XPand3200 Series

Sub-½ ATR, Conduction-Cooled Chassis for Conduction-Cooled Modules

Depending on your processing requirements, XPand3200 Series systems can be populated with high-performance, low-power 3U VPX or 3U cPCI modules designed and manufactured by X-ES.

X-ES also has an extensive lineup of XMC and PMC solutions to fulfill your data-processing and I/O requirements. Additionally, X-ES provides integration services for third-party modules.

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XPand3200 Series Rugged System

The XPand3200 Series redefines the limits of power, performance, and functionality in a sub-½ ATR chassis. XPand3200 Series systems are based on a conduction-cooled, fully ruggedized chassis designed to meet the rigorous standards of MIL-STD-810 while integrating the latest power-saving and performance-enhancing technology. In today’s avionics and ruggedized environments, size really does matter, and the XPand3200 Series sets a new standard for sub-½ ATR computing.

Depending on your processing requirements, XPand3200 Series systems can be populated with high-performance, low-power 3U VPX or 3U cPCI modules designed and manufactured by X-ES. X-ES also has an extensive lineup of conduction-cooled XMC and PMC solutions to fulfill your data-processing and I/O requirements. Additionally, X-ES provides integration services for third-party modules.

An optional SATA Solid-State Drive (SSD) memory module provides the convenience of removable storage and the ruggedness of solid-state memory at up to 64 GB. An optional front-panel USB port provides system monitoring and maintenance capabilities. X-ES maximizes power supply performance, supporting up to 200 W from a MIL-STD-704 28 VDC or 115 VAC input. Internal EMI filtering and hold-up for up to 60 ms at 200 W are also provided.

Features

  • ½ ATR-compliant, conduction-cooled chassis (reduced height and length)
  • Physical dimensions of 8.75 in. (L) x 4.88 in. (W) x 5.62 in. (H)
  • 3U VPX and 3U cPCI backplanes available
  • Five conduction-cooled 3U VPX or 3U CompactPCI slots and one power supply slot
  • Configurable front panel I/O connectors
  • SATA Solid-State Drive (SSD) memory module with easy removal and insertion (optional)
  • Select from an extensive lineup of X-ES designed and manufactured SBC, FPGA, and I/O modules
  • Integration services with third-party modules available
  • Up to 200 W from a MIL-STD-704 28 VDC or 115 VAC source
  • MIL-STD-461E/F EMI filtering
  • Environmentally sealed
  • Internal holdup of up to 60 ms at 200 W

Technical Specs

Physical Characteristics

  • ½ ATR-compliant, conduction-cooled chassis (reduced height and length)
  • Dimensions: 8.75 in. (L) x 4.88 in. (W) x 5.62 in. (H)

Backplane Options

  • 3U VPX
  • 3U cPCI
  • Custom backplane solutions available

Front Panel I/O Options

  • USB 2.0- and 1.0-compliant interface
  • Three user-defined push buttons
  • Removable SATA SSD storage media bay with high-reliability connector
  • Custom front panel I/O

Back Panel I/O Options

  • Up to three D38999 circular connectors for I/O
  • DVI graphics interfaces
  • USB 2.0- and 1.0-compliant interfaces
  • 10/100/1000BASE-T Gigabit Ethernet interfaces
  • RS-232/422 serial links
  • MIL-STD-1553
  • ARINC 429
  • Custom I/O via XMC/PMC modules
  • Custom I/O via third-party modules

Power Supply Options

  • MIL-STD-704 28 VDC input voltage support (default)
  • MIL-STD-704 115 VAC input voltage support
  • Up to 60 ms internal hold-up time at 200 W
  • Up to 110  ms internal hold-up time at 120 W
  • Additional power supply options available

Accessories

Supports the following:

Please contact X-ES Sales at sales@xes-inc.com or by phone at +1-608-833-1155 for information on this product's accessories.

Documentation

Datasheet

To view all of the information about this product in a PDF, please download the datasheet.

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Technical Documents

SupportNet is your source for product manuals, technical support, and software downloads.

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Block Diagram

Additional Information

Datasheet

View the XPand3200 Series Datasheet PDF

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Press Release

View the XPand3200 Series Press Release

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