XPedite8300

Intel® Core™ Ultra (Series 3) Processor-Based XMC Module with 64 GB of LPDDR5 and Microchip PolarFire™ SoC FPGA

The XPedite8300 is a secure, high-performance XMC single board computer based on the Intel® Core™ Ultra processor (Series 3) (formerly Panther Lake). Ideal for ruggedized systems requiring high-bandwidth processing and low power consumption, the XPedite8300 delivers superior performance and efficiency for today's network information processing and high performance embedded computing applications.

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XPedite8300 XMC Module

The XPedite8300 is a secure, high-performance XMC single board computer based on the Intel® Core™ Ultra processor (Series 3) (formerly Panther Lake). Ideal for ruggedized systems requiring high-bandwidth processing and low power consumption, the XPedite8300 delivers superior performance and efficiency for today’s network information processing and high performance embedded computing applications.

The XPedite8300 integrates SecureCOTS™ technology with a Microchip PolarFire™ System-on-Chip (SoC) FPGA for hosting custom functions to protect data from being modified or observed and provides an ideal solution when stringent security capabilities are required.

The XPedite8300 supports up to 64 GB of LPDDR5 SDRAM with in-band ECC in eight channels and up to 1 TB of onboard NVMe storage, with optional AES-128/256 TCG Opal 2.0 Self-Encrypting Drive (SED) support. The XPedite8300 also provides fast and efficient I/O, including 10/100/1000BASE-T Ethernet, USB 3.0 and USB 2.0, PCI Express, I²C, and RS-232 or RS-422/485 serial ports.

Wind River VxWorks, X-ES Enterprise Linux (XEL), and Linux Yocto Board Support Packages (BSPs) are available.

Features

  • Supports Intel® Core™ Ultra processors (Series 3) (formerly Panther Lake)
  • Designed with SecureCOTS™ technology to support enhanced security and trusted computing
  • Microchip PolarFire™ SoC FPGA with 256 MB SPI NOR flash
  • Conduction-cooled XMC module
  • Up to 64 GB of LPDDR5 SDRAM with in-band ECC
  • Up to 1 TB of onboard NVMe storage with optional Self-Encrypting Drive (SED) offering AES-128/256 TCG Opal 2.0 hardware encryption support
  • Two 10/100/1000BASE-T Ethernet ports
  • Two USB 3.0 and two USB 2.0 ports
  • Four RS-232 or two RS-422/485 serial ports
  • One x1, one x4, and one x8 PCI Express Gen4-capable interfaces
  • One DisplayPort++ 1.4 interface
  • Wind River VxWorks BSP
  • X-ES Enterprise Linux (XEL) BSP
  • Linux Yocto BSP
  • Contact factory for availability of Microsoft Windows drivers and other operating systems

Technical Specs

Processor

  • Supports Intel® Core™ Ultra processors (Series 3) (formerly Panther Lake)

Memory

  • Up to 64 GB of LPDDR5 SDRAM with in-band ECC
  • Up to 1 TB of onboard NVMe storage with optional Self-Encrypting Drive (SED) offering AES-128/256 TCG Opal 2.0 hardware encryption support
  • 64 MB NOR boot flash
  • 64 kB EEPROM

Security and Management

  • Microchip PolarFire™ SoC FPGA with 256 MB SPI NOR flash
  • Designed with SecureCOTS™ technology to support enhanced security and trusted computing
  • System voltage monitor, power-on/reset control, non-volatile write-protection control
  • Trusted Platform Module (TPM) 2.0

P14 PMC Interface (Optional)

  • Four RS-232 or two RS-422/485 serial ports (shared with P16)
  • One I²C port
  • 30 3.3 V GPIO

P15 XMC Interface

  • One x8 PCI Express Gen4-capable interface
  • Five 3.3 V GPIO

P16 XMC Interface

  • Two 10/100/1000BASE-T Ethernet ports
  • Two USB 3.0 ports
  • Two USB 2.0 ports
  • Four RS-232 or two RS-422/485 serial ports
  • One x1 PCI Express Gen4-capable interface
  • One x4 PCI Express Gen4-capable interface
  • One DisplayPort++ 1.4 interface
  • One I²C port
  • One 3.3 V GPIO

Additional Features

  • IEEE 1588 1PPS

Software Support

  • UEFI firmware
  • Wind River VxWorks BSP
  • X-ES Enterprise Linux (XEL) BSP
  • Linux Yocto BSP
  • Contact factory for availability of Microsoft Windows drivers and other operating systems

Physical Characteristics

  • Conduction-cooled XMC form factor
  • Dimensions: 149 mm x 74 mm, 10 mm stacking height

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements.

  • Supported ruggedization levels (see the X-ES Ruggedization Chart): 5
  • Conformal coating available as an ordering option

Power Requirements

  • Power will vary based on configuration and usage. Please consult factory.

Accessories

  • XTend2101 (90015345) - XMC/PMC Carrier for Development and Testing

Documentation

Datasheet

To view all of the information about this product in a PDF, please download the datasheet.

Download Datasheet

Technical Documents

SupportNet is your source for product manuals, technical support, and software downloads.

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Block Diagram

XPedite8300 XMC Module
XPedite8300 — XMC Mezzanine Module

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Additional Information

Intel® Core™ Ultra (Series 3) Overview

Learn more about the Intel® Core™ Ultra (Series 3) family of processors

Learn More

Datasheet

View the XPedite8300
Datasheet PDF
 

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XMC/PMC Mezzanines

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