front panel I/O connectors
  • Integration services with third-party modules available
  • Integrated MIL-STD-704 28 VDC power supply
  • MIL-STD-461E/F EMI filtering
  • Internal holdup of up to 100 ms at 70 W (optional)
  • Foldable front panel handle
  • Environmentally sealed

Technical Specs

Physical Characteristics

  • ½ ATR-compliant, natural convection-cooled or conduction-cooled chassis (reduced height and length)
  • Dimensions: 10.30 in. (L) x 4.88 in. (W) x 5.65 in. (H)
  • Four 0.8 in. slots support conduction-cooled 3U VPX, 3U cPCI, or power supply modules
  • Boards are inserted in the back of the chassis in a vertical orientation
  • Foldable front panel handle

Backplane Options

  • 3U VPX
  • 3U cPCI
  • Two high-power payload slots
  • Up to two lower-power payload slots for I/O or non-volatile SSD memory
  • One power supply slot or optional integrated power supply
  • Custom backplane solutions available
  • PCI Express or Gigabit Ethernet switching (optional)

Front Panel I/O Options

  • Up to three D38999 circular connectors for I/O
  • DVI graphics interfaces
  • USB 2.0- and 1.0-compliant interfaces
  • 10/100/1000BASE-T Gigabit Ethernet interfaces
  • RS-232/422 serial links
  • MIL-STD-1553
  • ARINC 429
  • Custom I/O via PMC/XMC modules
  • Custom I/O via third-party modules

Power Supply Options

  • MIL-STD-704 28 VDC input voltage support (default)
  • Up to 100 ms internal holdup time at 70 W (optional)
  • Additional power supply options available

Thermal

At 55°C ambient and 200 LFM ambient airflow at sea level

  • Maintains 85²C board rail temperatures with up to 105 W total chassis power dissipation
  • Two high-power payload slots at up to 40 W each
  • One lower-power payload slot at up to 10 W
  • Conduction through the base plate can provide additional cooling

Accessories

Supports the following:

Please contact X-ES Sales at sales@xes-inc.com or by phone at +1-608-833-1155 for information on this product's accessories.

Documentation

Datasheet

To view all of the information about this product in a PDF, please download the datasheet.

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Technical Documents

SupportNet is your source for product manuals, technical support, and software downloads.

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Block Diagram

Additional Information

Replacement Product

View the recommended replacement product, the XPand6200 Series

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Press Release

View the XPand5200 Series Press Release
 

View Press Release

Datasheet

View the XPand5200 Series Datasheet PDF
 

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VPX Rugged Systems

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View the full selection of cPCI Rugged Systems from X-ES
 

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