Products
Overview
Showing 166–180 of 340 results
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XPort3305
Status: Not Recommended for New Designs (NRND)
Form Factor: XMC
Ethernet: 1 10GBASE-SR, 2 10GBASE-KX4Conduction-Cooled XMC with Dual 10 Gigabit Ethernet Interfaces and Rugged Optical Connector
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XPort3303
Status: End of Life (EOL)
Form Factor: XMC
Ethernet: 1 SFP+Conduction- or Air-Cooled XMC with Dual 10 Gigabit Ethernet Interfaces and Rugged Optical Connector
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XPort9200
Status: End of Life (EOL)
Form Factor: PMC, XMC
Interface: 12 CAN busConduction- or Air-Cooled 12-Channel High-Speed CAN Bus XMC or PMC Module
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XPort9102
Status: Not Recommended for New Designs (NRND)
Form Factor: XMC
Interface: 12 I/O DiscretesAvionics-Level-Tolerant Isolated TTL Discrete I/O XMC Module
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XIt1042
Form Factor: 6U VPX
Ethernet: 4 10/100/1000BASE-T, 6 10GBASE-T
USB: 2 USB 2.0
Serial: 3 RS-232/422/485
SATA: 4 SATA 3 Gb/s6U VPX Rear Transition Module with Gigabit Ethernet, SATA, USB, Serial, and HDMI
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XTend3103
Form Factor: PMC, XMC
Chassis Type: Development
Number of Slots: 2
Dimensions: 10.8"L x 9.3"W x 2.0"H
Chassis Cooling: Forced Convection-CooledDual XMC/PMC Carrier for Development and Testing
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XTend3100
Status: Not Recommended for New Designs (NRND)
Form Factor: PMC, XMC
Chassis Type: Development
Number of Slots: 2
Dimensions: 10.8"L x 9.3"W x 2.0"H
Chassis Cooling: Forced Convection-CooledDual XMC/PrPMC Carrier for Development and Testing
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XPand9004
Form Factor: Custom
Chassis Type: Custom
Number of Slots: 1
Dimensions: 5.8"L x 3.5"W x 1.1"H
Chassis Cooling: Natural Convection-CooledSolid-State Drive Module Development System
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XPand1405
Form Factor: COM Express®, PCIe Edge Card
Chassis Type: Development
Number of Slots: 1
Dimensions: 19.3"L x 15.43"W x 8.15"H
Chassis Cooling: Forced Convection-CooledDevelopment Platform for X-ES COM Express® Basic (Type 7) Modules
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XPand1404
Form Factor: COM Express®, PCIe Edge Card
Chassis Type: Development
Number of Slots: 1
Dimensions: 19.3"L x 15.43"W x 8.15"H
Chassis Cooling: Forced Convection-CooledDevelopment Platform for X-ES COM Express® Basic (Type 7) Modules
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XPand1400 Series
Form Factor: COM Express®, PCIe Edge Card, PMC, XMC
Chassis Type: Development
Number of Slots: 2
Dimensions: 21.5"L x 9"W x 20.5"H
Chassis Cooling: Forced Convection-CooledDevelopment Platform For XPand6000 Series, X-ES COM Express® Modules, and XMC/PMC Modules
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XTend2001
Status: End of Life (EOL)
Form Factor: XMC
Chassis Type: Development
Number of Slots: 2
Dimensions: 6.55"L x 3.95"W x 0.83"H
Chassis Cooling: Forced Convection-CooledDual-XMC Carrier for Development and Testing
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XPand1205
Form Factor: 3U VPX
Chassis Type: Development
Number of Slots: 8
Dimensions: 11.5"L x 5.5"W x 16.5"H
Chassis Cooling: Forced Convection-Cooled3U VPX Development Platform for Up to Eight Conduction-Cooled Modules
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XPand1203
Form Factor: 3U VPX
Chassis Type: Development
Number of Slots: 8
Dimensions: 11.5"L x 5.5"W x 16.5"H
Chassis Cooling: Forced Convection-Cooled3U VPX Development Platform for Up to Eight Conduction-Cooled Modules
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XPand1015
Form Factor: 6U VPX
Chassis Type: Development
Number of Slots: 2
Dimensions: 17.5"L x 5.6"W x 9.3"H
Chassis Cooling: Conduction-CooledTwo-Slot 6U VPX Development Platform for Conduction-Cooled Modules with RTM I/O