XPedite7650

Intel® Xeon® D-1500 Family Processor-Based Rugged COM Express® Basic (Type 7) Module with Dual 10 Gigabit Ethernet

The XPedite7650 is an enhanced COM Express® Type 7 mezzanine module based on the Intel® Xeon® D-1500 family of processors (formerly )Broadwell-DE).

It accommodates up to 32 GB of DDR4-2133 ECC SDRAM in two channels to support memory-intensive applications.

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XPedite7650 COM Express (Type 7) Mezzanine Module

The XPedite7650 is an enhanced, Type 7 COM Express® module based on the Intel® Xeon® D-1500 family processors (formerly Broadwell-DE). COM Express® provides a standards-based form factor to bring PC processing to a wide range of applications.

The XPedite7650 is ideal for the high-bandwidth and processing-intensive requirements of today’s commercial, industrial, and military applications. The small footprint and standards-based form factor make the XPedite7650 perfect for portable and rugged environments, while providing an upgrade path for the future.

The XPedite7650 accommodates up to 32 GB of DDR4-2133 ECC SDRAM in two channels to support memory-intensive applications. The XPedite7650 also hosts numerous I/O ports and interfaces, including 10 Gigabit Ethernet, Gigabit Ethernet, PCI Express, SATA, USB 3.0, LPC, SMB, I²C, and LVTTL serial.

Wind River VxWorks and X-ES Enterprise Linux Support Packages (XEL) are available. The XPedite7670 uses coreboot, powered by Intel®’s Firmware Support Package (FSP), to provide fast boot times and significantly simplify code traceability over legacy BIOS implementations.

Features

  • Supports Intel® Xeon® D-1500 family processors (formerly Broadwell-DE)
  • Up to 16 Xeon®-class cores in a single, power-efficient SoC package
  • 4, 8, or 12 core SKUs available with native extended temperature support
  • Standard COM Express® Basic form factor with ruggedization enhancements
  • COM Express® enhanced Type 7 pinout
  • Up to 32 GB of DDR4-2133 ECC SDRAM in two channels
  • 24 lanes of PCIe Gen3, available as one x8 PCIe interface and one x16 PCIe interface
  • Up to 8 lanes of PCIe Gen2 (eight x1 interfaces)
  • Two 10GBASE-KR Ethernet ports
  • One Gigabit Ethernet port
  • Four USB 3.0 ports
  • Two SATA ports
  • Two LVTTL serial ports
  • Wind River VxWorks BSP
  • X-ES Enterprise Linux (XEL) BSP
  • coreboot firmware powered by Intel® FSP
  • Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs, as well as Microsoft Windows drivers

Technical Specs

Processor

  • Intel® Xeon® D-1500 family processors (formerly Broadwell-DE)
  • Up to 16 Xeon®-class cores in a single, power-efficient SoC package
  • 4, 8, or 12 core SKUs available with native extended temperature support

Memory

  • Up to 32 GB of DDR4-2133 ECC SDRAM in two channels
  • Up to 32 GB of SLC NAND flash
  • 32 MB NOR boot flash
  • 64 kB EEPROM

COM Express®

  • Basic form factor (95 mm x 125 mm)
  • Enhanced Type 7 pinout
  • Adds non-volatile write protect
  • Adds two external interrupts
  • Adds boot flash select

Ruggedization and Reliability

  • Class III PCB fabrication and assembly
  • Soldered DDR4 ECC SDRAM
  • Tin whisker mitigation
  • Designed and tested for extended solder joint reliability
  • Additional mounting holes for rugged and conduction-cooled environments
  • BIT support

Interface

  • Four USB 3.0 ports
  • Two SATA ports capable of 6 Gb/s
  • Two 10GBASE-KR Ethernet ports with optional management sideband signals
  • One 10/100/1000BASE-T Ethernet port
  • One x16 PCI Express Gen3-capable interface
  • One x8 PCI Express Gen3-capable interface
  • Up to eight x1 PCI Express Gen2-capable interfaces
  • Two LVTTL serial ports
  • LPC
  • Eight GPIO interfaces

Additional Features

  • Non-volatile memory write protection
  • Trusted Platform Module (TPM)

Software Support

Physical Characteristics

  • COM Express® Basic (Type 7) form factor
  • Dimensions: 95 mm x 125 mm

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements.

  • Supported ruggedization levels (see the X-ES Ruggedization Chart): 1, 3, 5
  • Conformal coating available as an ordering option

Power Requirements

  • Power will vary based on configuration and usage. Please consult factory.

Accessories

  • XPand1404 (90073255) - Development Platform for X-ES COM Express Basic (Type 7) Modules
  • XTend218 (90072500) - Debug Module/Cable for X-ES Intel® Single Board Computers (SBCs)

Documentation

Datasheet

To view all of the information about this product in a PDF, please download the datasheet.

Download Datasheet

Technical Documents

SupportNet is your source for product manuals, technical support, and software downloads.

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Block Diagram

Additional Information

Press Release
 

View the press release for the XPedite7650
 

View Press Release

Webinar
 

Intel® Xeon® D in High Performance Computing
 

View Presentation

Datasheet
 

View the XPedite7650
Datasheet PDF
 

Download Datasheet

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