XPedite7683

Intel® Xeon® D-1500 Processor-Based 3U VPX Module with 32 GB of DDR4, XMC Support, and SecureCOTS™

The XPedite7683 is a secure, high-performance, 3U OpenVPX™, single board computer based on the Intel® Xeon® D-1500 family of processors.

Providing up to 16 Xeon®-class cores, up to 32 GB of DDR4-2133 ECC SDRAM, and XMC support, the XPedite7683 is an optimal choice for computationally heavy applications requiring maximum data and information protection.

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XPedite7683 3U VPX Single Board Computer (SBC)

The XPedite7683 is a secure, high-performance, 3U OpenVPX™, single board computer based on the Intel® Xeon® D-1500 family of processors. Providing up to 16 Xeon®-class cores, up to 32 GB of DDR4-2133 ECC SDRAM, and XMC support, the XPedite7683 is an optimal choice for computationally heavy applications requiring maximum data and information protection.

The XPedite7683 integrates SecureCOTS™ technology with a Microsemi SmartFusion®2 security SoC for hosting custom functions to protect data from being modified or observed, and provides an ideal solution when stringent security capabilities are required. The Microsemi SmartFusion®2 can control, intercept, and monitor the Xeon® D subsystem, implement penalties, and interface to the system through GPIO directly connected to the VPX backplane. Circuit board enhancements and optimized Two-Level Maintenance (2LM) metalwork provide additional protection to the physical hardware.

The XPedite7683 maximizes network performance with two 10 Gigabit Ethernet interfaces and two Gigabit Ethernet interfaces. It accommodates up to 32 GB of DDR4-2133 ECC SDRAM in two channels and up to 256 GB of onboard SATA NAND flash in addition to numerous I/O ports, including USB, SATA, and RS-232/422/485 through the backplane connectors. The XPedite7683 provides additional expansion capabilities with an integrated XMC site, which includes a x8 PCIe connection to the Intel® Xeon® D processor and X12d I/O mapped directly to the VPX backplane connectors.

Wind River VxWorks and X-ES Enterprise Linux Support Packages (XEL) are available. The XPedite7683 uses coreboot, powered by Intel®’s Firmware Support Package (FSP), to provide fast boot times and significantly simplify code traceability over legacy BIOS implementations.

Features

  • 3U VPX (VITA 46) module
  • Compatible with multiple VITA 65 OpenVPX™ slot profiles
  • Supports Intel® Xeon® D-1500 family processors (formerly Broadwell-DE)
  • Up to 16 Xeon®-class cores in a single, power-efficient SoC package
  • 4-, 8-, or 12-core SKUs available with native extended temperature support
  • Up to 32 GB of DDR4-2133 ECC SDRAM in two channels
  • XMC site with a x8 PCIe interface and rear I/O support
  • Ruggedized Enhanced Design Implementation (REDI) per VITA 48
  • Designed with SecureCOTS™ technology to support enhanced security and trusted computing
  • Microsemi SmartFusion®2 SoC with 1 GB DDR3-667 ECC SDRAM and 32 MB SPI flash
  • Up to 256 GB of NAND flash
  • Two x4 PCI Express backplane fabric interconnects
  • Two 10 Gigabit Ethernet ports and two Gigabit Ethernet ports
  • Four SATA ports and two USB 2.0 ports
  • One XMC (J16) SATA port for secure storage (XPort6105)
  • coreboot firmware powered by Intel® FSP
  • Wind River VxWorks BSP
  • X-ES Enterprise Linux (XEL) BSP
  • Contact factory for availability of Green Hills INTEGRITY, QNX Neutrino, and LynuxWorks LynxOS BSPs, as well as Microsoft Windows drivers

Technical Specs

Processor

  • Intel® Xeon® D-1500 family processors (formerly Broadwell-DE)
  • Up to 16 Xeon®-class cores in a single, power-efficient SoC package
  • 4-, 8-, or 12-core SKUs available with native extended temperature support

