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Rugged Intel 3U VPX Core i7 SBC for the harshest military applications.

XPedite7570 4th Gen Intel Core i7 Haswell 3U VPX-REDI Single Board Computer SBC

XPedite7570

4th Generation Intel® Core™ i7 Haswell Processor-Based Conduction- or Air-Cooled 3U VPX-REDI Module

The XPedite7570 is a high-performance, 3U VPX-REDI, single board computer based on the 4th generation Intel® Core™ i7 Haswell processor. The XPedite7570 maximizes network performance with four Gigabit Ethernet interfaces, configured as two 1000BASE-BX/KX (SerDes) ports and two 10/100/1000BASE-T ports. An integrated PCI Express switch with Non-Transparent bridging support enables direct communication with other Intel® processors without the need for a separate switch module within the system, further reducing SWaP-C for the system integrator.

The XPedite7570 provides superior growth and expansion capabilities by including an XMC or PMC site with full 10 mm I/O envelope support while maintaining a 0.8 in. VPX slot pitch, providing the system integrator with a plethora of COTS options for additional I/O, storage, or processing while minimizing total system SWaP-C. Additionally, the XPedite7570 provides significant maintenance and diagnostics advantages by enabling the remote configuration and management capabilities of Intel® vPro™ with Intel® Active Management Technology (Intel® AMT) support.

The XPedite7570 accommodates up to 16 GB of DDR3L-1600 ECC SDRAM in two channels to support memory-intensive applications. The XPedite7570 also hosts numerous I/O ports, including PCI Express, Gigabit Ethernet, USB, SATA, graphics, and RS-232/422/485 through the backplane connectors. Wind River VxWorks and Linux Board Support Packages (BSPs) are available, as well as Microsoft Windows drivers.

  • Supports 4th generation Intel® Core™ i7 processors
  • 3U VPX (VITA 46) module
  • OpenVPX™ standards based
  • Ruggedized Enhanced Design Implementation (REDI) per VITA 48
  • Conduction or air cooling
  • Up to 16 GB of DDR3L-1600 ECC SDRAM in two channels
  • Up to 32 GB of NAND flash
  • PMC/XMC interface
  • Two PCI Express Fat Pipe P1 fabric interconnects
  • Four Gigabit Ethernet ports
  • Four SATA ports
  • Two HDMI/DVI-D or Dual-Mode DisplayPort interfaces
  • One XMC (P16) SATA port for storage mezzanine
  • Intel® vPro™/AMT support
  • Wind River VxWorks BSP
  • Linux BSP
  • Microsoft Windows drivers
  • Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs
XPedite7570 Block Diagram

Click on the image above to view a larger version.

Processor

  • 4th generation Intel® Core™ i7
  • Integrated high-performance 3D graphics controller

Memory

  • Up to 16 GB of DDR3L-1600 ECC SDRAM on two channels
  • Up to 32 GB of NAND flash
  • 64 MB NOR boot flash
  • 64 kB EEPROM

VPX (VITA 46) P0 I/O

  • I²C port

VPX (VITA 46) P1 I/O

  • x4 PCI Express Fat Pipe interface to P1.A
  • x4 PCI Express Fat Pipe interface to P1.B
  • Two 1000BASE-BX Gigabit Ethernet ports
  • XMC P16 I/O, mapping P1w9-X12d per VITA 46.9

VPX (VITA 46) P2 I/O

  • Two 10/100/1000BASE-T Gigabit Ethernet ports
  • Four SATA ports
  • Two USB 2.0 ports
  • Two HDMI/DVI-D or Dual-Mode DisplayPort interfaces
  • Up to two RS-232/422/485 serial ports
  • 3.3 V GPIO signals

PrPMC/XMC Site

  • 32-bit, 33/66 MHz PCI bus (PMC interface)
  • x8 PCI Express Gen3-capable port (XMC interface)
  • One SATA port (XMC interface)

Additional Features

  • Non-volatile memory write protection
  • Optional Trusted Platform Module (TPM)
  • IEEE 1588 support on three Gigabit Ethernet ports
  • Intel® Active Management Technology (AMT) supported by Intel® vPro™ Technology

Software Support

  • Wind River VxWorks BSP
  • Linux BSP
  • Microsoft Windows drivers
  • Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs

Physical Characteristics

  • 3U VPX-REDI conduction- or air-cooled form factor
  • Dimensions: 100 mm x 160 mm
  • 0.8 in. pitch without solder-side cover
  • 0.85 in. and 1.0 in. pitch with solder-side cover

Environmental Requirements

  • Supported ruggedization levels (see the X-ES Ruggedization Chart): 1, 3, 5
  • Conformal coating available as an ordering option
  • Thermal performance will vary based on CPU frequency and application

Power Requirements

  • Power will vary based on configuration and usage. Please consult factory.