XPedite5470

NXP QorIQ Eight-Core P4080 Processor-Based Conduction- or Air-Cooled 3U VPX-REDI Module

The XPedite5470 is a high-performance 3U VPX-REDI single board computer supporting NXP (formerly Freescale) QorIQ P3 and P4 processors. With a number of processor options to choose from, X-ES can provide a product to meet the specific power and performance requirements of today's embedded computing applications.

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XPedite5470 3U VPX-REDI SBC

The XPedite5470 is a high-performance 3U VPX-REDI single board computer supporting NXP (formerly Freescale) QorIQ P3 and P4 processors. With a number of processor options to choose from, X-ES can provide a product to meet the specific power and performance requirements of today’s embedded computing applications.

The P4080 processor brings the raw power of eight e500mc cores running at up to 1.5 GHz and dual-channel DDR3 memory, delivering unparalleled multi-core performance. For applications that are more power-conscious, the P3041 processor offers four e500mc cores running at up to 1.5 GHz with a single channel of DDR3 memory, all within a significantly reduced power envelope. Additional reduced function-processors are available to meet any power and performance budget.

The XPedite5470 provides a ruggedized, high-performance, feature-rich solution to support the next generation of rugged embedded applications. Wind River VxWorks, Linux, and Green Hills INTEGRITY-178 tuMP Board Support Packages (BSPs) are available.

Features

  • NXP QorIQ P4080 processor with eight Power Architecture® e500mc cores at up to 1.5 GHz
  • Alternate NXP QorIQ processors: P3041, P4040
  • 3U VPX (VITA 46) module
  • Ruggedized Enhanced Design Implementation (REDI)
  • Conduction or air cooling
  • Up to 8 GB (4 GB each) of DDR3 ECC SDRAM in two channels
  • Up to 512 MB of NOR flash (with redundancy)
  • Up to 32 GB of NAND flash
  • Hardware write protection for NVRAM
  • XMC/PrPMC interface
  • x4 PCI Express or Serial RapidIO Fat Pipe P1.A fabric interconnect
  • x4 PCI Express or Serial RapidIO Fat Pipe P1.B fabric interconnect
  • Two SerDes Gigabit Ethernet Thin Pipe P1 fabric interconnects
  • Two 10/100/1000BASE-T Ethernet ports (optional)
  • Two SATA ports to P16 or P2 (optional)
  • Up to two RS-232/422/485 serial ports to P2
  • Two USB 2.0 ports to P2 (one optionally can be routed to front panel via plugover module)
  • Front I/O available via plugover module
  • Linux BSP
  • Wind River VxWorks BSP
  • Green Hills INTEGRITY-178 tuMP BSP

Technical Specs

Processor

  • NXP (formerly Freescale) QorIQ P4080 processor
  • Eight Power Architecture® e500mc cores at up to 1.5 GHz
  • 128 kB L2 cache per core
  • 1 MB L3 cache per channel
  • IEEE 754 Floating-Point Unit (FPU) support

Alternate Processor Configurations

  • P3041 processor with four Power Architecture® e500mc cores at up to 1.5 GHz
  • P4040 processor with four Power Architecture® e500mc cores at up to 1.5 GHz

Memory

  • Up to 8 GB (4 GB each) of DDR3 ECC SDRAM in two channels
  • Up to 512 MB of NOR flash (with redundancy)
  • Up to 32 GB of NAND flash

Front Panel I/O

  • Front panel RJ-45 Ethernet, micro-DB-9 RS-232 serial ports, and USB available via optional plugover module

VPX (VITA 46) P1 I/O

  • x4 PCI Express or Serial RapidIO Fat Pipe to P1.A
  • x4 PCI Express or Serial RapidIO Fat Pipe to P1.B
  • Two SerDes Gigabit Ethernet ports (or one 10/100/1000BASE-T port out P1 and one 10/100/1000BASE-T port out P2)
  • X12d XMC P16 I/O

VPX (VITA 46) P2 I/O

  • One 10/100/1000BASE-T port (when two SerDes Gigabit Ethernet P1 ports are not used)
  • Up to two RS-232/422/485 serial ports
  • Up to two USB 2.0 ports
  • I²C port
  • 3.3 V GPIO signals
  • P64s PMC P14 I/O (optional)
  • Two SATA ports capable of 3 Gb/s (optional)

XMC/PrPMC Site

  • 32-bit, 66 MHz PCI bus (PMC interface)
  • x4 PCIe port (XMC interface)
  • P64s P14 I/O support (optional)
  • X12d P16 I/O support
  • Two SATA ports capable of 3 Gb/s to P16 (optional)

Software Support

  • Linux BSP
  • Wind River VxWorks BSP
  • Green Hills INTEGRITY-178 tuMP BSP

Physical Characteristics

  • 3U VPX-REDI conduction- or air-cooled form factor
  • Dimensions: 100 mm x 160 mm
  • 0.8 in. pitch without solder-side cover
  • 0.85 and 1.0 in. pitch with solder-side cover

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements.

  • Supported ruggedization levels (see the X-ES Ruggedization Chart): 3, 5
  • Conformal coating available as an ordering option

Power Requirements

  • Power will vary based on configuration and usage. Please consult factory.

Accessories

  • XIt1070 (90060170) - 3U VPX Rear Transition Module with Gigabit Ethernet, SATA, USB, Serial, and DVI
  • XPand1004 (90071810) - Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O
  • XPand1200 (90070530) - 3U VPX Conduction-Cooled Development Platform
  • XPand1203 (90072665) - 3U VPX Development Platform for Up to Eight Conduction-Cooled Modules
  • XPand1300 (90070415) - 3U VPX Air-Cooled Development Platform
  • XPand1303 (90072850) - 3U VPX Development Platform for Up to Eight Air-Cooled Modules
  • XPort6105 (90010395) - XMC Secure 512 GB Solid-State Drive (SSD) with Self-Encrypting Drive (SED) Technology
  • XTend200 (90070050) - Debug Module with JTAG/Serial/Ethernet Cable

Documentation

Datasheet

To view all of the information about this product in a PDF, please download the datasheet.

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Technical Documents

SupportNet is your source for product manuals, technical support, and software downloads.

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Block Diagram

Additional Information

Product Brief

NXP P-Series SBCs Product Brief

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Datasheet

View the XPedite5470
Datasheet PDF

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