XPedite7479

3rd Gen Intel® Core™ i7 Processor-Based 3U VPX Module with Full XMC J16 I/O Routing

The XPedite7479 is a high-performance, low-power, 3U VPX-REDI, single board computer based on the 3rd generation Intel® Core™ i7 processor and Intel® QM67 chipset.

With two PCI Express Fat Pipe P1 interconnects and two Gigabit Ethernet ports, the XPedite7479 is ideal for the high-bandwidth and processing-intensive demands of today's military and avionics applications.

Not Recommended for New Designs (NRND)

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SKU: 90030475 Category:
XPedite7479 3U VPX SBC

The XPedite7479 is a high-performance, low-power, 3U VPX-REDI, single board computer based on the 3rd generation Intel® Core™ i7 processor and Intel® QM67 chipset. With two PCI Express Fat Pipe P1 interconnects and two Gigabit Ethernet ports, the XPedite7479 is ideal for the high-bandwidth and processing-intensive demands of today’s military and avionics applications.

Floating-Point-intensive applications such as radar, image processing, and signals intelligence will benefit from the performance boost provided by the Intel® Advanced Vector Extensions (Intel® AVX).

The XPedite7479 accommodates up to 8 GB of DDR3L-1600 ECC SDRAM in two channels to support memory-intensive applications. The XPedite7479 also hosts numerous I/O ports including Gigabit Ethernet, USB 2.0, SATA, Dual-Mode DisplayPort, and two serial ports through the backplane connectors.

The XPedite7479 can be used in either the system slot or peripheral slot of a VPX backplane. Wind River VxWorks, X-ES Enterprise Linux (XEL), and Linux Board Support Packages (BSPs) are available, as well as Microsoft Windows drivers.

Features

  • Supports 3rd generation Intel® Core™ i7 processors
  • Quad- or dual-core processor with Intel® Hyper-Threading Technology
  • 3U VPX (VITA 46) module
  • Compatible with multiple VITA 65 OpenVPX™ profiles
  • Ruggedized Enhanced Design Implementation (REDI) per VITA 48
  • Conduction cooling
  • Up to 8 GB of DDR3L-1600 ECC SDRAM in two channels
  • Up to 32 GB of NAND flash
  • XMC interface with full X12d+X8d+X24s rear I/O
  • Two Gen2 Fat Pipe P1 fabric interconnects
  • Two RS-232/422/485 serial ports
  • One HDMI/DVI-D port or Dual-Mode DisplayPort (optional)
  • Optional Trusted Platform Management (TPM)
  • Wind River VxWorks BSP
  • X-ES Enterprise Linux (XEL) BSP
  • Linux BSP
  • Microsoft Windows drivers
  • Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs

Technical Specs

Processor

  • Quad- or dual-core Intel® Core™ i7
  • Intel® Turbo Boost Technology
  • Intel® Hyper-Threading Technology
  • AVX instruction set extensions
  • Integrated with Intel® QM67 chipset
  • Dual-channel integrated memory controller
  • Integrated high-performance 3D graphics controller

Quad-Core Processor Configurations

  • Core™ i7-3612QE: 2.1 GHz, 6 MB cache

Dual-Core Processor Configurations

  • Core™ i7-3555LE: 2.5 GHz, 4 MB cache
  • Core™ i7-3517UE: 1.7 GHz, 4 MB cache

Memory

  • Up to 8 GB of DDR3L-1600 ECC SDRAM in two channels
  • 32 MB of NOR boot flash
  • Up to 32 GB of NAND flash
  • 16 kB EEPROM

Graphics

  • Integrated high-performance 3D graphics controller
  • One HDMI/DVI-D port or Dual-Mode DisplayPort (optional)

VPX (VITA 46) P0 I/O

  • I²C port

VPX (VITA 46) P1 I/O

  • x4 PCI Express Fat Pipe interface to P1.A
  • x4 PCI Express Fat Pipe interface to P1.B
  • Four 1000BASE-X or two 10/100/1000BASE-T Gigabit Ethernet ports
  • Up to two SATA ports capable of 3 Gb/s
  • Up to two SATA ports capable of 6 Gb/s
  • Up to two USB 2.0 ports
  • One HDMI/DVI-D port or Dual-Mode DisplayPort (optional)

VPX (VITA 46) P2 I/O

  • Two RS-232/422/485 serial ports
  • XMC X12d+X8d+X24s I/O

XMC Site

  • x8 PCI Express port

Additional Features

  • Non-volatile memory write protection
  • Optional Trusted Platform Module (TPM)
  • IEEE 1588 support on one Gigabit Ethernet port

Software Support

  • Wind River VxWorks BSP
  • X-ES Enterprise Linux (XEL) BSP
  • Linux BSP
  • Microsoft Windows drivers
  • Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs

Physical Characteristics

  • 3U VPX-REDI conduction-cooled form factor
  • Dimensions: 100 mm x 160 mm
  • 0.8 in. pitch without solder-side cover
  • 0.85 and 1.0 in. pitch with solder-side cover

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements.

  • Supported ruggedization levels (see the X-ES Ruggedization Chart): 5
  • Conformal coating available as an ordering option

Power Requirements

  • Power will vary based on configuration and usage. Please consult factory.

Accessories

Documentation

Datasheet

To view all of the information about this product in a PDF, please download the datasheet.

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Technical Documents

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Block Diagram

Additional Information

Board Support

X-ES Enterprise Linux (XEL) Board Support Package

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Datasheet

View the XPedite7479
Datasheet PDF

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