XPedite6032

The XPedite6032 is a high-performance conduction- or air-cooled 3U CompactPCI (cPCI) module that dissipates less than 18 W and is capable of operating at up to 85°C at the external thermal interface without forced air flow (conduction-cooled version) or up to 55°C ambient air temperature with 300 LFM airflow (air-cooled version). The XPedite6032 can also host one single-width conduction-cooled PMC or standard air-cooled PMC. The XPedite6032 is tolerant of 40 g peak/6 ms half sine shock, random vibration of 0.1 g²/Hz from 50 to 2000 Hz, and swept sinusoidal vibration of 0.06 inch/10 g peak amplitude from 10 to 500 Hz.

The XPedite6032 utilizes the NXP (formerly Freescale) MPC7447A/7448 embedded processor and Marvell Discovery III system controller and provides up to 512 MB DDR-266 SDRAM, up to 128 MB of NOR flash, two RS-232/422 serial ports, a 33/66 MHz cPCI interface and 66/100/133 MHz PCI-X PMC interface. The serial and two Gigabit Ethernet interfaces are accessible through the backplane J2 connector along with a subset of the PMC’s P14 I/O. The XPedite6032 can be built as a system or peripheral cPCI module.

The XPedite6032 is ideal for 3U cPCI applications in commercial or extended temperature, shock, and vibration environments that require high-bandwidth and processing performance.

Features

• NXP MPC7447A/7448 processor
• Conduction- or air-cooled 3U cPCI form factor
• One conduction- or air-cooled PCI-X PMC slot
• Extended shock/vibration tolerance
• Up to 512 MB DDR-266 SDRAM
• 128 MB soldered flash
• Two rear I/O Gigabit Ethernet interfaces
• Two RS-232/422 serial ports
• PMC P14 backplane I/O
• Linux BSP
• Wind River VxWorks BSP
• QNX Neutrino BSP
• Green Hills INTEGRITY BSP
• LynuxWorks LynxOS BSP

Technical Specs

Processor

• NXP (formerly Freescale) MPC7447A/7448
• 1 GHz max processor speed
• 133 MHz bus speed
• 32 kB L1 instruction/data caches
• 512 kB (7447A) / 1 MB (7448) L2 cache

Conduction-Cooled

• Operates at up to 85°C at the external thermal interface

Air-Cooled

• Operates at up to 55°C ambient air temperature with 300 LFM airflow

PCI-X PMC Slot

• Maximum aggregate bandwidth of 1 GB
• Processor PMC (PrPMC) support

Non-Volatile Storage

• Up to 128 MB NOR flash
• 4 kB SEEPROM
• 128 kB NVSRAM

Ethernet

• Two Gigabit Ethernet ports
• Rear I/O

DDR SDRAM

• Up to 512 MB at DDR-266
• 2.6 Gb/s peak bandwidth

Rear I/O

• Two Gigabit Ethernet ports
• Two RS-232/422 serial ports
• Four GPIO pins
• One I²C port

Software

• Linux BSP
• Wind River VxWorks BSP
• QNX Neutrino BSP
• Green Hills INTEGRITY BSP
• LynuxWorks LynxOS BSP

Physical Characteristics

• 3U cPCI form factor
• Dimensions: 100 mm x 160 mm

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements.

• Supported ruggedization levels (see the X-ES Ruggedization Chart): 1, 3, 5
• Conformal coating available as an ordering option

Power Requirements (Estimate)

• 3.3 V, 5.2 A, 17.16 W
• 5 V, 0.05 A, 0.25 W

Accessories

Documentation

Datasheet

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Technical Documents

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