XMC MEZZANINE MODULE · SKU 90015330
XPedite8300
The XPedite8300 is a secure, high-performance XMC single board computer based on the Intel® Core™ Ultra (Series 3) processor (formerly Panther Lake).
Ideal for ruggedized systems requiring high-bandwidth processing and low power consumption, the XPedite8300 delivers superior performance and efficiency for today’s network information processing and high performance embedded computing applications.
Product Lifecycle
X-ES also offers comprehensive configuration and obsolescence management services, providing customers with direct control over non-interchangeable changes and extending product availability and serviceability well beyond standard end-of-life milestones.
Engineered for Extended Reliability
All X-ES products are designed and manufactured 100% in the USA with components from trusted supply chains in order to deliver rugged, reliable performance in the most demanding environments.
Built with components rated for extreme conditions and validated through rigorous testing, our solutions minimize obsolescence risk and lower total cost of ownership across the full program lifespan.
Introduction to XPedite8300
The XPedite8300 is a secure, high-performance XMC single board computer based on the Intel® Core™ Ultra (Series 3) processor (formerly Panther Lake).
Performance & Applications
Ideal for ruggedized systems requiring high-bandwidth processing and low power consumption, the XPedite8300 delivers superior performance and efficiency for today’s network information processing and high performance embedded computing applications.
Security & Data Protection
The XPedite8300 integrates SecureCOTS™ technology with a Microchip PolarFire™ System-on-Chip (SoC) FPGA for hosting custom functions to protect data from being modified or observed and provides an ideal solution when stringent security capabilities are required.
Memory & Storage
The XPedite8300 supports up to 64 GB of LPDDR5 SDRAM (32 GB in standard configuration) with in-band ECC in eight channels and up to 1 TB of onboard NVMe storage, with optional AES-128/256 TCG Opal 2.0 Self-Encrypting Drive (SED) support.
I/O & Connectivity
The XPedite8300 also provides fast and efficient I/O, including 10/100/1000BASE-T Ethernet, USB 3.0 and USB 2.0, PCI Express, I²C, and RS-232 or RS-422/485 serial ports.
Software Support
Wind River VxWorks, X-ES Enterprise Linux (XEL), and Linux Yocto Board Support Packages (BSPs) are available.
Processor
- Supports Intel® Core™ Ultra (Series 3) processors (formerly Panther Lake)
Memory
- Up to 64 GB of LPDDR5 SDRAM with in-band ECC (32 GB in standard configuration)
- Up to 1 TB of onboard NVMe storage with optional Self-Encrypting Drive (SED) offering AES-128/256 TCG Opal 2.0 hardware encryption support
- 64 MB NOR boot flash
- 64 kB EEPROM
Security and Management
- Microchip PolarFire™ SoC FPGA with 256 MB SPI NOR flash
- Designed with SecureCOTS™ technology to support enhanced security and trusted computing
- System voltage monitor, power-on/reset control, non-volatile write-protection control
- Trusted Platform Module (TPM) 2.0
P14 PMC Interface (Optional)
- Four RS-232 or two RS-422/485 serial ports (shared with P16)
- One I²C port
- 30 3.3 V GPIO
P15 XMC Interface
- One x8 PCI Express Gen4-capable interface
- Five 3.3 V GPIO
P16 XMC Interface
- Two 10/100/1000BASE-T Ethernet ports
- Two USB 3.0 ports
- Two USB 2.0 ports
- Four RS-232 or two RS-422/485 serial ports
- One x1 PCI Express Gen4-capable interface
- One x4 PCI Express Gen4-capable interface
- One DisplayPort++ 1.4 interface
- One I²C port
- One 3.3 V GPIO
Additional Features
- IEEE 1588 1 Pulse per Second
Software Support
- UEFI firmware
- Wind River VxWorks BSP
- X-ES Enterprise Linux (XEL) BSP
- Linux Yocto BSP
- Contact factory for availability of Microsoft Windows drivers and other operating systems
Physical Characteristics
- Conduction-cooled XMC form factor
- Dimensions: 149 mm x 74 mm, 10 mm stacking height
Environmental Requirements
Contact factory for appropriate board configuration based on environmental requirements.
- Supported ruggedization levels (see the X-ES Ruggedization Chart): 5
- Conformal coating available as an ordering option
Power Requirements
- Power will vary based on configuration and usage. Please consult factory.
Accessories
- XTend2101 (90015345) – XMC/PMC Carrier for Development and Testing
XPedite8300
Intel® Core™ Ultra (Series 3) Processor-Based XMC Module with Up to 64 GB of LPDDR5 and Microchip PolarFire™ SoC FPGA
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Datasheet
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Technical Documentation
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Intel® Core™ Ultra (Series 3) Overview
Learn more about the Intel® Core™ Ultra (Series 3) family of processors.
