X-ES Introduces Rugged COM Express® Module for Small Form Factor Systems

Extreme Engineering Solutions, Inc. (X-ES) has introduced the company’s first ruggedized COM Express® module, the XPedite5550, which complies with the PICMG COM Express® Compact form factor (95 mm x 95 mm) and supports an enhanced Type 5 pinout. The XPedite5550 can be hosted on a standard COM Express® carrier card, hosted on a custom carrier card built to include any additional requirements from the end user, or integrated into the X-ES XPand6000 Series of Small Form Factor (SFF) rugged systems.

Designed and tested for the harshest military, aerospace, and industrial environments, the XPedite5550 includes enhancements above and beyond commercial COM Express® modules to provide a rugged and reliable COTS processor mezzanine solution:

  • Incorporates the same design and manufacturing principles as all X-ES Level-5 rugged products
  • Designed and tested for full operation from -40°C to +85°C
  • Additional mounting holes for increased structural integrity
  • Extended shock and vibration capabilities for full operation in the harshest environments
  • Conduction-cooled and air-cooled applications supported by single design
  • Soldered down memory replaces less rugged and less reliable SO-DIMMs
  • Tin-lead manufacturing process to mitigate tin-whisker effects (RoHS-compliant process is also available)
  • BIT support

Targeting NXP (formerly Freescale) QorIQ P1011, P1020, P2010, and P2020 processors with clock speeds of up to 1.2 GHz, the XPedite5550 features up to 8 GB of DDR3-800, x2 and x1 PCI Express interfaces, three Gigabit Ethernet ports, two SATA 3 Gb/s ports, two serial ports, and a USB 2.0 port. Board Support Packages (BSPs) for Linux, Green Hills INTEGRITY, and Wind River VxWorks are available. QNX Neutrino, LynuxWorks LynxOS, and other O/S support may be available as needed.

The XPedite5550 was developed with the rugged XPand6000 SFF systems in mind. Supporting conduction cooling, natural convection cooling, and minimal SWaP, an XPand6000 Series-based system can be bolted to almost any available surface of a small UAV or ground vehicle. Weighing as little as 3.5 lbs., XPand6000 Series rugged systems provide both high-performance processing capabilities and a multitude of I/O functions added via PMCs/XMCs, including MIL-STD-1553, serial, router, and storage capability in an extremely small and lightweight package.

About X-ES

Extreme Engineering Solutions, Inc. (X-ES), a 100% U.S.A.-based company, designs and builds single-board computers, I/O boards, power supplies, backplanes, chassis, and system-level solutions for embedded computing customers. X-ES offers cutting-edge performance and flexibility in design, plus an unparalleled level of customer support and service.

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