The XPedite2470 is a high-performance, reconfigurable, conduction- or air-cooled, 3U VPX, FPGA processing module based on the AMD (formerly Xilinx) Virtex-7 family of FPGAs. With multiple high-speed fabric interfaces, external memory, Virtex-7 FPGA, an FMC site, and high-density I/O, the XPedite2470 is ideal for customizable, high-bandwidth, signal-processing applications.
The XPedite2470’s DDR3 SDRAM and flexible I/O routing makes it perfect for high-speed, bandwidth-intensive, data-streaming applications. The card provides numerous I/O capabilities through its FMC daughter card interface, allowing access to single-ended and differential I/O and configurable GTX transceivers. An FMC daughter card can expand the capabilities of the XPedite2470 by providing technologies such as Digital Signal Processing (DSP), high-frequency Digital-to-Analog Conversion (DAC), and high-frequency Analog-to-Digital Conversion (ADC).
The XPedite2470 provides a high-performance, feature-rich solution capable of interfacing to and processing streaming data from a wide variety of sensors. The X-ES FPGA Development Kit (FDK) is provided to support the requirements of high-performance, real-time, embedded streaming data applications and simplify FPGA development. It includes IP blocks, example FPGA designs, and software to control and communicate with FPGAs.
Technical Specs
FPGA
- AMD (formerly Xilinx) Virtex-7 for high-performance logic and DSP applications
- Up to 4 GB of DDR3 SDRAM in four channels
- 128 MB of user NOR flash
Supported FPGAs
- Virtex-7 XC7VX690T (default)
- Virtex-7 XC7VX485T
- Support for commercial and industrial temperature as well as -1, -2, -3 speed grades
Development Support
FMC (VITA 57)
- FPGA LVDS I/O
- x8 GTX transceivers
- 47 LVDS GPIO
- Support for 1.8 V, 1.5 V, 1.2 V, and 1.35 V VADJ
VPX (VITA 46) P1 I/O
- x8 GTX transceivers configurable as x8 PCI Express interface to P1.A
- Three additional GTX lanes
VPX (VITA 46) P2 I/O
- Nine FGPA LVDS GPIO
- FMC GPIO
- One RS-232 serial port
Physical Characteristics
- 3U VPX-REDI conduction- or air-cooled form factor
- Dimensions: 100 mm x 160 mm
- 0.8 in. pitch without solder-side cover
- 0.85 in. and 1.0 in. pitch with solder-side cover
Environmental Requirements
Contact factory for appropriate board configuration based on environmental requirements.
- Supported ruggedization levels (see the X-ES Ruggedization Chart): 5
- Conformal coating available as an ordering option
- Contact X-ES for air-cooled development options
Power Requirements
- Power will vary based on configuration and usage. Please consult factory.
Documentation
Datasheet
To view all of the information about this product in a PDF, please download the datasheet.
Download Datasheet
Technical Documents
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