XPedite7450

The XPedite7450 is an enhanced, Type 6 COM Express™ module based on the 2nd generation Intel® Core™ i7 processor or 3rd generation Intel Core i7 processor and Intel QM67 chipset. COM Express provides a standards-based form factor to bring PC processing to a wide range of applications. The XPedite7450 is ideal for the high-bandwidth and processing-intensive requirements of today's commercial, industrial, and military applications. The small footprint and standards-based form factor make the XPedite7450 perfect for portable and rugged environments, while providing an upgrade path for the future.

The XPedite7450 accommodates up to 16 GB of DDR3 ECC SDRAM in two channels to support memory-intensive applications. The XPedite7450 also hosts numerous I/O ports and interfaces, including two dual-mode DisplayPort graphics interfaces, two x8 PCIe links, one x4 PCIe link, two x1 PCIe links, six SATA/eSATA ports, four USB 2.0 ports, HD audio link, LPC bus, SMB, I²C, and RS-232 serial.

The XPedite7450 uses the latest Unified Extensible Firmware Interface (UEFI) BIOS customized with BIT support. Wind River VxWorks and Linux Board Support Packages (BSPs) are available, as well as Microsoft Windows drivers.

• Supports 2nd generation Intel® Core™ i7 processors and 3rd generation Intel Core i7 processors
• Dual- or quad-core processor with Intel Hyper-Threading Technology
• Standard COM Express™ Basic form factor with ruggedization enhancements
• COM Express enhanced Type 6 pinout
• Up to 16 GB of DDR3-1600 ECC SDRAM in two channels
• 32 MB NOR boot flash
• Up to 16 GB of NAND flash
• Two x8 PCI Express ports
• One x4 PCI Express port
• Two x1 PCI Express ports
• Two 10/100/1000BASE-T Gigabit Ethernet ports
• Four USB 2.0 ports
• Six SATA 3.0 Gb/s ports
• Two digital display interfaces (DP/DVI/HDMI)
• Intel® High Definition Audio port
• Wind River VxWorks BSP
• Linux BSP
• Microsoft Windows drivers
• Green Hills INTEGRITY BSP (contact factory)
• QNX Neutrino BSP (contact factory)
• LinuxWorks LynxOS BSP (contact factory)

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Processor

• Quad- or Dual-core Intel® Core™ i7
• Intel Turbo Boost Technology
• Intel Hyper-Threading Technology
• AVX instruction set extensions
• Integrated with Intel QM67 chipset
• Dual-channel integrated memory controller
• Integrated high-performance 3D graphics controller

Dual-Core Processor Configurations

• Core i7-2655LE: 2.2 GHz, 4 MB cache
• Core i7-2610UE: 1.5 GHz, 4 MB cache
• Core i7-3555LE: 2.5 GHz, 4 MB cache
• Core i7-3517UE: 1.7 GHz, 4 MB cache

Quad-Core Processor Configurations

• Core i7-3612QE: 2.1 GHz, 6 MB cache

Memory

• Up to 16 GB of DDR3-1600 ECC SDRAM in two channels
• 32 MB NOR boot flash
• Up to 16 GB of NAND flash

COM Express™

• Basic form factor (95 mm x 125 mm)
• Enhanced Type 6 pinout
• Replaces LVDS with second Ethernet port and two SATA 3.0 Gb/s
• Adds non-volatile write protect
• Adds two external interrupts

Graphics

• Integrated high-performance 3D graphics controller
• Two digital display interfaces (DP/DVI/HDMI)

Interface

• Four USB 2.0 ports
• Six SATA 3.0 Gb/s ports
• Intel® High-Definition Audio port
• Two x1 Gen2 PCI Express ports
• Two x8 Gen2 PCI Express ports
• One x4 Gen2 PCI Express port
• Two serial ports
• LPC
• SMB
• I²C

Ruggedization and Reliability

• Class III PCB fabrication and assembly
• Soldered DDR3 ECC SDRAM
• Tin whisker mitigation
• Designed and tested for extended solder joint reliability
• Additional mounting holes for rugged and conduction-cooled environments
• BIT support

Software Support

• Wind River VxWorks BSP
• Linux BSP
• Microsoft Windows drivers
• QNX Neutrino BSP (contact factory)
• Green Hills INTEGRITY BSP (contact factory)
• LinuxWorks LynxOS BSP (contact factory)

Physical Characteristics

• Dimensions: 95 mm x 125 mm

Environmental Requirements

• Supported ruggedization levels (see the X-ES Ruggedization Chart): 1, 3, 5
• Conformal coating available as an ordering option

Power Requirements

• Power will vary based on CPU frequency and application. Please consult factory.