XPedite2470

3U VPX Xilinx Virtex-7 FPGA Module with FMC Site and NXP (formerly Freescale) QorIQ P1010 Processor

The XPedite2470 is a high-performance, reconfigurable, conduction- or air-cooled, 3U VPX, FPGA processing module based on the Xilinx Virtex-7 family of FPGAs. With multiple high-speed fabric interfaces, external memory, Virtex-7 FPGA, an FMC site, and high-density I/O, the XPedite2470 is ideal for customizable, high-bandwidth, signal-processing applications.

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XPedite2470 3U VPX FPGA

The XPedite2470 is a high-performance, reconfigurable, conduction- or air-cooled, 3U VPX, FPGA processing module based on the Xilinx Virtex-7 family of FPGAs. With multiple high-speed fabric interfaces, external memory, Virtex-7 FPGA, an FMC site, and high-density I/O, the XPedite2470 is ideal for customizable, high-bandwidth, signal-processing applications.

The XPedite2470’s DDR3L SDRAM and flexible I/O routing makes it perfect for high-speed, bandwidth-intensive, data-streaming applications. The card provides numerous I/O capabilities through its FMC daughter card interface, allowing access to single-ended and differential I/O and configurable GTX transceivers. An FMC daughter card can expand the capabilities of the XPedite2470 by providing technologies such as Digital Signal Processing (DSP), high-frequency Digital-to-Analog Conversion (DAC), and high-frequency Analog-to-Digital Conversion (ADC).

The XPedite2470 supports a high-performance Freescale P1010 QorIQ processor. With a Power Architecture® e500 core running at up to 800 MHz, the P1010 provides hybrid signal processing with the combination of an FPGA and a general-purpose processor on one 3U VPX module. With the flexibility of the FMC interface, high-speed streaming data can be brought directly into the FPGA and processed, then transferred over a high-speed PCIe interface to the P1010 processor for further processing and analysis.

The XPedite2470 provides a high-performance, feature-rich solution capable of interfacing to and processing streaming data from a wide variety of sensors. The X-ES FPGA Development Kit (FDK) is provided to support the requirements of high-performance, real-time, embedded streaming data applications and simplify FPGA development. It includes IP blocks, example FPGA designs, and software to control and communicate with FPGAs. A Linux Board Support Package (BSP) is available.

Features

  • Xilinx Virtex-7 FPGA XC7VX485T
  • 3U VPX (VITA 46) module
  • FMC-compliant carrier card (VITA 57) with High Pin Count (HPC) connector
  • Freescale QorIQ P1010 processor with one Power Architecture® e500 core at up to 800 MHz
  • Up to 512 MB of DDR3L-800 ECC SDRAM for P1010
  • Up to 16 GB of SPI flash (with redundancy) for P1010
  • Up to 1 GB of NAND flash for P1010
  • Four channels of x32 DDR3L SDRAM, up to 1 GB each for FPGA
  • 128 MB of user NOR flash for FPGA
  • LVDS and high-speed GTX transceiver connectivity between FPGA and FMC
  • One MicroSD socket
  • x1 PCI Express P1010 to FPGA interconnect
  • Two SerDes Gigabit Ethernet P1 fabric interconnects (P1010)
  • Optional 10/100/1000BASE-T Ethernet port (P1010)
  • Eight high-speed GTX lanes to FMC
  • Eleven high-speed GTX lanes to P1 fabric interconnect
  • Up to two RS-232/422/485 serial P2 ports (P1010)
  • One USB 2.0 port (P1010)
  • FPGA Development Kit (FDK)
  • Linux BSP

Technical Specs

FPGA

  • Xilinx Virtex-7 for high-performance logic and DSP applications
  • Up to 4 GB of DDR3L SDRAM in four channels
  • 128 MB of user NOR flash

Supported FPGAs

  • Xilinx Virtex-7 XC7VX330T
  • Xilinx Virtex-7 XC7VX415T
  • Xilinx Virtex-7 XC7VX485T (default)
  • Xilinx Virtex-7 XC7VX690T
  • Support for commercial and industrial temperature as well as -1, -2, -3 speed grades

FMC (VITA 57)

  • FPGA LVDS I/O
  • x8 GTX transceivers
  • FPGA and processor GPIO via I²C expanders
  • VPX GPIO
  • RS-232/485 serial ports
  • SPI and I²C interfaces
  • Support for 1.8 V, 1.5 V, 1.2 V, and 1.35 V VADJ

Processor

  • Freescale QorIQ P1010 processor
  • Power Architecture® e500 core at up to 800 MHz
  • 256 kB L2 cache
  • Up to 512 MB of DDR3L-800 ECC SDRAM
  • Up to 16 MB of NOR flash (with redundancy)
  • Up to 1 GB of NAND flash

VPX (VITA 46) P1 I/O

  • Up to x8 PCI Express P1.A
  • Three additional GTX lanes
  • Two SerDes Gigabit Ethernet ports (or one SerDes port out P1 and one 10/100/1000BASE-T port out P2)

VPX (VITA 46) P2 I/O

  • One 10/100/1000BASE-T port (when two SerDes Gigabit Ethernet P1 ports are not used)
  • Up to two RS-232/422/485 serial ports
  • One USB 2.0 port
  • 3.3 V GPIO signals
  • FGPA LVDS GPIO
  • P1010 GPIO
  • FMC GPIO

Development Support

Physical Characteristics

  • 3U VPX-REDI conduction- or air-cooled form factor
  • Dimensions: 100 mm x 160 mm
  • 0.8 in. pitch without solder-side cover
  • 0.85 in. and 1.0 in. pitch with solder-side cover

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements.

  • Supported ruggedization levels (see the X-ES Ruggedization Chart): 1, 3, 5
  • Conformal coating available as an ordering option

Power Requirements

  • Power will vary based on configuration and usage. Please consult factory.

Accessories

  • XTend210 (90071260) - Debug Module for FPGA Cards
  • XIt1070 (90060170) - 3U VPX RTM with Gigabit Ethernet, SATA, USB, Serial, and DVI

Documentation

Datasheet

To view all of the information about this product in a PDF, please download the datasheet.

Download Datasheet

Technical Documents

SupportNet is your source for product manuals, technical support, and software downloads.

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Block Diagram

Additional Information

Board Support

X-ES FPGA Development Kit (FDK) Overview

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Datasheet

View the XPedite2470
Datasheet PDF

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