XPedite2470

The XPedite2470 is a high-performance, reconfigurable, conduction- or air-cooled, 3U VPX, FPGA processing module based on the AMD (formerly Xilinx) Virtex-7 family of FPGAs. With multiple high-speed fabric interfaces, external memory, Virtex-7 FPGA, an FMC site, and high-density I/O, the XPedite2470 is ideal for customizable, high-bandwidth, signal-processing applications.

The XPedite2470’s DDR3 SDRAM and flexible I/O routing makes it perfect for high-speed, bandwidth-intensive, data-streaming applications. The card provides numerous I/O capabilities through its FMC daughter card interface, allowing access to single-ended and differential I/O and configurable GTX transceivers. An FMC daughter card can expand the capabilities of the XPedite2470 by providing technologies such as Digital Signal Processing (DSP), high-frequency Digital-to-Analog Conversion (DAC), and high-frequency Analog-to-Digital Conversion (ADC).

The XPedite2470 provides a high-performance, feature-rich solution capable of interfacing to and processing streaming data from a wide variety of sensors. The X-ES FPGA Development Kit (FDK) is provided to support the requirements of high-performance, real-time, embedded streaming data applications and simplify FPGA development. It includes IP blocks, example FPGA designs, and software to control and communicate with FPGAs.

Features

• AMD (formerly Xilinx) Virtex-7 FPGA XC7VX690T
• 3U VPX (VITA 46) module
• FMC-compliant carrier card (VITA 57) with High Pin Count (HPC) connector
• Four channels of x32 DDR3 SDRAM, up to 1 GB each
• 128 MB of user NOR flash
• LVDS and high-speed GTX transceiver connectivity between FPGA and FMC
• Eight high-speed GTX lanes to FMC
• Eleven high-speed GTX lanes to P1 fabric interconnect
• Total of 56 LVDS pairs
• FPGA Development Kit (FDK)

Technical Specs

FPGA

• AMD (formerly Xilinx) Virtex-7 for high-performance logic and DSP applications
• Up to 4 GB of DDR3 SDRAM in four channels
• 128 MB of user NOR flash

Supported FPGAs

• Virtex-7 XC7VX690T (default)
• Virtex-7 XC7VX485T
• Support for commercial and industrial temperature as well as -1, -2, -3 speed grades

Development Support

• X-ES FPGA Development Kit (FDK)

FMC (VITA 57)

• FPGA LVDS I/O
• x8 GTX transceivers
• 47 LVDS GPIO
• Support for 1.8 V, 1.5 V, 1.2 V, and 1.35 V VADJ

VPX (VITA 46) P1 I/O

• x8 GTX transceivers configurable as x8 PCI Express interface to P1.A
• Three additional GTX lanes

VPX (VITA 46) P2 I/O

• Nine FGPA LVDS GPIO
• FMC GPIO
• One RS-232 serial port

Physical Characteristics

• 3U VPX-REDI conduction- or air-cooled form factor
• Dimensions: 100 mm x 160 mm
• 0.8 in. pitch without solder-side cover
• 0.85 in. and 1.0 in. pitch with solder-side cover

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements.

• Supported ruggedization levels (see the X-ES Ruggedization Chart): 5
• Conformal coating available as an ordering option
• Contact X-ES for air-cooled development options

Power Requirements

• Power will vary based on configuration and usage. Please consult factory.

Accessories

• XTend210 (90071260) - Debug Module for FPGA Cards
• XIt1070 (90060170) - 3U VPX RTM with Gigabit Ethernet, SATA, USB, Serial, and DVI

Documentation

Datasheet

To view all of the information about this product in a PDF, please download the datasheet.

Download Datasheet

Technical Documents

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