X-ES Introduces Rugged COM Express® Module for Small Form Factor Systems
March 14th, 2012 — News
Extreme Engineering Solutions, Inc. (X-ES) has introduced the company’s first ruggedized COM Express® module, the XPedite5550, which complies with the PICMG COM Express® Compact form factor (95 mm x 95 mm) and supports an enhanced Type 5 pinout. The XPedite5550 can be hosted on a standard COM Express® carrier card, hosted on a custom carrier card built to…
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