X-ES Introduces Rugged COM Express® Module with 3rd Generation Intel® Core™ i7 Processor for Small Form Factor Systems
May 3rd, 2012 — News
Extreme Engineering Solutions, Inc. (X-ES) introduces XPedite7450, a rugged COM Express® module that complies with the PICMG COM Express® Basic form factor (95 mm x 125 mm) and supports an enhanced Type 6 pinout. The XPedite7450 can be hosted on a standard COM Express® carrier card or a custom carrier card built to include additional end-user requirements, or…
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