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Rugged Intel® Core™ i7 3U VPX SBC for the harshest military applications.

XPedite7470 Intel Core i7 3U VPX-REDI Single Board Computer SBC

XPedite7470

Intel® Core™ i7 Processor-Based Conduction- or Air-Cooled 3U VPX-REDI Module

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The XPedite7470 is a high-performance, low-power, 3U VPX-REDI, single board computer based on the 2nd and 3rd generation Intel® Core™ i7 processor and the Intel® QM67 chipset. With two PCI Express Fat Pipe P1 interconnects and two Gigabit Ethernet ports, the XPedite7470 is ideal for the high-bandwidth and processing-intensive demands of today's military and avionics applications. Floating-point-intensive applications such as radar, image processing, and signals intelligence will benefit from the performance boost provided by the Intel® Advanced Vector Extensions (Intel® AVX) incorporated into the Intel® Core™ i7 processor.

The XPedite7470 accommodates up to 8 GB of DDR3-1600 ECC SDRAM in two channels to support memory-intensive applications. The XPedite7470 also hosts numerous I/O ports including Gigabit Ethernet, USB 2.0, SATA 3.0 Gb/s, graphics, and RS-232/422/485 through the backplane connectors.

The XPedite7470 can be used in either the system slot or peripheral slot of a VPX backplane. Wind River VxWorks and Linux Board Support Packages (BSPs) are available, as well as Microsoft Windows drivers.

  • Supports 2nd generation Intel® Core™ i7 processors and 3rd generation Intel® Core™ i7 processors
  • Quad- or dual-core processor with Intel® Hyper-Threading Technology
  • 3U VPX (VITA 46) module
  • OpenVPX™ standards based
  • Ruggedized Enhanced Design Implementation (REDI) per VITA 48
  • Conduction or air cooling
  • Up to 8 GB of DDR3-1600 ECC SDRAM in two channels
  • 32 MB of NOR boot flash
  • Up to 16 GB of NAND flash
  • PMC/XMC interface with rear I/O and limited front-panel I/O support
  • Two Gen2 Fat Pipe P1 fabric interconnects
  • Two RS-232/422/485 serial ports
  • Two HDMI/DVI-D or Dual-Mode DisplayPort
  • Two XMC (P16) SATA 6.0 Gb/s ports for storage mezzanine
  • Two SATA 3.0 Gb/s ports and two USB 2.0 ports
  • Wind River VxWorks BSP
  • Linux BSP
  • Microsoft Windows drivers
  • Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs
XPedite7470 Block Diagram

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Processor

  • Quad- or dual-core Intel® Core™ i7
  • Intel® Turbo Boost Technology
  • Intel® Hyper-Threading Technology
  • AVX instruction set extensions
  • Integrated with Intel® QM67 chipset
  • Dual-channel integrated memory controller
  • Integrated high-performance 3D graphics controller

Dual-Core Processor Configurations

  • Core i7-2655LE: 2.2 GHz, 4 MB cache
  • Core i7-2610UE: 1.5 GHz, 4 MB cache
  • Core i7-3555LE: 2.5 GHz, 4 MB cache
  • Core i7-3517UE: 1.7 GHz, 4 MB cache

Quad-Core Processor Configurations

  • Core i7-3612QE: 2.1 GHz, 6 MB cache

Memory

  • Up to 8 GB of DDR3-1600 ECC SDRAM in two channels
  • 32 MB of NOR boot flash
  • Up to 16 GB of NAND flash

Graphics

  • Integrated high-performance 3D graphics controller
  • Two HDMI/DVI-D or Dual-Mode DisplayPort interfaces

VPX (VITA 46) P0 I/O

  • I²C port

VPX (VITA 46) P1 I/O

  • x4 PCI Express Fat Pipe interface to P1.A
  • x4 PCI Express Fat Pipe interface to P1.B
  • Two 1000BASE-BX Gigabit Ethernet ports (or one 10/100/1000BASE-T port to P1 and one port to P2)
  • XMC P16 I/O, mapping P1w9-X12d per VITA 46.9

VPX (VITA 46) P2 I/O

  • One 10/100/1000BASE-T Gigabit Ethernet port
  • Two SATA 3.0 Gb/s ports
  • Two USB 2.0 ports
  • Up to two RS-232/422/485 serial ports
  • 3.3 V GPIO signals
  • Two HDMI/DVI-D or Dual-Mode DisplayPort interfaces
  • Optional I/O can be replaced by a subset of P2w1-P64s I/O, Wafer 1-8 is NC

PMC/XMC Site

  • 32-bit, 33 MHz PCI bus (PMC interface)
  • x4 PCIe port (XMC interface)
  • Two SATA 6.0 Gb/s ports (XMC interface)

Security and Management

  • Optional Trusted Platform Module (TPM)
  • Non-volatile memory write protection

Software Support

  • Wind River VxWorks BSP
  • Linux BSP
  • Microsoft Windows drivers
  • Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs

Physical Characteristics

  • 3U VPX-REDI conduction- or air-cooled form factor
  • Dimensions: 100 mm x 160 mm
  • 0.8 in. pitch without solder-side cover
  • 0.85 and 1.0 in. pitch with solder-side cover

Environmental Requirements

  • Supported ruggedization levels (see the X-ES Ruggedization Chart): 1, 3, 5
  • Conformal coating available as an ordering option

Power Requirements

  • Power will vary based on configuration and usage. Please consult factory.