3U VPX SINGLE BOARD COMPUTER · SKU 90030255
XPedite7570
End of Life
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The XPedite7570 is a high-performance, 3U VPX-REDI, single board computer based on the 5th generation Intel® Core™ i7 Broadwell-H processor.
The XPedite7570 maximizes network performance with four Gigabit Ethernet interfaces, configured as two 1000BASE-BX/KX (SerDes) ports and two 10/100/1000BASE-T ports.
Product Lifecycle
X-ES also offers comprehensive configuration and obsolescence management services, providing customers with direct control over non-interchangeable changes and extending product availability and serviceability well beyond standard end-of-life milestones.
Engineered for Extended Reliability
All X-ES products are designed and manufactured 100% in the USA with components from trusted supply chains in order to deliver rugged, reliable performance in the most demanding environments.
Built with components rated for extreme conditions and validated through rigorous testing, our solutions minimize obsolescence risk and lower total cost of ownership across the full program lifespan.
Introduction to XPedite7570
The XPedite7570 is a high-performance, 3U VPX-REDI, single board computer based on the 5th generation Intel® Core™ i7 Broadwell-H processor.
Network Performance
The XPedite7570 maximizes network performance with four Gigabit Ethernet interfaces, configured as two 1000BASE-BX/KX (SerDes) ports and two 10/100/1000BASE-T ports.
PCI Express Switching
An integrated PCI Express switch with Non-Transparent Bridging support enables direct communication with other Intel® processors, eliminating the need for a separate switch module within the system and further reducing SWaP-C for the system integrator.
Memory, I/O & Software Support
The XPedite7570 accommodates up to 8 GB of DDR3 ECC SDRAM in two channels to support memory-intensive applications. The XPedite7570 also hosts numerous I/O ports, including PCI Express, Gigabit Ethernet, USB, SATA, graphics, and RS-232/422/485 through the backplane connectors.
Wind River VxWorks and Linux Board Support Packages (BSPs) are available, as well as Microsoft Windows drivers.
Expansion Capabilities
The XPedite7570 provides superior growth and expansion capabilities by including an XMC or PMC site with full 10 mm I/O envelope support, while maintaining a 0.8 in. VPX slot pitch and providing the system integrator with a plethora of COTS options for additional I/O, storage, or processing, all while minimizing total system SWaP-C.
Maintenance & Graphics
The XPedite7570 provides significant maintenance and diagnostics advantages by including optimized Two-Level Maintenance (2LM) metalwork and enabling the remote configuration and management capabilities of Intel® vPro™ with Intel® Active Management Technology (Intel® AMT) support.
The XPedite7570 leverages Intel® Iris™ Pro graphics for graphics-intensive applications and serves as a general-purpose GPU for demanding data processing applications.
Processor
- 5th generation Intel® Core™ i7 (Broadwell-H)
- 4th generation Intel® Core™ i7 (Haswell)
- Integrated high-performance 3D graphics controller
- Up to Intel® Iris™ Pro Graphics 6200
Memory
- Up to 8 GB of DDR3 ECC SDRAM in two channels
- Up to 32 GB of NAND flash
- 64 MB NOR boot flash
- 64 kB EEPROM
XMC/PrPMC Site
- 32-bit, 33/66 MHz PCI bus (PMC interface)
- x8 PCI Express Gen3-capable port (XMC interface)
- One SATA port capable of 6 Gb/s (XMC interface)
VPX (VITA 46) P0 I/O
- I²C port
VPX (VITA 46) P1 I/O
- x4 PCI Express Fat Pipe interface to P1.A
- x4 PCI Express Fat Pipe interface to P1.B
- Two 1000BASE-BX Gigabit Ethernet ports
- XMC P16 I/O, mapping P1w9-X12d per VITA 46.9
VPX (VITA 46) P2 I/O
- Two 10/100/1000BASE-T Gigabit Ethernet ports
- Four SATA ports capable of 6 Gb/s
- Two USB 2.0 ports
- Two HDMI/DVI-D or Dual-Mode DisplayPort interfaces
- Up to two RS-232/422/485 serial ports
- 3.3 V GPIO signals
Additional Features
- Non-volatile memory write protection
- Optional Trusted Platform Module (TPM)
- IEEE 1588 support on three Gigabit Ethernet ports
- Intel® Active Management Technology (AMT) supported by Intel® vPro™ Technology
Software Support
- Wind River VxWorks BSP
- Linux BSP
- Microsoft Windows drivers
- Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs
Physical Characteristics
- 3U VPX-REDI conduction- or air-cooled form factor
- Dimensions: 100 mm x 160 mm
- 0.8 in. pitch without solder-side cover
- 0.85 in. and 1.0 in. pitch with solder-side cover
- Optional Two-Level Maintenance (2LM) metalwork (1.0 in. pitch)
Environmental Requirements
Contact factory for appropriate board configuration based on environmental requirements.
- Supported ruggedization levels (see the X-ES Ruggedization Chart): 5
- Conformal coating available as an ordering option
- Thermal performance will vary based on CPU frequency and application
- Contact X-ES for air-cooled development options
Power Requirements
- Power will vary based on configuration and usage. Please consult factory.
Accessories
- XIt1076 (90060330) – 3U VPX RTM with Serial, Ethernet, USB, SATA, DDP
- XIt1081 (90040025) – 3U VPX RTM with Serial, Ethernet, USB, SATA, XMC
- XTend209 (90071685) – Debug Module
- XPand1200 (90070530) – 3U VPX Development Chassis for Conduction-Cooled Modules
XPedite7570
5th Gen Intel® Core™ i7 (Broadwell-H) Processor-Based Conduction- or Air-Cooled 3U VPX-REDI Single Board Computer (SBC)
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Datasheet
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Technical Documentation
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