XMC FPGA MODULE  ·  SKU 90015260

XPedite2600

The XPedite2600 is a configurable, high-performance, conduction- or air-cooled XMC module based on the AMD Zynq™ UltraScale+™ family of MPSoC devices.

These devices provide specialized processing elements ideal for next-generation wired and 5G wireless infrastructure, cloud computing, and aerospace and defense applications.

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XPedite2600 | XMC FPGA Module

 

01At a Glance

Form Factor
XMC
Rugged, SWaP-optimized design

FPGA
AMD Zynq™ UltraScale+™
XCZU11EG MPSoC

Memory
16 GB DDR4 ECC SDRAM
In two channels

Ruggedization
Level 5
Conduction-cooled

Product Lifecycle

X-ES also offers comprehensive configuration and obsolescence management services, providing customers with direct control over non-interchangeable changes and extending product availability and serviceability well beyond standard end-of-life milestones.

Engineered for Extended Reliability

All X-ES products are designed and manufactured 100% in the USA with components from trusted supply chains in order to deliver rugged, reliable performance in the most demanding environments.

Built with components rated for extreme conditions and validated through rigorous testing, our solutions minimize obsolescence risk and lower total cost of ownership across the full program lifespan.

 

02Core Capabilities

Introduction to XPedite2600

The XPedite2600 is a configurable, high-performance, conduction- or air-cooled XMC module based on the AMD (formerly Xilinx) Zynq™ UltraScale+™ family of MPSoC devices.

Specialized Processing

These AMD Zynq™ UltraScale+ devices provide specialized processing elements ideal for next-generation wired and 5G wireless infrastructure, cloud computing, and aerospace and defense applications.

Heterogeneous Compute

The Zynq™ UltraScale+™ XCZU11EG MPSoC combines a quad-core ARM® Cortex™-A53 platform with dual-core Cortex™-R5 real-time processors, a Mali™-400 MP2 graphics processing unit, and 16 nm FinFET+ programmable logic.

High-Speed Serial I/O

The XPedite2600 is capable of interfacing to and processing streaming data from a wide variety of inputs. It provides four High-Speed Serial ports from the FPGA and four High-Speed Serial ports from the Zynq™ processor subsystem, the latter featuring integrated support for multiple protocols such as SATA, Gigabit Ethernet, USB 3.0, and DisplayPort.

Additional I/O

Other interfaces on the P16 connector include Gigabit Ethernet, USB 2.0, serial, and LVDS I/O. Additional LVDS I/O is available via an optional P14 connector.

Development Support

The X-ES FPGA Development Kit (FDK) is provided to jump-start application development with a full suite of IP blocks, HDL, test benches, Linux drivers, and complete example designs for the XPedite2600.

 

03Block Diagram

 

04Technical Specifications

MPSoC

  • AMD (formerly Xilinx) Zynq™ UltraScale+™ MPSoC XCZU11EG
  • Quad-core ARM® Cortex™-A53 platform running at up to 1.5 GHz
  • Dual-core ARM® Cortex™-R5 real-time processors
  • ARM® Mali™-400 MP2 graphics processing unit
  • 16 nm FinFET+ programmable logic

Memory

  • Up to 16 GB of DDR4 ECC SDRAM in two 64-bit channels
  • 64 GB of Micron eMMC flash
  • Dual-QSPI FPGA configuration flash

XMC Site

  • One x8 PCI Express Gen3 interface

P14 User I/O (Optional)

  • 32 LVDS user I/O to FPGA

P15 I/O

  • x8 PCI Express Gen3 interface compliant with VITA 42.3

P16 I/O

  • Four PL MGT High-Speed Serial ports from FPGA
  • Four PS GTR High-Speed Serial ports from Zynq™ processor subsystem with integrated support for multiple protocols
  • Two 1000BASE-X Ethernet ports or one 10/100/1000BASE-T Ethernet port
  • One I²C port
  • Two RS-232/422/485 serial ports
  • Two USB 2.0 ports
  • Nine LVDS user I/O to FPGA

Development Support

  • X-ES FPGA Development Kit (FDK)
  • Linux drivers

Physical Characteristics

  • Conduction- or air-cooled XMC form factor
  • Dimensions: 149 mm x 74 mm

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements.

  • Supported ruggedization levels (see the X-ES Ruggedization Chart): 5
  • Conformal coating available as an ordering option
  • Contact X-ES for air-cooled development options

Power Requirements

  • Power will vary based on configuration and usage. Please consult factory.

Accessories

  • XIt1095 (90040090) – 3U VPX Rear Transition Module for XPedite2600 with Ethernet, eSATA, Serial, and USB
  • XTend210 (90071260) – Debug Module for AMD (formerly Xilinx) FPGA-Based Cards

 

XPedite2600 is also available as a fully customizable, derivative design.

Through our derivative design services, X-ES can modify the standard pinout, I/O, form factor, and other key attributes to meet specific requirements, providing the proven performance of a COTS foundation with the tailored fit of a custom solution.

 

05Request Information

XPedite2600 | XMC FPGA Module

XPedite2600

AMD (formerly Xilinx) Zynq™ UltraScale+™ MPSoC-Based Conduction- or Air-Cooled XMC Module

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06Documentation & Resources

Access technical documentation, board support packages, software, and other resources for working with the XPedite2600. All X-ES products are backed by our four-hour customer support guarantee.

Datasheet

To view all of the information about this product in a PDF, please download the datasheet.

Download Datasheet

Technical Documentation

SupportNet is your source for hardware manuals, technical support, and software downloads.

Access SupportNet

Board Support

X-ES FPGA Development Kit (FDK) Overview.

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XMC FPGAs

View the full selection of XMC FPGA Modules from X-ES.

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07Related Products

 

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