XPedite7370

Intel® Core™ i7 Processor-Based Conduction- or Air-Cooled 3U VPX-REDI Single Board Computer (SBC)

The XPedite7370 accommodates up to 4 GB of DDR3-1066 ECC SDRAM in two channels to support memory-intensive applications. The XPedite7370 also hosts numerous I/O ports including Gigabit Ethernet, USB 2.0, SATA, graphics, and RS-232/422/485 through the backplane connectors.

End of Life

Please contact X-ES Sales for assistance with choosing a recommended replacement product.

Learn more about this product below »
REQUEST A QUOTE ASK A QUESTION

Contact us directly at +1 (608) 833-1155

SKU: 90030120 Category:
XPedite7370 3U VPX-REDI SBC

The XPedite7370 is a high-performance, low-power, 3U VPX-REDI, single board computer based on the Intel® Core™ i7 processor and Intel® QM57 chipset. With two PCI Express P1 interconnects and two Gigabit Ethernet ports, the XPedite7370 is ideal for the high-bandwidth and processing-intensive applications of today’s military and avionics applications.

The XPedite7370 accommodates up to 4 GB of DDR3-1066 ECC SDRAM in two channels to support memory-intensive applications. The XPedite7370 also hosts numerous I/O ports including Gigabit Ethernet, USB 2.0, SATA, graphics, and RS-232/422/485 through the backplane connectors.

The XPedite7370 can be used in either the system slot or peripheral slot of a VPX backplane. Operating system support for Wind River VxWorks, QNX Neutrino, and Linux Board Support Packages (BSPs) is available, as well as Microsoft Windows drivers.

Features

  • Intel® Core™ i7-610E, -620LE, -660UE, and -620UE processors
  • Dual-core with Hyper-Threading Technology
  • 3U VPX (VITA 46) module
  • OpenVPX standards-based
  • Ruggedized Enhanced Design Implementation (REDI) per VITA 48
  • Conduction or air cooling
  • Up to 4 GB of DDR3-1066 ECC SDRAM in two channels
  • 32 MB of NOR boot flash
  • Up to 16 GB of NAND flash
  • XMC/PrPMC interface with rear and front panel I/O support
  • Two PCI Express P1 fabric interconnects
  • Two 10/100/1000BASE-T or 1000BASE-BX Ethernet ports (optional)
  • Two rear panel USB 2.0 high-speed ports (optional)
  • Two rear panel SATA ports (optional)
  • Two rear panel RS-232/422/485 serial ports
  • Two rear panel DVI graphics ports
  • Wind River VxWorks BSP
  • Linux BSP
  • Microsoft Windows drivers
  • Contact factory for availability of GHS INTEGRITY BSP, QNX Neutrino BSP, and LynuxWorks LynxOS BSP

Technical Specs

Processor

  • Intel® Core™ i7 processor operating at 2.53, 2.0, 1.33, or 1.06 GHz
  • Dual-core with Hyper-Threading Technology
  • Intel® QM57 chipset
  • Dual-channel integrated memory controller
  • Integrated graphics controller
  • 4 MB of shared cache

Memory

  • Up to 4 GB of DDR3-1066 ECC SDRAM in two channels
  • 32 MB of NOR boot flash
  • Up to 16 GB of NAND flash

Graphics

  • Integrated high-performance 3D graphics controller
  • Dual DVI-D

XMC/PrPMC Site

  • 32-bit, 33 MHz PCI bus (PMC interface)
  • x8 PCIe port (XMC interface)
  • X12d P16 I/O support

VPX (VITA 46) P0 I/O

  • I²C port

VPX (VITA 46) P1 I/O

  • x4 PCI Express interface to P1.A
  • x4 PCI Express interface to P1.B
  • Two 1000BASE-BX Gigabit Ethernet ports (or one 10/100/1000BASE-T port to P1 and one port to P2)
  • X12d XMC P16 I/O

VPX (VITA 46) P2 I/O

  • One 10/100/1000BASE-T Ethernet port (optional)
  • Two SATA ports capable of 3 Gb/s (optional)
  • Two USB 2.0 ports (optional)
  • Up to two RS-232/422/485 serial ports
  • 3.3 V GPIO signals (optional)
  • Two DVI graphics ports (optional)
  • One audio port

Software Support

  • Wind River VxWorks BSP
  • Linux BSP
  • Microsoft Windows drivers
  • GHS INTEGRITY BSP (contact factory)
  • QNX Neutrino BSP (contact factory)
  • LynuxWorks LynxOS BSP (contact factory)

Physical Characteristics

  • 3U VPX-REDI conduction- or air-cooled form factor
  • Dimensions: 100 mm x 160 mm
  • 0.8 in. pitch without solder-side cover
  • 0.85 and 1.0 in. pitch with solder-side cover

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements.

  • Supported ruggedization levels (see the X-ES Ruggedization Chart): 1, 3, 5
  • Conformal coating available as an ordering option

Power Requirements

  • Power will vary based on configuration and usage. Please consult factory.

Accessories

Documentation

Datasheet

To view all of the information about this product in a PDF, please download the datasheet.

Download Datasheet

Technical Documents

SupportNet is your source for product manuals, technical support, and software downloads.

Access SupportNet

Block Diagram

Additional Information

Replacement Product

View the recommended replacement product, XPedite7570

View Product

Datasheet

View the XPedite7370
Datasheet PDF
 

Download Datasheet

3U VPX SBCs

View the full selection of 3U VPX SBCs from X-ES
 

View All
Back to Top
Fast, Flexible, and Customer-Focused Embedded Solutions
© 2018 Extreme Engineering Solutions, Inc