XPedite7478

Intel® Core™ i7 Processor-Based 3U VPX-REDI Single Board Computer (SBC) with Integrated 1553 and CAN Bus

The XPedite7478 is a high-performance, low-power, 3U VPX-REDI, single board computer based on the 3rd generation Intel® Core™ i7 processor. With an integrated dual-redundant MIL-STD-1553B interface and two CAN bus channels, the XPedite7478 maximizes native I/O while minimizing SWaP and cost.

Not Recommended for New Designs (NRND)

Please contact X-ES Sales for assistance with choosing a recommended replacement product.

Learn more about this product below »
REQUEST A QUOTE ASK A QUESTION

Contact us directly at +1 (608) 833-1155

SKU: 90030410 Category:
XPedite7478 3U VPX-REDI SBC

The XPedite7478 is a high-performance, low-power, 3U VPX-REDI, single board computer based on the 3rd generation Intel® Core™ i7 processor. With an integrated dual-redundant MIL-STD-1553B interface and two CAN bus channels, the XPedite7478 maximizes native I/O while minimizing SWaP and cost. Additionally, the XPedite7478 integrates further expansion capabilities by including support for an XMC module.

The XPedite7478 also maximizes memory density with up to 8 GB of DDR3-1600 ECC SDRAM across two channels. With two PCI Express Fat Pipe P1 interconnects and two Gigabit Ethernet ports, the XPedite7478 is ideal for processing-intensive applications requiring high-throughput communication.

Wind River VxWorks and Linux Board Support Packages (BSPs) are available, as well as Microsoft Windows drivers.

Features

  • Supports 3rd generation Intel® Core™ i7 processors
  • Dual-core processor with Intel® Hyper-Threading Technology
  • 3U VPX (VITA 46) module
  • VITA 46.11 Tier 1 and Tier 2 IPMI Controller (IPMC)
  • Compatible with multiple VITA 65 OpenVPX™ profiles
  • Ruggedized Enhanced Design Implementation (REDI) per VITA 48
  • Conduction cooling
  • Up to 8 GB of DDR3-1600 ECC SDRAM in two channels
  • Up to 32 GB of NAND flash
  • Two Gen2 Fat Pipe P1 fabric interconnects
  • One dual-redundant MIL-STD-1553B interface
  • Two CAN bus channels
  • Four serial ports
  • One DisplayPort video interface
  • Wind River VxWorks BSP
  • Linux BSP
  • Microsoft Windows drivers
  • Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks BSPs

Technical Specs

Processor

  • Quad- or dual-core Intel® Core™ i7
  • Intel® Turbo Boost Technology
  • Intel® Hyper-Threading Technology
  • AVX instruction set extensions
  • Integrated with Intel® QM77 chipset
  • Dual-channel integrated memory controller

Quad-Core Processor Configurations

  • Core™ i7-3612QE: 2.1 GHz, 6 MB cache

Dual-Core Processor Configurations

  • Core™ i7-3555LE: 2.5 GHz, 4 MB cache
  • Core™ i7-3517UE: 1.7 GHz, 4 MB cache

Memory

  • Up to 8 GB of DDR3-1600 ECC SDRAM in two channels
  • 32 MB of NOR boot flash
  • Up to 32 GB of NAND flash
  • 16 kB EEPROM
  • 4 MB MRAM

Graphics

  • Integrated high-performance 3D graphics controller
  • One DisplayPort video interface

VPX (VITA 46) P0 I/O

  • IPMI I²C port
  • VITA 46.11 (System Management on VPX)

VPX (VITA 46) P1 I/O

  • x4 PCI Express Fat Pipe interface to P1.A
  • x4 PCI Express Fat Pipe interface to P1.B
  • One 10/100/1000BASE-T Gigabit Ethernet port

VPX (VITA 46) P2 I/O

  • One 10/100/1000BASE-T Gigabit Ethernet port
  • One dual-redundant MIL-STD-1553B interface
  • Two CAN bus channels
  • Two SATA ports capable of 3 Gb/s
  • Two USB 2.0 ports
  • Two RS-232 serial ports, two RS-422/485 serial ports
  • One DisplayPort video interface
  • Isolated mono audio

Additional Features

  • Non-volatile memory write protection
  • IEEE 1588 support on two Gigabit Ethernet ports
  • VITA 46.11 Tier 1 and Tier 2 IPMI Controller (IPMC)

Software Support

  • Wind River VxWorks BSP
  • Linux BSP
  • Microsoft Windows drivers
  • Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks BSPs

Physical Characteristics

  • 3U VPX-REDI conduction- or air-cooled form factor
  • Dimensions: 100 mm x 160 mm
  • 0.8 in. pitch without solder-side cover
  • 0.85 in. and 1.0 in. pitch with solder-side cover

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements.

  • Supported ruggedization levels (see the X-ES Ruggedization Chart): 3, 5
  • Conformal coating available as an ordering option
  • Thermal performance will vary based on CPU frequency and application

Power Requirements

  • Power will vary based on configuration and usage. Please consult factory.

Accessories

  • XIt1080 (90040020) - 3U VPX Rear Transition Module (RTM) for I/O Breakout
  • XPand1004 (90071810) - 3U VPX Two-Slot Development Chassis for Conduction-Cooled Modules
  • XTend209 (90071685) - Debug Module

Documentation

Datasheet

To view all of the information about this product in a PDF, please download the datasheet.

Download Datasheet

Technical Documents

SupportNet is your source for product manuals, technical support, and software downloads.

Access SupportNet

Block Diagram

Additional Information

Product Brief

3rd Gen Intel® Core™ i7 3U VPX SBCs Product Brief

View Brief

Datasheet

View the XPedite7478
Datasheet PDF

Download Datasheet

3U VPX SBCs

View the full selection of 3U VPX SBCs from X-ES

View All
Back to Top
Fast, Flexible, and Customer-Focused Embedded Solutions
© 2018 Extreme Engineering Solutions, Inc