XPand6000 Series

Rugged Intel® Core™ i7, Intel® Atom™, or NXP (formerly Freescale) QorIQ-Based Small Form Factor (SFF) System with XMC/PMC Support

XPand6000 Series systems are based on convection-cooled and conduction-cooled, fully-ruggedized Small Form Factor (SFF) chassis designed and tested to meet the rigorous standards of MIL-STD-810 while integrating the latest power-saving, performance-enhancing, and space-efficient COTS technology.

Its small size, availability in horizontal and vertical orientations, and use of COTS components enables the XPand6000 Series to be deployed quickly into a wide variety of airborne and ground vehicle applications.

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XPand6000 Series Small Form Factor (SFF) Rugged System

XPand6000 Series systems are based on convection-cooled and conduction-cooled, fully-ruggedized Small Form Factor (SFF) chassis designed and tested to meet the rigorous standards of MIL-STD-810 while integrating the latest power-saving, performance-enhancing, and space-efficient COTS technology. Its small size, availability in horizontal and vertical orientations, and use of COTS components enables the XPand6000 Series to be deployed quickly into a wide variety of airborne and ground vehicle applications.

XPand6000 Series systems can be populated with a high-performance ruggedized Intel® Core™ i7, Intel® Atom™, or NXP (formerly Freescale) QorIQ processor-based COM Express® module. The XPand6000 Series supports an XMC or PMC site for expansion. The system’s carrier card can also be customized to support application-specific circuitry such as additional I/O or an FPGA. X-ES has an extensive lineup of PMC and XMC solutions to fulfill your data-processing and I/O requirements. Additionally, X-ES provides integration services for third-party ruggedized COM Express® or XMC/PMC modules.

An optional Slim SATA SSD memory module (with optional integrated encryption) provides the convenience of high-capacity off-the-shelf storage, the ruggedness of solid-state non-volatile memory, and the security of 256-bit AES encryption. X-ES maximizes power supply performance per cubic inch, supporting an integrated MIL-STD-704 28 VDC power supply and MIL-STD-461 EMI filtering. Internal holdup can be provided, as well.

Features

  • Convection-cooled or conduction-cooled Small Form Factor (SFF) ATR chassis
  • Physical dimensions of 7.1 in. (L) x 2.36 in. (W) x 4.88 in. (H) for vertical orientation, convection-cooled version
  • Physical dimensions of 7.7 in. (L) x 4.88 in. (W) x 2.1 in. (H) for horizontal orientation, convection-cooled version
  • Physical dimensions of 7.1 in. (L) x 4.88 in. (W) x 1.9 in. (H) for horizontal orientation, conduction-cooled version
  • Supports single Intel® Core™ i7, Intel® Atom™, or NXP (formerly Freescale) QorIQ processor-based Rugged COM Express® module
  • Supports single conduction-cooled XMC or PMC module
  • Integration services with third-party modules available
  • Slim SATA SSD memory module (optional)
  • Integrated MIL-STD-704 28 VDC power supply
  • MIL-STD-461E/F EMI filtering
  • Internal holdup (optional)
  • Environmentally sealed
  • D38999 connector support
  • Configurable front panel I/O connectors
  • Customizable internal carrier card for application-specific circuitry
  • Back panel power connector

Technical Specs

Physical Characteristics – Vertical Orientation, Convection Cooling

  • Dimensions: 7.10 in. (L) x 2.36 in. (W) x 4.88 in. (H)
  • Weighs less than 4 lbs. (fully populated)

Physical Characteristics – Horizontal Orientation, Convection Cooling

  • Dimensions: 7.70 in. (L) x 4.88 in. (W) x 2.10 in. (H)
  • Weighs less than 3.75 lbs. (fully populated)

Physical Characteristics – Horizontal Orientation, Conduction Cooling

  • Dimensions: 7.70 in. (L) x 4.88 in. (W) x 1.90 in. (H)
  • Weighs less than 3.5 lbs. (fully populated)

Configuration Options

  • Supports a single ruggedized Intel® Core™ i7, Intel® Atom™, or NXP (formerly Freescale) QorIQ processor-based COM Express® module
  • Supports a single conduction-cooled XMC or PMC module
  • Customized carrier card solutions available for application-specific circuitry
  • Slim SATA SSD module with optional integrated encryption (optional)

Front Panel I/O Options

  • Up to two D38999 circular connectors for I/O
  • Customizable connector options
  • DVI graphics interfaces
  • USB 2.0- and 1.0-compliant interfaces
  • 10/100/1000BASE-T Gigabit Ethernet interfaces
  • RS-232/422 serial links
  • MIL-STD-1553
  • ARINC 429
  • Custom I/O via XMC or PMC modules
  • Custom I/O via carrier card

Power Supply Options

  • Integrated power supply
  • MIL-STD-704 28 VDC input voltage support (default)
  • MIL-STD-461 EMI filtering
  • Integrated internal holdup (optional)
  • Additional power supply options available

Thermal

  • The chassis, power supply, and internal components are designed and tested to handle ambient temperatures down to -40°C and extreme high temperatures. However, high and low temperature performance is dependent on the capabilities of the installed COTS modules.

Accessories

Supports the following:

Please contact X-ES Sales at sales@xes-inc.com or by phone at +1-608-833-1155 for information on this product's accessories.

Documentation

Datasheet

To view all of the information about this product in a PDF, please download the datasheet.

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Technical Documents

SupportNet is your source for product manuals, technical support, and software downloads.

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Block Diagram

Additional Information

Product Brief
 

Rugged COTS Systems
Product Brief
 

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Datasheet
 

View the XPand6000 Series Datasheet PDF
 

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XMC/PMC Rugged Systems

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COM Express® Rugged Systems

View the full selection of COM Express® Rugged Systems
from X-ES

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Press Release
 

View the XPand6000 Series Press Release
 

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