Memory

  • Up to 32 GB of DDR4-2133 ECC SDRAM in two channels
  • Up to 256 GB of SATA NAND flash
  • 32 MB NOR boot flash
  • 64 kB EEPROM

Security and Management

  • Microsemi SmartFusion®2 security FPGA with 1 GB DDR3-667 ECC SDRAM and 32 MB SPI flash
  • Designed with SecureCOTS™ technology to support enhanced security and trusted computing
  • Microsemi SmartFusion®2 zeroization
  • System voltage monitor, power-on/reset control, non-volatile write-protection control
  • Non-Deterministic Random Number Generator, Encryption
  • Environmental sensors (see product manual)
  • Trusted Platform Module (TPM) 1.2 or 2.0

VPX (VITA 46) P0 I/O

  • Two Microsemi SmartFusion®2 I²C ports

VPX (VITA 46) P1 I/O

  • x4 PCI Express Gen3-capable interface to P1.A
  • x4 PCI Express Gen3-capable interface to P1.B
  • Two 10GBASE-KR Ethernet ports
  • XMC P16 I/O, mapping P1w9-X12d per VITA 46.9

VPX (VITA 46) P2 I/O

  • Two 10/100/1000BASE-T Ethernet ports
  • Four SATA ports capable of 6 Gb/s
  • Two USB 2.0 ports
  • Up to six RS-232 or four RS-422/485 serial ports
  • GPIO from Microsemi SmartFusion®2
  • GPIO from processor

Software Support

XMC Site

  • x8 PCI Express Gen3-capable interface
  • One SATA port
  • Six Microsemi SmartFusion®2 GPIO

Physical Characteristics

  • 3U VPX-REDI conduction- or air-cooled form factor
  • Dimensions: 100 mm x 160 mm
  • 0.8 in. pitch without solder-side cover
  • 1.0 in. pitch with Two-Level Maintenance (2LM) support (optional)

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements.

  • Supported ruggedization levels (see the X-ES Ruggedization Chart): 3, 5
  • Conformal coating available as an ordering option
  • Thermal performance will vary based on CPU frequency and application

Power Requirements

  • Power will vary based on configuration and usage. Please consult factory.

Accessories

  • XIt1076 (90060330) - 3U VPX Rear Transition Module with Gigabit Ethernet, SATA, USB, Serial, and Mini DisplayPort
  • XIt1086 (90040055) - 3U VPX Rear Transition Module with PCIe, 10 Gigabit Ethernet, eSATA, USB, Serial, and Expandable XIM Sites
  • XPand1004 (90071810) - Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O
  • XPand1200 (90070530) - 3U VPX Development Platform for Up to Eight Conduction-Cooled Modules
  • XPand1203 (90072665) - 3U VPX Development Platform for Up to Eight Conduction-Cooled Modules
  • XPand1300 (90070415) - 3U VPX Development Platform for Up to Eight Air-Cooled Modules
  • XPand1303 (90072850) - 3U VPX Development Platform for Up to Eight Air-Cooled Modules
  • XTend218 (90072500) - Debug Module/Cable with Serial/I²C/USB/JTAG/SPI and Power Supply Programming

Documentation

Datasheet

To view all of the information about this product in a PDF, please download the datasheet.

Download Datasheet

Technical Documents

SupportNet is your source for product manuals, technical support, and software downloads.

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Block Diagram

Additional Information

Press Release

View the XPedite7683
Press Release

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Webinar

Intel® Xeon® D in High Performance Computing

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Technologies

coreboot bootloader &
the Intel® FSP

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Board Support

X-ES Enterprise Linux (XEL) Board Support Package

View BSP

Onboard Security

Integrated SecureCOTS™ technology

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Product Family

View an Intel® Xeon® D 3U VPX SBCs Family Comparison

View Comparison

Datasheet

View the XPedite7683
Datasheet PDF

Download Datasheet

3U VPX SBCs

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