The XPedite7672 is a secure, high-performance, 3U VPX-REDI, single board computer based on the Intel® Xeon® D-1500 family processors. The Intel® Xeon® D processor can provide up to 16 Xeon®-class cores in a single, power-efficient System-on-Chip (SoC) package. The XPedite7672 is an optimal choice for computationally heavy applications requiring maximum data and information protection.
The XPedite7672 integrates SecureCOTS™ technology with a SmartFusion®2 security SoC for hosting custom functions to protect data from being modified or observed and provides an ideal solution when stringent security capabilities are required. The SmartFusion®2 can control, intercept, and monitor the Xeon® D subsystem, implement penalties, and interface to the system through single-ended and differential I/O directly connected to the VPX backplane. Circuit board enhancements and optimized Two-Level Maintenance (2LM) metalwork provide additional protection to the physical hardware.
The XPedite7672 maximizes network performance with two 10 Gigabit 10GBASE-KR Ethernet interfaces and two 10/100/1000BASE-T Gigabit Ethernet interfaces. It accommodates up to 16 GB of DDR4-2133 ECC SDRAM in two channels and up to 32 GB of onboard SATA NAND flash in addition to numerous I/O ports, including USB, SATA, and RS-232/422/485 through the backplane connectors. The XPedite7672 provides additional expansion capabilities by including an integrated XMC. This XMC site includes a x8 PCIe connection to the Intel® Xeon® D processor and X12d I/O mapped directly to the VPX backplane connectors.
Wind River VxWorks and X-ES Enterprise Linux Support Packages (XEL) are available. The XPedite7672 uses coreboot, powered by Intel®’s Firmware Support Package (FSP), to provide fast boot times and significantly simplify code traceability over legacy BIOS implementations.
Technical Specs
Processor
- Intel® Xeon® D-1500 family processors (formerly Broadwell-DE)
- Up to 16 Xeon®-class cores in a single, power-efficient SoC package
- 4, 8, or 12 core SKUs available with native extended temperature support
Memory
- Up to 16 GB of DDR4-2133 ECC SDRAM in two channels
- Up to 32 GB of SLC NAND flash
- 32 MB NOR boot flash
- 64 kB EEPROM
Security and Management
- Microsemi SmartFusion®2 security FPGA with 1 GB DDR3-667 ECC SDRAM and 32 MB SPI flash
- Designed with SecureCOTS™ technology to support enhanced security and trusted computing
- SmartFusion®2 zeroization
- System voltage monitor, power-on/reset control, non-volatile write-protection control
- Non-Deterministic Random Number Generator, Encryption
- Environmental sensors (see product manual)
- Trusted Platform Module (TPM) 1.2 or 2.0
VPX (VITA 46) P0 I/O
- Two SmartFusion®2 I²C ports
VPX (VITA 46) P1 I/O
- x4 PCI Express Gen3-capable interface to P1.A
- x4 PCI Express Gen3-capable interface to P1.B
- Two 10GBASE-KR Ethernet ports
- XMC P16 I/O, mapping P1w9-X12d per VITA 46.9
VPX (VITA 46) P2 I/O
- Two 10/100/1000BASE-T Gigabit Ethernet ports
- Four SATA ports capable of 6 Gb/s
- Two USB 2.0 ports
- Up to six RS-232 or four RS-422/485 serial ports
- Single-ended and differential GPIO from SmartFusion®2
Software Support
XMC Site
- x8 PCI Express Gen3-capable port
- One SATA port
- Six SmartFusion®2 GPIO
Physical Characteristics
- 3U VPX-REDI conduction- or air-cooled form factor
- Dimensions: 100 mm x 160 mm
- 0.8 in. pitch without solder-side cover
- 1.0 in. pitch with Two-Level Maintenance (2LM) support (optional)
Environmental Requirements
Contact factory for appropriate board configuration based on environmental requirements.
- Supported ruggedization levels (see the X-ES Ruggedization Chart): 1, 3, 5
- Conformal coating available as an ordering option
- Thermal performance will vary based on CPU frequency and application
Power Requirements
- Power will vary based on configuration and usage. Please consult factory.
Documentation
Datasheet
To view all of the information about this product in a PDF, please download the datasheet.
Download Datasheet
Technical Documents
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