3U VPX SINGLE BOARD COMPUTER · SKU 90030400
XPedite7477
End of Life
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The XPedite7477 is a high-performance, low-power, 3U VPX-REDI, single board computer based on the 3rd generation Intel® Core™ i7 processor and Intel® QM67 chipset.
Product Lifecycle
X-ES also offers comprehensive configuration and obsolescence management services, providing customers with direct control over non-interchangeable changes and extending product availability and serviceability well beyond standard end-of-life milestones.
Engineered for Extended Reliability
All X-ES products are designed and manufactured 100% in the USA with components from trusted supply chains in order to deliver rugged, reliable performance in the most demanding environments.
Built with components rated for extreme conditions and validated through rigorous testing, our solutions minimize obsolescence risk and lower total cost of ownership across the full program lifespan.
Introduction to XPedite7477
The XPedite7477 is a high-performance, low-power, 3U VPX-REDI, single board computer based on the 3rd generation Intel® Core™ i7 processor and Intel® QM67 chipset.
High-Bandwidth Performance
With two PCI Express Fat Pipe P1 interconnects and two Gigabit Ethernet ports, the XPedite7477 is ideal for the high-bandwidth and processing-intensive demands of today’s military and avionics applications.
Floating-Point-intensive applications such as radar, image processing, and signals intelligence will benefit from the performance boost provided by the Intel® Advanced Vector Extensions (Intel® AVX).
Memory & I/O
The XPedite7477 accommodates up to 8 GB of DDR3 ECC SDRAM in two channels to support memory-intensive applications.
The XPedite7477 also hosts numerous I/O ports including Gigabit Ethernet, USB 2.0, SATA, graphics, and multiple serial ports through the backplane connectors.
Backplane Slot Flexibility
The XPedite7477 can be used in either the system slot or peripheral slot of a VPX backplane.
Remote Management
The XPedite7477 provides Intel® vPro™/AMT technology for remote management. Remote management is accessed via the P2 10/100/1000BASE-T Ethernet port.
Software Support
Wind River VxWorks and Linux Board Support Packages (BSPs) are available, as well as Microsoft Windows drivers.
Processor
- Quad-or dual-core Intel® Core™ i7
- Intel® Turbo Boost Technology
- Intel® Hyper-Threading Technology
- AVX instruction set extensions
- Integrated with Intel® QM67 chipset
- Dual-channel integrated memory controller
- Integrated high-performance 3D graphics controller
Quad-Core Processor Configurations
- Core™ i7-3612QE: 2.1 GHz, 6 MB cache
Dual-Core Processor Configurations
- Core™ i7-3555LE: 2.5 GHz, 4 MB cache
- Core™ i7-3517UE: 1.7 GHz, 4 MB cache
Memory
- Up to 8 GB of DDR3 ECC SDRAM in two channels
- 32 MB of NOR boot flash
- Up to 32 GB of NAND flash
- 16 kB EEPROM
Graphics
- Integrated high-performance 3D graphics controller
- One HDMI/DVI-D interface
VPX (VITA 46) P0 I/O
- I²C port
VPX (VITA 46) P1 I/O
- x4 PCI Express Fat Pipe interface to P1.A
- x4 PCI Express Fat Pipe interface to P1.B
- One 1000BASE-BX or 10/100/1000BASE-T Gigabit Ethernet port
- XMC x12d I/O
VPX (VITA 46) P2 I/O
- One 10/100/1000BASE-T Gigabit Ethernet port with Intel® vPro™ support
- Two SATA ports capable of 3 Gb/s
- Two USB 2.0 ports
- Six RS-232/422/485 serial ports
- One HDMI/DVI-D or Dual-Mode DisplayPort interface
- Four 3.3 V GPIO signals
XMC Site
- x8 PCI Express interface
- Two SATA ports
Additional Features
- Non-volatile memory write protection
- Optional Trusted Platform Module (TPM)
- IEEE 1588 support on one Gigabit Ethernet port
- Intel® Active Management Technology (AMT) supported by Intel® vPro™ Technology
Software Support
- Wind River VxWorks BSP
- Linux BSP
- Microsoft Windows drivers
- Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs
Physical Characteristics
- 3U VPX-REDI conduction- or air-cooled form factor
- Dimensions: 100 mm x 160 mm
- 0.8 in. pitch without solder-side cover
- 0.85 and 1.0 in. pitch with solder-side cover
Environmental Requirements
Contact factory for appropriate board configuration based on environmental requirements.
- Supported ruggedization levels (see the X-ES Ruggedization Chart): 3, 5
- Conformal coating available as an ordering option
Power Requirements
- Power will vary based on configuration and usage. Please consult factory.
Accessories
- XIt1070 (90060170) – 3U VPX Rear Transition Module with Gigabit Ethernet, SATA, USB, Serial, and DVI
- XIt1079 (90040010) – 3U VPX Rear Transition Module with Gigabit Ethernet, mSATA, USB, Serial, and DVI-D
- XPand1004 (90071810) – Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O
- XPand1200 (90070530) – 3U VPX Conduction-Cooled Development Platform
- XPand1203 (90072665) – 3U VPX Development Platform for Up to Eight Conduction-Cooled Modules
- XPand1300 (90070415) – 3U VPX Air-Cooled Development Platform
- XTend204 (90070330) – Debug Module with JTAG/Serial/LPC Cable
- XTend208 (90070630) – Debug Module with SPI/JTAG/XMega
XPedite7477
Intel® Core™ i7 Processor-Based Conduction-Cooled 3U VPX-REDI Single Board Computer (SBC)
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Datasheet
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