COM EXPRESS MEZZANINE MODULE · SKU 90015335
XPedite8350
The XPedite8350 is an enhanced, COM Express® Basic enhanced (Type 6) module based on the Intel® Core™ Ultra (Series 3) processor (formerly Panther Lake).
Ideal for ruggedized systems requiring high-bandwidth processing and low power consumption, the XPedite8350 delivers superior performance and efficiency for today’s network information processing and high performance embedded computing applications.
Product Lifecycle
X-ES also offers comprehensive configuration and obsolescence management services, providing customers with direct control over non-interchangeable changes and extending product availability and serviceability well beyond standard end-of-life milestones.
Engineered for Extended Reliability
All X-ES products are designed and manufactured 100% in the USA with components from trusted supply chains in order to deliver rugged, reliable performance in the most demanding environments.
Built with components rated for extreme conditions and validated through rigorous testing, our solutions minimize obsolescence risk and lower total cost of ownership across the full program lifespan.
Introduction to XPedite8350
The XPedite8350 is an enhanced COM Express® Basic (Type 6) module based on the Intel® Core™ Ultra (Series 3) processor (formerly Panther Lake). COM Express® provides a standards-based form factor to bring PC processing to a wide range of applications.
Performance & Applications
Ideal for ruggedized systems requiring high-bandwidth processing and low power consumption, the XPedite8350 delivers superior performance and efficiency for today’s network information processing and high performance embedded computing applications.
Security & Data Protection
The XPedite8350 integrates SecureCOTS™ technology with a Microchip PolarFire™ System-on-Chip (SoC) FPGA for hosting custom functions to protect data from being modified or observed and provides an ideal solution when stringent security capabilities are required.
Memory & Storage
The XPedite8350 supports up to 64 GB of LPDDR5 SDRAM with in-band ECC in four channels and up to 1 TB of onboard NVMe storage, with optional AES-128/256 TCG Opal 2.0 Self-Encrypting Drive (SED) support.
I/O & Connectivity
The XPedite8350 also provides fast and efficient I/O, including 10/100/1000BASE-T Ethernet, USB 2.0, PCI Express, I²C, DisplayPort++ 1.4, and serial.
Software Support
Wind River VxWorks, X-ES Enterprise Linux (XEL), and Linux Yocto Board Support Packages (BSPs) are available.
Processor
- Supports Intel® Core™ Ultra (Series 3) processors (formerly Panther Lake)
Memory
- Up to 64 GB of LPDDR5 SDRAM with in-band ECC
- Up to 1 TB of onboard NVMe storage with optional Self-Encrypting Drive (SED) offering AES-128/256 TCG Opal 2.0 hardware encryption support
- 64 MB NOR boot flash
- 64 kB general purpose EEPROM
- 16 kB COM Express EEPROM
Security and Management
- Microchip PolarFire™ SoC FPGA with 256 MB SPI NOR flash
- Designed with SecureCOTS™ technology to support enhanced security and trusted computing
- System voltage monitor, power-on/reset control, non-volatile write-protection control
- Trusted Platform Module (TPM) 2.0
COM Express®
- Basic (Type 6) form factor (95 mm x 125 mm) with ruggedization enhancements
- Revision 3.1 pinout
- Non-volatile write-protect signal from A103 (optional)
Interface
- One 10/100/1000BASE-T Ethernet port
- Four USB 2.0 ports
- Four PCI Express Gen4-capable interfaces (contact factory for PCIe bifurcation details)
- Two DisplayPort++ 1.4 interfaces
- Two UART LVTTL serial ports
- Eight single-ended GPIO
- One general-purpose SPI interface
Software Support
- UEFI firmware
- Wind River VxWorks BSP
- X-ES Enterprise Linux (XEL) BSP
- Linux Yocto BSP
- Contact factory for availability of Microsoft Windows drivers and other operating systems
Physical Characteristics
- COM Express® Basic (Type 6) form factor with ruggedization enhancements
- Dimensions: 95 mm x 125 mm
Environmental Requirements
Contact factory for appropriate board configuration based on environmental requirements.
- Supported ruggedization levels (see the X-ES Ruggedization Chart): 1, 5
- Conformal coating available as an ordering option
- Contact X-ES for air-cooled development options
Power Requirements
- Power will vary based on configuration and usage. Please consult factory.
Accessories
- XPand1407 (90075980) – COM Express Type 6 Development Platform
- XTend230 (90072690) – Debug Module for Programming and Diagnostic Interfaces
XPedite8350
Intel® Core™ Ultra (Series 3) Processor-Based Rugged COM Express® Module with 64 GB of LPDDR5 and Microchip PolarFire™ SoC FPGA
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Datasheet
To view all of the information about this product in a PDF, please download the datasheet.
Technical Documentation
SupportNet is your source for hardware manuals, technical support, and software downloads.
Intel® Core™ Ultra (Series 3) Overview
Learn more about the Intel® Core™ Ultra (Series 3) family of processors.
COM Express® Mezzanines
View the full selection of COM Express® Mezzanine modules from X-ES.
