3U VPX SINGLE BOARD COMPUTER · SKU 90030190
XPedite7470
End of Life
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The XPedite7470 is a high-performance, low-power, 3U VPX-REDI, single board computer based on the 2nd and 3rd generation Intel® Core™ i7 processor and the Intel® QM67 chipset.
Product Lifecycle
X-ES also offers comprehensive configuration and obsolescence management services, providing customers with direct control over non-interchangeable changes and extending product availability and serviceability well beyond standard end-of-life milestones.
Engineered for Extended Reliability
All X-ES products are designed and manufactured 100% in the USA with components from trusted supply chains in order to deliver rugged, reliable performance in the most demanding environments.
Built with components rated for extreme conditions and validated through rigorous testing, our solutions minimize obsolescence risk and lower total cost of ownership across the full program lifespan.
Introduction to XPedite7470
The XPedite7470 is a high-performance, low-power, 3U VPX-REDI, single board computer based on the 2nd and 3rd generation Intel® Core™ i7 processor and the Intel® QM67 chipset.
High-Bandwidth Performance
With two PCI Express Fat Pipe P1 interconnects and two Gigabit Ethernet ports, the XPedite7470 is ideal for the high-bandwidth and processing-intensive demands of today’s military and avionics applications.
Intel® AVX
Floating-Point-intensive applications such as radar, image processing, and signals intelligence will benefit from the performance boost provided by the Intel® Advanced Vector Extensions (Intel® AVX) incorporated into the Intel® Core™ i7 processor.
Memory
The XPedite7470 accommodates up to 8 GB of DDR3 ECC SDRAM in two channels to support memory-intensive applications.
I/O Connectivity
The XPedite7470 also hosts numerous I/O ports including Gigabit Ethernet, USB 2.0, SATA, graphics, and RS-232/422/485 through the backplane connectors.
The XPedite7470 can be used in either the system slot or peripheral slot of a VPX backplane.
Software Support
Wind River VxWorks and Linux Board Support Packages (BSPs) are available, as well as Microsoft Windows drivers.
Processor
- Quad- or dual-core Intel® Core™ i7
- Intel® Turbo Boost Technology
- Intel® Hyper-Threading Technology
- AVX instruction set extensions
- Integrated with Intel® QM67 chipset
- Dual-channel integrated memory controller
- Integrated high-performance 3D graphics controller
Quad-Core Processor Configurations
- Core™ i7-3612QE: 2.1 GHz, 6 MB cache
Dual-Core Processor Configurations
- Core™ i7-2655LE: 2.2 GHz, 4 MB cache
- Core™ i7-2610UE: 1.5 GHz, 4 MB cache
- Core™ i7-3555LE: 2.5 GHz, 4 MB cache
- Core™ i7-3517UE: 1.7 GHz, 4 MB cache
Memory
- Up to 8 GB of DDR3 ECC SDRAM in two channels
- 32 MB of NOR boot flash
- Up to 16 GB of NAND flash
Graphics
- Integrated high-performance 3D graphics controller
- Two HDMI/DVI-D or Dual-Mode DisplayPort interfaces
VPX (VITA 46) P0 I/O
- I²C port
VPX (VITA 46) P1 I/O
- x4 PCI Express Fat Pipe interface to P1.A
- x4 PCI Express Fat Pipe interface to P1.B
- Two 1000BASE-BX Gigabit Ethernet ports (or one 10/100/1000BASE-T port to P1 and one port to P2)
- XMC P16 I/O, mapping P1w9-X12d per VITA 46.9
VPX (VITA 46) P2 I/O
- One 10/100/1000BASE-T Gigabit Ethernet port
- Two SATA ports capable of 3 Gb/s
- Two USB 2.0 ports
- Up to two RS-232/422/485 serial ports
- 3.3 V GPIO signals
- Two HDMI/DVI-D or Dual-Mode DisplayPort interfaces
- Optional I/O can be replaced by a subset of P2w1-P64s I/O, Wafer 1-8 is NC
XMC/PMC Site
- 32-bit, 33 MHz PCI bus (PMC interface)
- x4 PCIe port (XMC interface)
- Two SATA ports capable of 6 Gb/s (XMC interface)
Security and Management
- Optional Trusted Platform Module (TPM)
- Non-volatile memory write protection
Software Support
- Wind River VxWorks BSP
- Linux BSP
- Microsoft Windows drivers
- Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs
Physical Characteristics
- 3U VPX-REDI conduction- or air-cooled form factor
- Dimensions: 100 mm x 160 mm
- 0.8 in. pitch without solder-side cover
- 0.85 in. and 1.0 in. pitch with solder-side cover
Environmental Requirements
Contact factory for appropriate board configuration based on environmental requirements.
- Supported ruggedization levels (see the X-ES Ruggedization Chart): 3, 5
- Conformal coating available as an ordering option
Power Requirements
- Power will vary based on configuration and usage. Please consult factory.
Accessories
- XIt1070 (90060170) – 3U VPX Rear Transition Module with Gigabit Ethernet, SATA, USB, Serial, and DVI
- XPand1004 (90071810) – Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O
- XPand1200 (90070530) – 3U VPX Conduction-Cooled Development Platform
- XPand1203 (90072665) – 3U VPX Development Platform for Up to Eight Conduction-Cooled Modules
- XPand1300 (90070415) – 3U VPX Air-Cooled Development Platform
- XPand1303 (90030190) – 3U VPX Development Platform for Up to Eight Air-Cooled Modules
- XTend204 (90070330) – Debug Module with JTAG/Serial/LPC Cable
- XTend208 (90070630) – Debug Module with SPI/JTAG/XMega
XPedite7470
Intel® Core™ i7 Processor-Based Conduction- or Air-Cooled 3U VPX-REDI Single Board Computer (SBC)
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Datasheet
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