Features
- Intel® Core™ Duo or Intel® Core™2 Duo processor
- Intel 3100 chipset
- Front-panel Gigabit Ethernet
- Front-panel RS-232 serial
- Front-panel USB 2.0
- Complies with AMC.0 and MicroTCA.0 (µTCA)
- AMC.1 x4 PCI Express Fat Pipe interface
- AMC.2 dual Gigabit Ethernet 1000Base-BX interfaces
- AMC.3 Dual SATA interfaces
- Two PC3200 SO-RDIMMs, up to 8 GB
- Up to 4 GB of NAND flash
- Up to 4 MB of Firmware Hub (FWH) storage
- AMI BIOS
- Windows XP / Vista support
- Linux LSP
- VxWorks BSP
- QNX BSP
Description
The XPedite7040 is a single-width, mid-size or full-size Advanced Mezzanine Card (AMC) single-board computer designed to provide maximum performance and I/O options while minimizing power consumption. The Ultra Low Voltage (ULV) Intel® Core™ Duo processor or Low Voltage (LV) Intel® Core™2 Duo processor provides the XPedite7040 with a significant performance-per-watt processing advantage. Additionally, the Intel 3100 chipset combines the functionalities of an integrated server-class memory controller (Northbridge) and an I/O controller (Southbridge) into a single device that is specifically intended for power- and board-space-sensitive embedded applications.
The XPedite7040 can be installed in an AdvancedTCA (ATCA) AMC.0-compliant carrier or a MicroTCA.0 (µTCA)-compliant backplane. The XPedite7040 supports an AMC.1 x4 PCI Express Fat Pipe interface, dual AMC.2 Gigabit Ethernet 1000Base-BX interfaces, and dual AMC.3 SATA interfaces. Additional serial and general-purpose I/O is provided through the backplane connector.
The XPedite7040 supports two PC3200 SO-RDIMM modules and up to 4 GB of NAND flash for ample on-card memory capacity. 4 MB of Firmware Hub (FWH) space is also supported for redundant BIOS or OS kernel storage.
Technical Specifications
Processor
- Intel Core Duo or Intel Core 2 Duo processor
- 32 KB L1 instruction/data caches
- 2 / 4 MB L2 cache
- 533-MHz or 667-MHz FSB
Memory & I/O Controller Hub
- Intel 3100
- DDR2-400 ECC SDRAM
- Up to 4 GB of NAND flash
- 4 MB of Firmware Hub (FWH) storage
AMC Backplane Interconnect
- Complies with AMC.0 and MicroTCA.0 (µTCA)
- AMC.1 x4 PCI Express Fat Pipe interface
- AMC.2 dual Gigabit Ethernet 1000Base-BX interfaces
- AMC.3 dual SATA interfaces
- Dual USB 2.0 interfaces
- RS-232/RS-422 serial interface
Front Panel I/O
- Micro DB-9 RS-232 serial port
- USB 2.0 port
- 10/100/1000Base-T Gigabit Ethernet port
Software Support
- AMI BIOS
- Windows XP / Vista support
- Linux LSP
- QNX BSP
- VxWorks BSP
Physical Characteristics
- Single-width, mid-size or full-size AMC
- Dimensions: 180 mm x 75 mm
Environmental Requirements
- Operating temperature: 0 to 55 ºC (ambient)
- Humidity: 0% to 85%
- Storage temperature: -40 to 85 ºC
Power Requirements
- Less than 30 Watts
