XPedite7477

Intel® Core™ i7 Processor-Based Conduction-Cooled 3U VPX-REDI Single Board Computer (SBC)

The XPedite7477 is a high-performance, low-power, 3U VPX-REDI, single board computer based on the 3rd generation Intel® Core™ i7 processor and Intel® QM67 chipset. With two PCI Express Fat Pipe P1 interconnects and two Gigabit Ethernet ports, the XPedite7477 is ideal for the high-bandwidth and processing-intensive demands of today's military and avionics applications.

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SKU: 90030400 Category:
XPedite7477 3U VPX-REDI SBC

The XPedite7477 is a high-performance, low-power, 3U VPX-REDI, single board computer based on the 3rd generation Intel® Core™ i7 processor and Intel® QM67 chipset. With two PCI Express Fat Pipe P1 interconnects and two Gigabit Ethernet ports, the XPedite7477 is ideal for the high-bandwidth and processing-intensive demands of today’s military and avionics applications. Floating-Point-intensive applications such as radar, image processing, and signals intelligence will benefit from the performance boost provided by the Intel® Advanced Vector Extensions (Intel® AVX).

The XPedite7477 accommodates up to 8 GB of DDR3-1600 ECC SDRAM in two channels to support memory-intensive applications. The XPedite7477 also hosts numerous I/O ports including Gigabit Ethernet, USB 2.0, SATA, graphics, and multiple serial ports through the backplane connectors.

The XPedite7477 can be used in either the system slot or peripheral slot of a VPX backplane. Wind River VxWorks and Linux Board Support Packages (BSPs) are available, as well as Microsoft Windows drivers.

The XPedite7477 provides Intel® vPro™/AMT technology for remote management. Remote management is accessed via the P2 10/100/1000BASE-T Ethernet port.

Features

  • Supports 3rd generation Intel® Core™ i7 processors
  • Quad- or dual-core processor with Intel® Hyper-Threading Technology
  • 3U VPX (VITA 46) module
  • Compatible with multiple VITA 65 OpenVPX™ profiles
  • Ruggedized Enhanced Design Implementation (REDI) per VITA 48
  • Conduction cooling
  • Up to 8 GB of DDR3L-1600 ECC SDRAM in two channels
  • Up to 32 GB of NAND flash
  • XMC interface with rear I/O
  • Two Gen2 Fat Pipe P1 fabric interconnects
  • Six RS-232/422/485 serial ports
  • One HDMI/DVI-D or Dual-Mode DisplayPort
  • Intel® vPro™/AMT support
  • Optional Trusted Platform Management (TPM)
  • Wind River VxWorks BSP
  • Linux BSP
  • Microsoft Windows drivers
  • Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs

Technical Specs

Processor

  • Quad-or dual-core Intel® Core™ i7
  • Intel® Turbo Boost Technology
  • Intel® Hyper-Threading Technology
  • AVX instruction set extensions
  • Integrated with Intel® QM67 chipset
  • Dual-channel integrated memory controller
  • Integrated high-performance 3D graphics controller

Quad-Core Processor Configurations

  • Core™ i7-3612QE: 2.1 GHz, 6 MB cache

Dual-Core Processor Configurations

  • Core™ i7-3555LE: 2.5 GHz, 4 MB cache
  • Core™ i7-3517UE: 1.7 GHz, 4 MB cache

Memory

  • Up to 8 GB of DDR3-1600 ECC SDRAM in two channels
  • 32 MB of NOR boot flash
  • Up to 32 GB of NAND flash
  • 16 kB EEPROM

Graphics

  • Integrated high-performance 3D graphics controller
  • One HDMI/DVI-D interface

VPX (VITA 46) P0 I/O

  • I²C port

VPX (VITA 46) P1 I/O

  • x4 PCI Express Fat Pipe interface to P1.A
  • x4 PCI Express Fat Pipe interface to P1.B
  • One 1000BASE-BX or 10/100/1000BASE-T Gigabit Ethernet port
  • XMC x12d I/O

VPX (VITA 46) P2 I/O

  • One 10/100/1000BASE-T Gigabit Ethernet port with Intel® vPro™ support
  • Two SATA ports capable of 3 Gb/s
  • Two USB 2.0 ports
  • Six RS-232/422/485 serial ports
  • One HDMI/DVI-D or Dual-Mode DisplayPort interface
  • Four 3.3 V GPIO signals

XMC Site

  • x8 PCI Express port
  • Two SATA ports

Additional Features

  • Non-volatile memory write protection
  • Optional Trusted Platform Module (TPM)
  • IEEE 1588 support on one Gigabit Ethernet port
  • Intel® Active Management Technology (AMT) supported by Intel® vPro™ Technology

Software Support

  • Wind River VxWorks BSP
  • Linux BSP
  • Microsoft Windows drivers
  • Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs

Physical Characteristics

  • 3U VPX-REDI conduction- or air-cooled form factor
  • Dimensions: 100 mm x 160 mm
  • 0.8 in. pitch without solder-side cover
  • 0.85 and 1.0 in. pitch with solder-side cover

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements.

  • Supported ruggedization levels (see the X-ES Ruggedization Chart): 3, 5
  • Conformal coating available as an ordering option

Power Requirements

  • Power will vary based on configuration and usage. Please consult factory.

Accessories

  • XIt1070 (90060170) - 3U VPX Rear Transition Module with Gigabit Ethernet, SATA, USB, Serial, and DVI
  • XIt1079 (90040010) - 3U VPX Rear Transition Module with Gigabit Ethernet, mSATA, USB, Serial, and DVI-D
  • XPand1004 (90071810) - Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O
  • XPand1200 (90070530) - 3U VPX Conduction-Cooled Development Platform
  • XPand1300 (90070415) - 3U VPX Air-Cooled Development Platform
  • XTend204 (90070330) - Debug Module with JTAG/Serial/LPC Cable
  • XTend208 (90070630) - Debug Module with SPI/JTAG/XMega

Documentation

Datasheet

To view all of the information about this product in a PDF, please download the datasheet.

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Technical Documents

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Block Diagram

Additional Information

Product Brief

3rd Gen Intel® 3U VPX SBCs Product Brief

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Datasheet

View the XPedite7477
Datasheet PDF

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