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Rugged Intel 3U VPX Core i7 SBC for the harshest military applications.

XPedite7470

Intel® Core™ i7 Processor-Based 3U Conduction- or Air-Cooled VPX-REDI Module

The XPedite7470 is a high-performance, low-power, 3U VPX-REDI, single board computer based on the 2nd and 3rd generation Intel® Core™ i7 processor and the Intel QM67 chipset. With two PCI Express Fat Pipe P1 interconnects and two Gigabit Ethernet ports, the XPedite7470 is ideal for the high-bandwidth and processing-intensive demands of today's military and avionics applications. Floating-point-intensive applications such as radar, image processing, and signals intelligence will benefit from the performance boost provided by the Intel Advanced Vector Extensions (Intel AVX) incorporated into the Intel Core i7 processor.

The XPedite7470 accommodates up to 8 GB of DDR3-1600 ECC SDRAM in two channels to support memory-intensive applications. The XPedite7470 also hosts numerous I/O ports including Gigabit Ethernet, USB 2.0, SATA 3.0 Gb/s, graphics, and RS-232/422/485 through the backplane connectors.

The XPedite7470 can be used in either the system slot or peripheral slot of a VPX backplane. Wind River VxWorks and Linux Board Support Packages (BSPs) are available, as well as Microsoft Windows drivers.

  • Supports 2nd generation Intel® Core™ i7 processors and 3rd generation Intel Core i7 processors
  • Dual- or quad-core processor with Intel® Hyper-Threading Technology
  • 3U VPX (VITA 46) module
  • OpenVPX™ standards based
  • Ruggedized Enhanced Design Implementation (REDI) per VITA 48
  • Conduction or air cooling
  • Up to 8 GB of DDR3-1600 ECC SDRAM in two channels
  • 32 MB of NOR boot flash
  • Up to 16 GB of NAND flash
  • PMC/XMC interface with rear I/O and limited front-panel I/O support
  • Two Gen2 Fat Pipe P1 fabric interconnects
  • Two RS-232/422/485 serial ports
  • Two HDMI/DVI-D or Dual-Mode DisplayPort
  • Two XMC (P16) SATA 6.0 Gb/s ports for storage mezzanine
  • Two SATA 3.0 Gb/s ports and two USB 2.0 ports
  • Wind River VxWorks BSP
  • Linux BSP
  • Microsoft Windows drivers
  • Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LinuxWorks LynxOS BSPs
XPedite7470 Block Diagram

Click on the image above to view a larger version.

Processor

  • Quad- or Dual-core Intel® Core™ i7
  • Intel Turbo Boost Technology
  • Intel Hyper-Threading Technology
  • AVX instruction set extensions
  • Integrated with Intel QM67 chipset
  • Dual-channel integrated memory controller
  • Integrated high-performance 3D graphics controller

Dual-Core Processor Configurations

  • Core i7-2655LE: 2.2 GHz, 4 MB cache
  • Core i7-2610UE: 1.5 GHz, 4 MB cache
  • Core i7-3555LE: 2.5 GHz, 4 MB cache
  • Core i7-3517UE: 1.7 GHz, 4 MB cache

Quad-Core Processor Configurations

  • Core i7-3612QE: 2.1 GHz, 6 MB cache

Memory

  • Up to 8 GB of DDR3-1600 ECC SDRAM in two channels
  • 32 MB of NOR boot flash
  • Up to 16 GB of NAND flash

Graphics

  • Integrated high-performance 3D graphics controller
  • Two HDMI/DVI-D or Dual-Mode DisplayPort

VPX (VITA 46) P0 I/O

  • I²C port

VPX (VITA 46) P1 I/O

  • x4 PCI Express Fat Pipe interface to P1.A
  • x4 PCI Express Fat Pipe interface to P1.B
  • Two 1000BASE-BX Gigabit Ethernet ports (or one 10/100/1000BASE-T port to P1 and one port to P2)
  • XMC P16 I/O, mapping P1w9-X12d per VITA 46.9

VPX (VITA 46) P2 I/O

  • One 10/100/1000BASE-T Gigabit Ethernet port
  • Two SATA 3.0 Gb/s ports
  • Two USB 2.0 ports
  • Up to two RS-232/422/485 serial ports
  • 3.3 V GPIO signals
  • Two HDMI/DVI-D or Dual-Mode DisplayPort
  • Optional I/O can be replaced by a subset of P2w1-P64s I/O, Wafer 1-8 is NC

PMC/XMC Site

  • 32-bit, 33 MHz PCI bus (PMC interface)
  • x4 PCIe port (XMC interface)
  • Two SATA 6.0 Gb/s ports (XMC interface)

Security and Management

  • Optional Trusted Platform Module (TPM)
  • Non-volatile memory write protection

Software Support

  • Wind River VxWorks BSP
  • Linux BSP
  • Microsoft Windows drivers
  • Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LinuxWorks LynxOS BSPs

Physical Characteristics

  • 3U VPX-REDI conduction- or air-cooled form factor
  • Dimensions: 100 mm x 160 mm
  • 0.8 in. pitch without solder side cover
  • 0.85 and 1.0 in. pitch with solder side cover

Environmental Requirements

  • Supported ruggedization levels (see the X-ES Ruggedization Chart): 1, 3, 5
  • Conformal coating available as an ordering option

Power Requirements

  • Power will vary based on CPU frequency and application. Please consult factory.