XPedite6370

NXP QorIQ LS2088A-Based 3U VPX-REDI Single Board Computer (SBC) with Eight ARM® Cortex®-A72 Cores

The XPedite6370 is a 3U VPX-REDI single board computer based on the NXP (formerly Freescale) QorIQ LS2088A processor. It provides a rugged, feature-rich, processing solution that maximizes the performance-per-watt capabilities of an ARM-based processor module.

The LS2088A processor offers eight ARM® Cortex®-A72 CPUs, running at up to 2.0 GHz and integrates a 128-bit NEON™-based SIMD engine for each core. The integrated NEON™ SIMD engines allow the XPedite6370 to support DSP-level Floating-Point performance and an extensive inventory of software libraries.

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XPedite6370 3U VPX Single Board Computer (SBC)

The XPedite6370 is a 3U VPX-REDI single board computer based on the NXP (formerly Freescale) QorIQ LS2088A processor. It is compatible with multiple VITA 65 OpenVPX™ slot profiles. The XPedite6370 provides a rugged, feature-rich, processing solution that maximizes the performance-per-watt capabilities of an ARM-based processor module.

The LS2088A processor offers eight ARM® Cortex®-A72 CPUs, running at up to 2.0 GHz and integrates a 128-bit NEON™-based SIMD engine for each core. The integrated NEON™ SIMD engines allow the XPedite6370 to support DSP-level Floating-Point performance and an extensive inventory of software libraries.

The XPedite6370 also supports up to 16 GB of DDR4-2100 ECC SDRAM and provides a plethora of I/O options to the backplane, including multiple 10 Gigabit Ethernet and PCIe Gen3 interfaces.

The XPedite6370 provides superior growth and expansion capabilities. It includes an XMC site with full 10 mm I/O envelope support, while maintaining a 0.8 in. VPX slot pitch. This gives system integrators a wide variety of COTS options for additional I/O, storage, or processing and minimizes total system SWaP-C.

Wind River VxWorks, Linux, and Green Hills INTEGRITY Board Support Packages (BSPs) are available.

Features

  • NXP QorIQ LS2088A processor with eight ARM® Cortex®-A72 cores at up to 2.0 GHz
  • 128-bit NEON™ SIMD engine
  • Compatible with multiple VITA 65 OpenVPX™ slot profiles
  • 3U VPX (VITA 46) module
  • Ruggedized Enhanced Design Implementation (REDI)
  • Conduction or air cooling
  • Up to 16 GB of DDR4-2100 ECC SDRAM
  • Up to 256 MB of NOR flash (with redundancy)
  • Up to 32 GB of NAND flash
  • Hardware write protection for non-volatile memory
  • XMC interface
  • Two x4 PCI Express backplane fabric interconnects
  • x4 PCI Express to Fat Pipe P1.B fabric interconnect
  • Two SerDes Gigabit Ethernet Thin Pipe P1 fabric interconnects
  • Two 10/100/1000BASE-T Ethernet ports
  • Two SATA ports to P2 (optional)
  • Up to four RS-232/422/485 serial ports to P2
  • Two USB 2.0 ports to P2
  • Linux BSP
  • Wind River VxWorks BSP
  • Green Hills INTEGRITY BSP

Technical Specs

Processor

  • NXP (formerly Freescale) QorIQ LS2088A processor
  • Eight ARM® Cortex®-A72 cores at up to 2.0 GHz
  • 1 MB L2 cache shared between two CPUs
  • 1 MB platform cache with ECC
  • IEEE 784 Floating-Point Unit (FPU) support
  • 128-bit NEON™ SIMD engine

Memory

  • Up to 16 GB of up to DDR4-2100 ECC SDRAM
  • Up to 256 MB of NOR flash (with redundancy)
  • Up to 32 GB of NAND flash

VPX (VITA 46) P1 I/O

  • x4 PCI Express Gen3-capable interface to P1.A
  • x4 PCI Express Gen3-capable interface to P1.B
  • Two 10GBASE-KR Ethernet ports
  • XMC P16 I/O, mapping P1w9-X12d per VITA 46.9

VPX (VITA 46) P2 I/O

  • Two 10/100/1000BASE-T Ethernet ports
  • Up to four RS-232/422/485 serial ports
  • Two USB 2.0 ports
  • I²C port
  • 3.3 V GPIO signals
  • Two SATA ports capable of 6 Gb/s (optional)

XMC Site

  • x2 PCI Express interface
  • X12d P16 I/O support

Software Support

  • Linux BSP
  • Wind River VxWorks BSP
  • Green Hills INTEGRITY BSP
  • QNX Neutrino BSP (contact factory)
  • LynuxWorks LynxOS BSP (contact factory)

Physical Characteristics

  • 3U VPX-REDI conduction- or air-cooled form factor
  • Dimensions: 100 mm x 160 mm
  • 0.8 in. pitch without solder-side cover
  • 0.85 and 1.0 in. pitch with solder-side cover

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements.

  • Supported ruggedization levels (see the X-ES Ruggedization Chart): 3, 5
  • Conformal coating available as an ordering option

Power Requirements

  • Power will vary based on configuration and usage. Please consult factory.

Accessories

  • XIt1086 (90040055) - 3U VPX Rear Transition Module with PCIe, 10 Gigabit Ethernet, eSATA, USB, Serial, and Expandable XIM Sites
  • XPand1004 (90071810) - 3U VPX Two-Slot Development Chassis
  • XPand1200 (90070530) - 3U VPX Development Platform for Up to Eight Conduction-Cooled Modules
  • XPand1203 (90072665) - 3U VPX Development Platform for Up to Eight Conduction-Cooled Modules
  • XPand1300 (90070415) - 3U VPX Development Platform for Up to Eight Air-Cooled Modules
  • XTend214 (90071725) - Debug Module/Cable with JTAG/COP/Serial/Ethernet/USB

Documentation

Datasheet

To view all of the information about this product in a PDF, please download the datasheet.

Download Datasheet

Technical Documents

SupportNet is your source for product manuals, technical support, and software downloads.

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Block Diagram

Additional Information

Press Release

View the press release
for the XPedite6370

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Product Brief

NXP ARM-Based Modules Product Brief

View Brief

Datasheet

View the XPedite6370
Datasheet PDF

Download Datasheet

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